EP3C16F484C8 Equivalent & Substitute Parts

Part Overview

The EP3C16F484C8 is a Cyclone® III Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring 346 I/O pins and 15,408 logic elements. This device is classified as Active product status and is available in 484-BGA surface mount packaging. Alternative part numbers are necessary to address packaging variations, compliance requirements, and inventory availability across different supply channels.

Substiute Parts

EP3C16F484C8

IntelIn Stock: 1523EP3C16F484C8 Datasheet

Current PartRFQ

EP3C16F484C8N

IntelIn Stock: 25269EP3C16F484C8N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution between EP3C16F484C8 and EP3C16F484C8N is determined by the following criteria:

• Base Product Number: Both parts share the identical base product number EP3C16, confirming functional equivalence
• Logic Architecture: Identical logic element count (15,408), LAB/CLB count (963), and RAM capacity (516,096 bits)
• I/O Configuration: Both provide 346 I/O pins
• Electrical Specifications: Matching voltage supply range (1.15V ~ 1.25V) and operating temperature range (0°C ~ 85°C)
• Package Specification: Both use 484-BGA (23x23) surface mount packaging
• Packaging Format: The primary difference is the distribution packaging (Tube vs. Tray), which does not affect electrical or mechanical compatibility

Parameter Comparison

Engineering Selection Recommendations

Both EP3C16F484C8 and EP3C16F484C8N are functionally equivalent and electrically interchangeable for circuit design purposes. Selection between these parts should be based on:

• Compliance Requirements: EP3C16F484C8N is RoHS Compliant, while EP3C16F484C8 is RoHS non-compliant. Applications subject to RoHS regulations must use EP3C16F484C8N
• Supply Chain Considerations: EP3C16F484C8N has significantly higher inventory availability (25,200 pcs vs. 1,417 pcs), making it the preferred choice for volume production
• Packaging Format: EP3C16F484C8 is supplied in Tube packaging, while EP3C16F484C8N is supplied in Tray packaging. Packaging selection depends on assembly line automation and handling requirements
• Product Status: Both parts maintain Active status, ensuring continued manufacturer support and availability

Frequently Asked Questions (FAQ)

Q: Are EP3C16F484C8 and EP3C16F484C8N pin-compatible?

A: Yes. Both parts use identical 484-BGA (23x23) packaging with 346 I/O pins in the same physical configuration. No PCB redesign is required for substitution.

Q: What is the difference between Tube and Tray packaging?

A: Tube packaging is used for manual handling and smaller quantities, while Tray packaging is optimized for automated assembly line processing. The electrical and mechanical specifications of the device remain unchanged.

Q: Can I substitute EP3C16F484C8 with EP3C16F484C8N in a design already in production?

A: Yes, provided your application does not have specific constraints tied to the original part number. Both parts are functionally equivalent. If RoHS compliance is required, EP3C16F484C8N is the appropriate choice.

Q: What does RoHS Compliant status mean for EP3C16F484C8N?

A: RoHS Compliant indicates that EP3C16F484C8N meets the Restriction of Hazardous Substances directive, restricting the use of specific hazardous materials. This is required for applications in regulated markets, particularly in Europe and certain consumer electronics applications.

Q: Are the electrical specifications identical between these two parts?

A: Yes. Both parts operate at 1.15V ~ 1.25V supply voltage, support the same 0°C ~ 85°C operating temperature range, and provide identical logic element count, I/O configuration, and RAM capacity.

Q: What is the MSL rating and why does it matter?

A: Both parts have MSL 3 (168 Hours) rating, indicating moisture sensitivity level. This specifies the maximum time the device can be exposed to ambient conditions (30°C, 85% RH) before soldering. Proper storage and handling procedures must be followed to prevent moisture absorption.