EP20K600EFC672-1X Equivalent & Substitute Parts

Part Overview

The EP20K600EFC672-1X is an APEX-20KE® Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 508 I/O pins in a 672-BBGA package. This device is classified as obsolete, making substitute components necessary for new designs and ongoing production support. The part delivers 24,320 logic elements and 311,296 RAM bits for embedded applications requiring high-density programmable logic.

Substiute Parts

EP20K600EFC672-1X
IntelIn Stock: 1353EP20K600EFC672-1X Datasheet
EP20K600EFC672-1X
Current Part
LFE2-50E-5FN672C
Lattice Semiconductor CorporationIn Stock: 711LFE2-50E-5FN672C Datasheet
LFE2-50E-5FN672C
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number EP20K600EFC672-1X
Manufacturer Intel
Series APEX-20KE®
Product Status Obsolete
Number of Logic Elements 24,320
Total RAM Bits 311,296
Number of I/O 508
Number of Gates 1,537,000
Voltage Supply Range 1.71V ~ 1.89V
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 672-BBGA
Mounting Type Surface Mount
Moisture Sensitivity Level 3 (168 Hours)
RoHS Status RoHS non-compliant

Substitute Part Grouping Explanation

Substitution of the EP20K600EFC672-1X is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 672-BBGA (27x27) package to ensure PCB footprint compatibility and pin assignment alignment.

I/O Pin Count: The substitute must provide a minimum of 500 I/O pins to accommodate designs originally specified for 508 I/O. The LFE2-50E-5FN672C provides 500 I/O pins, meeting this requirement.

Logic Density: The substitute must deliver sufficient logic elements and RAM capacity. The LFE2-50E-5FN672C provides 48,000 logic elements and 396,288 RAM bits, exceeding the original part's specifications.

Operating Temperature Range: Both parts operate across 0°C ~ 85°C (TJ), ensuring thermal compatibility.

Mounting Type: Both parts use surface mount technology, maintaining assembly process compatibility.

Supply Voltage: The substitute operates at 1.14V ~ 1.26V, which differs from the original 1.71V ~ 1.89V. This represents a distinct electrical characteristic that must be evaluated during design migration.

Parameter Comparison

Parameter EP20K600EFC672-1X LFE2-50E-5FN672C
Manufacturer Intel Lattice Semiconductor Corporation
Series APEX-20KE® ECP2
Product Status Obsolete Active
Number of Logic Elements 24,320 48,000
Total RAM Bits 311,296 396,288
Number of I/O 508 500
Voltage Supply Range 1.71V ~ 1.89V 1.14V ~ 1.26V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package / Case 672-BBGA 672-BBGA
Mounting Type Surface Mount Surface Mount
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
RoHS Status RoHS non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The LFE2-50E-5FN672C from Lattice Semiconductor Corporation is the qualified substitute for the obsolete EP20K600EFC672-1X. Selection of this substitute is supported by the following factors:

Product Status: The LFE2-50E-5FN672C maintains active production status, ensuring long-term availability and supply chain stability compared to the obsolete EP20K600EFC672-1X.

Regulatory Compliance: The LFE2-50E-5FN672C is ROHS3 compliant, whereas the original part is RoHS non-compliant. This compliance advantage supports modern manufacturing and environmental standards.

Package Compatibility: Both parts use identical 672-BBGA packaging, eliminating PCB redesign requirements.

Thermal Compatibility: Matching operating temperature ranges (0°C ~ 85°C) ensure thermal performance equivalence.

Logic and Memory Capacity: The substitute provides increased logic elements (48,000 vs. 24,320) and RAM bits (396,288 vs. 311,296), offering design headroom for future enhancements.

I/O Pin Consideration: The substitute provides 500 I/O pins versus the original 508 I/O pins. Designs must confirm that the 8-pin reduction does not impact functional requirements.

Supply Voltage Difference: The substitute operates at 1.14V ~ 1.26V versus the original 1.71V ~ 1.89V. Power supply architecture and voltage regulation circuits must be re-evaluated during migration.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-50E-5FN672C directly replace the EP20K600EFC672-1X without PCB modifications?

A: The 672-BBGA package footprint is identical, eliminating PCB layout changes. However, the supply voltage range differs significantly (1.14V ~ 1.26V vs. 1.71V ~ 1.89V), requiring power supply circuit redesign and validation.

Q: What is the impact of the 8-pin I/O reduction (508 to 500)?

A: Designs must confirm that all 508 I/O pins were actively used in the original implementation. If fewer than 500 I/O pins are required, the substitute is fully compatible. If all 508 pins are essential, alternative solutions must be evaluated.

Q: Does the LFE2-50E-5FN672C provide sufficient logic capacity?

A: Yes. The substitute provides 48,000 logic elements and 396,288 RAM bits, both exceeding the original part's 24,320 logic elements and 311,296 RAM bits. This provides additional design capacity.

Q: Are there differences in moisture sensitivity handling?

A: Both parts share identical Moisture Sensitivity Level 3 (168 Hours) ratings, requiring equivalent storage and handling procedures.

Q: What is the significance of the RoHS compliance difference?

A: The LFE2-50E-5FN672C is ROHS3 compliant, meeting modern environmental and manufacturing standards. The original EP20K600EFC672-1X is RoHS non-compliant, which may restrict use in certain markets or applications with regulatory requirements.

Q: Are there any design tool or software compatibility considerations?

A: Design migration from APEX-20KE® to ECP2 architecture requires evaluation of HDL compatibility, synthesis tool support, and timing closure. These factors are outside the scope of electrical and mechanical parameter equivalence.

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