EP3C55F484I7 Equivalent & Substitute Parts

Part Overview

The EP3C55F484I7 is a Cyclone® III Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high logic density and I/O capability. This device features 55,856 logic elements, 2,396,160 RAM bits, and 327 I/O pins in a 484-BGA package. The part is currently in active production status. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate packaging or compliance requirements specific to procurement specifications.

Substiute Parts

EP3C55F484I7

IntelIn Stock: 1381EP3C55F484I7 Datasheet

Current PartRFQ

EP3C55F484I7N

IntelIn Stock: 6320EP3C55F484I7N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EP3C55F484I7 is determined by strict equivalence across the following critical parameters:

• Logic Architecture: Identical Cyclone® III series architecture with 55,856 logic elements and 3,491 LABs/CLBs
• Memory Configuration: 2,396,160 total RAM bits
• I/O Count: 327 I/O pins
• Package Geometry: 484-BGA (23x23 mm) form factor
• Electrical Specifications: 1.15V ~ 1.25V supply voltage and -40°C ~ 100°C operating temperature range
• Mounting Technology: Surface mount BGA configuration

The substitute part EP3C55F484I7N differs only in packaging format (Tray vs. standard packaging) and RoHS compliance status, while maintaining identical electrical and functional characteristics.

Parameter Comparison

Engineering Selection Recommendations

The EP3C55F484I7N serves as a direct functional equivalent to the EP3C55F484I7, with identical core specifications across logic elements, memory, I/O configuration, and thermal operating range. Selection between these parts should be based on:

RoHS Compliance Requirements: The EP3C55F484I7N is RoHS Compliant, making it the appropriate choice for applications subject to RoHS directives or customer specifications requiring RoHS-compliant components.

Packaging and Handling: The EP3C55F484I7N is supplied in Tray packaging, which may influence procurement workflows, storage requirements, and assembly line integration compared to standard packaging formats.

Supply Chain Continuity: Both parts maintain Active product status with substantial inventory availability (1,305 units and 6,238 units respectively), supporting long-term design continuity.

Both parts carry identical ECCN (3A991D) and HTSUS (8542.39.0001) classifications and share MSL 3 (168 Hours) moisture sensitivity ratings.

Frequently Asked Questions (FAQ)

Q: Can EP3C55F484I7N be used as a direct replacement for EP3C55F484I7 in existing designs?

A: Yes. The EP3C55F484I7N is functionally equivalent across all electrical and logical parameters. The only differences are packaging format (Tray) and RoHS compliance status. No design modifications are required for pin configuration, voltage requirements, or thermal specifications.

Q: What is the significance of the RoHS compliance difference?

A: RoHS Compliance status indicates adherence to the Restriction of Hazardous Substances directive. The EP3C55F484I7N meets RoHS requirements, while the EP3C55F484I7 does not. Selection depends on regulatory requirements applicable to the end application and market region.

Q: Are there any thermal or electrical performance differences between these parts?

A: No. Both parts operate within identical voltage ranges (1.15V ~ 1.25V) and temperature ranges (-40°C ~ 100°C TJ). Thermal and electrical performance characteristics are equivalent.

Q: Does packaging format affect PCB assembly or design considerations?

A: Packaging format (Tray vs. standard) affects component handling, storage, and assembly line automation but does not impact PCB design, footprint, or electrical performance. The 484-FBGA (23x23) physical dimensions and pinout remain identical.

Q: Are both parts suitable for long-term production use?

A: Yes. Both parts maintain Active product status with substantial inventory levels, supporting sustained production requirements and design continuity.