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EP2C35F672C8 Equivalent & Substitute Parts
Part Overview
The EP2C35F672C8 is a Cyclone® II Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring high-density logic integration. This device features 33,216 logic elements, 483,840 total RAM bits, and 475 I/O pins in a 672-BGA package. The part is currently in active production status. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate packaging or compliance requirements specific to your application.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EP2C35F672C8 |
| Manufacturer | Intel |
| Series | Cyclone® II |
| Number of Logic Elements | 33,216 |
| Total RAM Bits | 483,840 |
| Number of I/O | 475 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Package / Case | 672-BGA |
| Supplier Device Package | 672-FBGA (27x27) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Product Status | Active |
| RoHS Status | RoHS non-compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution for the EP2C35F672C8 is determined by strict equivalence across the following critical parameters:
- Logic Architecture: Identical number of logic elements (33,216) and LABs/CLBs (2,076)
- Memory Configuration: Identical total RAM bits (483,840)
- I/O Count: Identical number of I/O pins (475)
- Electrical Specifications: Identical supply voltage range (1.15V ~ 1.25V)
- Package Geometry: Identical 672-BGA package and 672-FBGA (27x27) footprint
- Thermal Characteristics: Identical operating temperature range (0°C ~ 85°C)
- Series Compatibility: Same Cyclone® II product family
The primary distinction between the main part and its substitute relates to packaging format (tape and reel versus bulk tray) and RoHS compliance status. These differences do not affect electrical or functional performance but may impact procurement, storage, and regulatory requirements.
Parameter Comparison
| Parameter | EP2C35F672C8 | EP2C35F672C8N | Compatibility |
|---|---|---|---|
| Manufacturer | Intel | Intel | Identical |
| Series | Cyclone® II | Cyclone® II | Identical |
| Logic Elements | 33,216 | 33,216 | Identical |
| Total RAM Bits | 483,840 | 483,840 | Identical |
| I/O Count | 475 | 475 | Identical |
| Supply Voltage | 1.15V ~ 1.25V | 1.15V ~ 1.25V | Identical |
| Package / Case | 672-BGA | 672-BGA | Identical |
| Supplier Device Package | 672-FBGA (27x27) | 672-FBGA (27x27) | Identical |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Product Status | Active | Active | Identical |
| Packaging Format | Bulk | Tray | Different |
| RoHS Status | RoHS non-compliant | RoHS Compliant | Different |
| MSL Rating | 3 (168 Hours) | 3 (168 Hours) | Identical |
Engineering Selection Recommendations
EP2C35F672C8N is the direct functional equivalent of EP2C35F672C8. Selection between these parts should be based on the following criteria:
- RoHS Compliance Requirement: If your application or end-market requires RoHS compliance, EP2C35F672C8N is the appropriate choice. If RoHS compliance is not a requirement, either part is functionally equivalent.
- Packaging and Handling: EP2C35F672C8N is supplied in tray packaging, which may be preferred for automated assembly processes. EP2C35F672C8 is supplied in bulk format.
- Supply Chain Availability: EP2C35F672C8N has higher documented inventory (19,507 pcs) compared to EP2C35F672C8 (1,770 pcs), making it more readily available for procurement.
- Electrical and Functional Performance: Both parts are electrically and functionally identical. No performance differences exist between the two variants.
Both parts maintain active product status and identical thermal, electrical, and mechanical specifications. The choice between them is driven by compliance, packaging, and availability requirements rather than technical performance.
Frequently Asked Questions (FAQ)
Q: Can EP2C35F672C8N be used as a direct replacement for EP2C35F672C8 in existing designs?
A: Yes. EP2C35F672C8N is a direct functional equivalent. All electrical specifications, logic capacity, memory configuration, I/O count, package geometry, and thermal characteristics are identical. The only differences are packaging format and RoHS compliance status, which do not affect circuit-level compatibility or performance.
Q: What is the difference between the packaging formats?
A: EP2C35F672C8 is supplied in bulk packaging, while EP2C35F672C8N is supplied in tray packaging. Tray packaging is typically used for automated pick-and-place assembly, whereas bulk packaging is used for manual handling or alternative assembly methods. Both formats contain the same device with identical electrical properties.
Q: Does RoHS compliance affect the device's electrical performance?
A: No. RoHS compliance relates to material composition and environmental regulations, not electrical performance. Both EP2C35F672C8 and EP2C35F672C8N deliver identical electrical and functional performance. RoHS compliance is a regulatory and procurement consideration.
Q: Are there any thermal or operating condition differences between these parts?
A: No. Both parts operate across the identical temperature range (0°C ~ 85°C junction temperature) and require the same supply voltage (1.15V ~ 1.25V). Thermal and operating characteristics are fully equivalent.
Q: What is the MSL rating, and does it differ between the two parts?
A: Both parts have an MSL rating of 3 with a 168-hour floor life. This rating indicates moisture sensitivity and storage requirements. No difference exists between the two variants in this specification.
Q: Can I mix EP2C35F672C8 and EP2C35F672C8N in the same production batch?
A: Yes, from a functional and electrical standpoint. However, if your design or manufacturing process specifies one variant, consistency in procurement and documentation is recommended for traceability and compliance purposes.
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