EP2C15AF484C6NES Equivalent & Substitute Parts

Part Overview

The EP2C15AF484C6NES is an Intel Cyclone® II Field Programmable Gate Array (FPGA) designed for embedded applications. This device features 315 I/O pins, 14448 logic elements, and 239616 bits of embedded RAM in a 484-BGA package. The part is currently active in production and RoHS compliant. Substitute parts are identified to address inventory availability, lead time requirements, or specific application constraints while maintaining electrical and mechanical compatibility.

Substiute Parts

EP2C15AF484C6NES

IntelIn Stock: 967EP2C15AF484C6NES Datasheet

Current PartRFQ

EP2C15AF484C8N

IntelIn Stock: 7781EP2C15AF484C8N Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EP2C15AF484C6NES is based on strict equivalence of the following critical parameters:

• Logic Element Count: 14448 elements (determines functional capacity)
• RAM Configuration: 239616 bits (embedded memory specification)
• I/O Pin Count: 315 pins (interface capability)
• Package Type: 484-BGA with 23x23mm footprint (physical and electrical compatibility)
• Supply Voltage Range: 1.15V ~ 1.25V (power delivery requirements)
• Operating Temperature Range: 0°C ~ 85°C (thermal specification)
• Series Family: Cyclone® II (architectural compatibility)

The substitute part EP2C15AF484C8N maintains identical electrical specifications and package configuration, differing only in the speed grade designation (C8 versus C6), which represents timing performance characteristics. Both parts are manufactured by Intel, carry active product status, and meet RoHS compliance requirements.

Parameter Comparison

Engineering Selection Recommendations

Both the EP2C15AF484C6NES and EP2C15AF484C8N are active production devices from Intel with identical RoHS compliance and REACH status. Selection between these parts is determined by application timing requirements and inventory availability. The EP2C15AF484C8N offers higher inventory levels (7718 units versus 890 units), which may reduce lead time in procurement scenarios. Both devices meet the same electrical, thermal, and mechanical specifications for embedded FPGA applications requiring 315 I/O pins and 14448 logic elements in a 484-BGA package.

Frequently Asked Questions (FAQ)

Q: Can EP2C15AF484C8N replace EP2C15AF484C6NES in existing designs?

A: Yes. Both parts share identical logic element count, RAM configuration, I/O pin count, package footprint, supply voltage range, and operating temperature specifications. The difference in speed grade (C8 versus C6) affects timing performance only.

Q: What does the speed grade designation mean?

A: The speed grade (C6 or C8) indicates the maximum propagation delay through the device logic. This affects the maximum clock frequency the device can support. Selection depends on the timing requirements of your specific application.

Q: Are the package dimensions identical?

A: Yes. Both parts use the 484-FBGA package with 23x23mm dimensions and identical pin configuration, ensuring PCB layout compatibility.

Q: Do both parts have the same moisture sensitivity requirements?

A: Yes. Both devices carry MSL 3 (168 Hours) rating, requiring identical handling and storage protocols.

Q: What is the difference in inventory availability?

A: EP2C15AF484C8N has 7718 units in stock compared to 890 units for EP2C15AF484C6NES, potentially affecting procurement lead times.