EP2C50F484I8 Equivalent & Substitute Parts

Part Overview

The EP2C50F484I8 is a Cyclone® II Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high-density logic integration. This device features 50,528 logic elements, 594,432 total RAM bits, and 294 I/O pins in a 484-BGA package. The part is currently in active production status. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and optimize procurement across manufacturing batches and packaging variants.

Substiute Parts

EP2C50F484I8

IntelIn Stock: 1869EP2C50F484I8 Datasheet

Current PartRFQ

EP2C50F484I8N

IntelIn Stock: 3659EP2C50F484I8N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the EP2C50F484I8 is determined by strict equivalence across the following critical parameters:

• Base product architecture (Cyclone® II series)
• Logic element count (50,528 elements)
• RAM capacity (594,432 bits)
• I/O pin count (294 pins)
• Package type (484-BGA, 23x23mm)
• Supply voltage range (1.15V ~ 1.25V)
• Operating temperature range (-40°C ~ 100°C)
• Mounting configuration (Surface Mount)

Parts meeting all these criteria are classified as direct functional equivalents. Variations in packaging designation, RoHS compliance status, or moisture sensitivity level do not affect electrical or mechanical compatibility when all core parameters remain identical.

Parameter Comparison

Engineering Selection Recommendations

The EP2C50F484I8N is a direct functional equivalent to the EP2C50F484I8. Both parts share identical electrical specifications, logic capacity, memory configuration, I/O architecture, and thermal operating range. The primary distinction is RoHS compliance status: the EP2C50F484I8N meets RoHS requirements, while the EP2C50F484I8 does not.

Selection between these parts should be based on regulatory and procurement requirements. If RoHS compliance is mandated by design specifications, supply chain policy, or end-market regulations, the EP2C50F484I8N is the appropriate choice. If RoHS compliance is not a constraint, either part satisfies identical functional requirements. Both parts maintain active production status and equivalent moisture sensitivity handling requirements.

Frequently Asked Questions (FAQ)

Q: Can EP2C50F484I8N replace EP2C50F484I8 in existing designs?

A: Yes. Both parts are electrically and mechanically identical. The EP2C50F484I8N can be substituted directly without design modifications, PCB layout changes, or firmware updates.

Q: What is the difference between EP2C50F484I8 and EP2C50F484I8N?

A: The parts are functionally equivalent. The primary difference is RoHS compliance: EP2C50F484I8N is RoHS Compliant, while EP2C50F484I8 is RoHS non-compliant. All electrical, thermal, and mechanical specifications are identical.

Q: Are there any package or pinout differences?

A: No. Both parts use the identical 484-FBGA (23x23mm) package with 294 I/O pins. Pinout, ball assignments, and mechanical dimensions are identical.

Q: Does RoHS compliance affect performance or reliability?

A: No. RoHS compliance status reflects material composition and manufacturing process compliance with environmental regulations. It does not alter electrical performance, thermal characteristics, or functional capability.

Q: What is the moisture sensitivity level, and how does it affect handling?

A: Both parts have MSL 3 (168 Hours). This indicates the component can be exposed to ambient conditions (30°C, 85% relative humidity) for up to 168 hours before soldering without baking. Standard moisture control procedures during storage and assembly apply.

Q: Can I use these parts interchangeably in production?

A: Yes, provided your supply chain and regulatory requirements permit. If RoHS compliance is required, use EP2C50F484I8N. If not required, either part meets functional specifications.