EP3C40F324I7 Equivalent & Substitute Parts

Part Overview

The EP3C40F324I7 is a Cyclone® III Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high-density logic integration. This device features 39,600 logic elements, 1,161,216 total RAM bits, and 195 I/O pins in a 324-BGA package. The part is currently in active production status. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate different packaging or compliance requirements across manufacturing environments.

Substiute Parts

EP3C40F324I7

IntelIn Stock: 75221EP3C40F324I7 Datasheet

Current PartRFQ

EP3C40F324I7N

IntelIn Stock: 2373EP3C40F324I7N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP3C40F324I7 is determined by strict equivalence across the following critical parameters:

• Logic Architecture: Identical number of logic elements (39,600) and LABs/CLBs (2,475)
• Memory Configuration: Identical total RAM bits (1,161,216)
• I/O Count: Identical number of I/O pins (195)
• Electrical Specifications: Identical supply voltage range (1.15V ~ 1.25V)
• Package Geometry: Identical 324-BGA package and 324-FBGA (19x19) footprint
• Thermal Range: Identical operating temperature range (-40°C ~ 100°C TJ)
• Mounting Technology: Identical surface mount configuration

The substitute part EP3C40F324I7N meets all these criteria and differs only in packaging format (Tray versus unspecified) and compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

Both EP3C40F324I7 and EP3C40F324I7N are functionally equivalent Cyclone® III FPGA devices with identical logic, memory, I/O, and thermal specifications. Selection between these parts should be based on compliance requirements:

• EP3C40F324I7: Select when RoHS non-compliant designs are acceptable or when legacy system requirements mandate this specific part number.
• EP3C40F324I7N: Select for applications requiring RoHS compliance. This variant maintains full functional equivalence while meeting environmental and regulatory standards.

Both parts maintain REACH Unaffected status and identical moisture sensitivity levels, ensuring equivalent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Are EP3C40F324I7 and EP3C40F324I7N pin-compatible?

A: Yes. Both devices use the 324-FBGA (19x19) package with identical pinout, supply voltage, and I/O specifications. PCB footprints are interchangeable.

Q: What is the primary difference between these two part numbers?

A: The primary difference is RoHS compliance status. EP3C40F324I7N is RoHS Compliant, while EP3C40F324I7 is RoHS non-compliant. All functional and electrical parameters are identical.

Q: Can I substitute EP3C40F324I7N for EP3C40F324I7 in existing designs?

A: Yes, provided your application does not have explicit requirements for the non-compliant variant. The RoHS-compliant version is a direct functional substitute.

Q: Are there any differences in logic capacity or memory between these parts?

A: No. Both parts contain 39,600 logic elements, 2,475 LABs/CLBs, and 1,161,216 RAM bits. Logic capacity and memory configuration are identical.

Q: Do these parts have different operating temperature ranges?

A: No. Both parts operate across the identical temperature range of -40°C to 100°C (junction temperature).

Q: What packaging formats are available for these part numbers?

A: EP3C40F324I7 is available in standard packaging, while EP3C40F324I7N is available in Tray packaging. Both use the 324-FBGA (19x19) physical package.

Q: Are moisture sensitivity requirements the same for both parts?

A: Yes. Both parts have MSL 3 rating with a 168-hour floor life, requiring identical handling and storage protocols.