EP2C20F256I8 Equivalent & Substitute Parts

Part Overview

The EP2C20F256I8 is a Cyclone® II Field Programmable Gate Array (FPGA) manufactured by Intel, designed for embedded applications requiring 152 I/O pins and 18,752 logic elements. This device is classified as Active product status and operates within a supply voltage range of 1.15V to 1.25V. The part is available in a 256-LBGA package (17x17mm) suitable for surface mount applications across industrial and commercial temperature ranges (-40°C to 100°C). Identifying equivalent substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and accommodate different packaging or compliance requirements while maintaining functional and electrical compatibility.

Substiute Parts

EP2C20F256I8

IntelIn Stock: 1209EP2C20F256I8 Datasheet

Current PartRFQ

EP2C20F256I8N

IntelIn Stock: 4972EP2C20F256I8N Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the EP2C20F256I8 are identified based on strict electrical and mechanical parameter matching. The primary substitution criteria are:

• Identical manufacturer (Intel)
• Identical series (Cyclone® II)
• Identical logic element count (18,752)
• Identical I/O pin count (152)
• Identical RAM capacity (239,616 bits)
• Identical supply voltage range (1.15V ~ 1.25V)
• Identical operating temperature range (-40°C ~ 100°C)
• Identical package type (256-LBGA)
• Identical mounting type (Surface Mount)

Variations in packaging format (such as Tray versus standard packaging) and RoHS compliance status do not affect functional or electrical compatibility and are therefore permissible in substitute relationships.

Parameter Comparison

Engineering Selection Recommendations

Both EP2C20F256I8 and EP2C20F256I8N are Active product status devices with identical functional and electrical specifications. The primary distinction is RoHS compliance status: EP2C20F256I8N meets RoHS requirements, while EP2C20F256I8 does not. Selection between these parts should be based on regulatory requirements applicable to the end application. For applications requiring RoHS compliance, EP2C20F256I8N is the appropriate selection. Both parts maintain identical REACH Unaffected status and Moisture Sensitivity Level (MSL 3, 168 Hours), ensuring equivalent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can EP2C20F256I8N be used as a direct replacement for EP2C20F256I8?

A: Yes. Both parts are functionally and electrically identical, with matching logic element counts, I/O pin configurations, RAM capacity, supply voltage, operating temperature range, and package specifications. The difference is RoHS compliance status only.

Q: What is the significance of the packaging difference (Tray versus standard)?

A: Packaging format refers to the delivery and storage method and does not affect the electrical or mechanical properties of the component itself. Both packaging formats are compatible for PCB assembly applications.

Q: Are there any differences in moisture sensitivity or handling requirements?

A: No. Both parts carry identical Moisture Sensitivity Level (MSL 3, 168 Hours) ratings, requiring the same handling, storage, and reflow procedures.

Q: Which part should be selected for RoHS-compliant applications?

A: EP2C20F256I8N is RoHS Compliant and should be selected for applications subject to RoHS regulations. EP2C20F256I8 is RoHS non-compliant and is suitable only for applications without RoHS requirements.

Q: Are the pin configurations identical between these parts?

A: Yes. Both parts feature 152 I/O pins in a 256-LBGA (17x17mm) package with identical pinout and signal assignments.