EP20K400EFC672-1 Equivalent & Substitute Parts

Part Overview

The EP20K400EFC672-1 is an APEX-20KE® Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 488 I/O pins and 16,640 logic elements in a 672-BBGA package. This device is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and procurement. The APEX-20KE® series represents legacy FPGA technology; identifying compatible alternatives ensures design continuity and supply chain reliability.

Substiute Parts

EP20K400EFC672-1

IntelIn Stock: 1355EP20K400EFC672-1 Datasheet

Current PartRFQ

LFE2-50E-5FN672C

Lattice Semiconductor CorporationIn Stock: 711LFE2-50E-5FN672C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EP20K400EFC672-1 is determined by the following critical parameters:

• Package Compatibility: Both main and substitute parts must use 672-BBGA (27x27) surface mount packaging to ensure PCB footprint compatibility
• I/O Pin Count: Substitute parts must provide equal or greater I/O capability (minimum 488 I/O pins)
• Logic Element Capacity: Substitute parts must meet or exceed 16,640 logic elements to support equivalent design complexity
• Embedded Memory: Substitute parts must provide sufficient RAM bits (minimum 212,992 bits) for design requirements
• Supply Voltage Range: Operating voltage must be compatible with system power delivery architecture
• Operating Temperature Range: Substitute parts must support the 0°C ~ 85°C operating window
• Mounting Type: Surface mount technology must be maintained for manufacturing consistency

The LFE2-50E-5FN672C from Lattice Semiconductor Corporation qualifies as a substitute based on matching package geometry, exceeding I/O count, logic element capacity, and embedded memory specifications while maintaining compatible operating parameters.

Parameter Comparison

Engineering Selection Recommendations

The LFE2-50E-5FN672C is an active product from Lattice Semiconductor Corporation, providing supply chain continuity for the obsolete EP20K400EFC672-1. Key selection factors include:

• Product Status: The substitute is actively manufactured and supported, eliminating obsolescence risk
• Compliance: Both parts maintain REACH Unaffected status and equivalent MSL ratings, ensuring regulatory and environmental compatibility
• Package Geometry: Identical 672-BBGA (27x27) footprint enables direct PCB layout reuse without redesign
• Functional Capacity: The LFE2-50E-5FN672C exceeds the EP20K400EFC672-1 in logic elements (48,000 vs. 16,640), I/O count (500 vs. 488), and embedded memory (396,288 vs. 212,992 bits), providing design margin and future scalability
• Operating Parameters: Matching temperature range and MSL specifications maintain system reliability requirements

Design migration requires HDL retargeting to the ECP2 architecture and validation of timing closure and resource utilization within the new device.

Frequently Asked Questions (FAQ)

Q: Can the LFE2-50E-5FN672C be used as a direct replacement for the EP20K400EFC672-1?

A: The LFE2-50E-5FN672C matches the 672-BBGA package footprint and exceeds functional specifications (I/O, logic elements, and memory). However, direct replacement requires HDL retargeting from APEX-20KE® to ECP2 architecture. Pin-to-pin compatibility is not guaranteed; pinout verification is mandatory before PCB layout finalization.

Q: What are the key differences in supply voltage between these parts?

A: The EP20K400EFC672-1 operates at 1.71V ~ 1.89V, while the LFE2-50E-5FN672C operates at 1.14V ~ 1.26V. Power delivery circuits must be redesigned to accommodate the lower voltage range of the substitute device.

Q: Are both parts suitable for the same operating temperature range?

A: Yes. Both the EP20K400EFC672-1 and LFE2-50E-5FN672C support 0°C ~ 85°C (TJ) operating temperature, maintaining thermal design compatibility.

Q: What is the significance of the 672-BBGA package designation?

A: The 672-BBGA package indicates a 672-pin ball grid array in a 27x27mm form factor. Both parts use this identical package geometry, enabling PCB footprint reuse. The FBGA and FPBGA designations refer to manufacturer-specific ball array implementations but maintain mechanical and electrical compatibility within the 672-BBGA standard.

Q: Does the LFE2-50E-5FN672C provide additional design capacity?

A: Yes. The LFE2-50E-5FN672C provides 48,000 logic elements compared to 16,640 in the EP20K400EFC672-1, along with 396,288 RAM bits versus 212,992 bits. This additional capacity supports design expansion and optimization within the same package footprint.

Q: What compliance certifications apply to both parts?

A: Both parts maintain REACH Unaffected status and Moisture Sensitivity Level 3 (168 Hours) ratings. The LFE2-50E-5FN672C additionally carries RoHS3 Compliance certification, reflecting its active product status.