EP20K200EFC672-1 Equivalent & Substitute Parts

Part Overview

The EP20K200EFC672-1 is an APEX-20KE® Field Programmable Gate Array (FPGA) manufactured by Intel, featuring 376 I/O pins and 8320 logic elements in a 672-BBGA package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and production continuity. The APEX-20KE® series represents legacy FPGA technology; identifying compatible alternatives ensures project feasibility when original inventory becomes unavailable.

Substiute Parts

EP20K200EFC672-1

IntelIn Stock: 1248EP20K200EFC672-1 Datasheet

Current PartRFQ

LFE3-70EA-8FN672C

Lattice Semiconductor CorporationIn Stock: 16718LFE3-70EA-8FN672C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EP20K200EFC672-1 is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 672-BBGA (27x27) package to ensure PCB footprint compatibility and mechanical fit.

I/O Pin Count: The substitute must provide a minimum of 376 I/O pins to maintain signal connectivity. The LFE3-70EA-8FN672C provides 380 I/O pins, meeting this requirement with marginal overhead.

Logic Capacity: The substitute must deliver sufficient logic elements to accommodate designs originally targeting 8320 logic elements. The LFE3-70EA-8FN672C provides 67000 logic elements, exceeding the original capacity.

Operating Temperature Range: Both devices support 0°C ~ 85°C (TJ), ensuring thermal compatibility in equivalent operating environments.

Voltage Supply Range: The substitute operates at 1.14V ~ 1.26V, which differs from the original 1.71V ~ 1.89V. This represents a fundamental architectural difference between legacy APEX-20KE® and modern ECP3 technology and requires power supply redesign.

Surface Mount Configuration: Both devices use surface mount technology, maintaining assembly process compatibility.

Parameter Comparison

Engineering Selection Recommendations

The LFE3-70EA-8FN672C qualifies as a functional substitute based on package compatibility, I/O pin count, and thermal operating range. The substitute offers significant advantages: active product status ensures long-term availability and supply chain stability, and ROHS3 compliance aligns with modern environmental and regulatory requirements.

Critical design considerations include voltage supply architecture redesign, as the substitute operates at 1.14V ~ 1.26V versus the original 1.71V ~ 1.89V. This necessitates power distribution network modifications and potential changes to peripheral circuitry. The substantially higher logic element count (67000 versus 8320) and RAM capacity (4526080 versus 106496 bits) provide design margin but do not require reduction or removal of functionality.

Selection of the LFE3-70EA-8FN672C is appropriate for new designs and production continuity where the EP20K200EFC672-1 is no longer available. Existing designs using the original part may continue production with current inventory; migration to the substitute should be evaluated as part of planned design refresh cycles.

Frequently Asked Questions (FAQ)

Q: Can the LFE3-70EA-8FN672C directly replace the EP20K200EFC672-1 without PCB modifications?

A: The 672-BBGA package footprint is identical, allowing direct PCB placement. However, power supply voltage differs fundamentally (1.14V ~ 1.26V versus 1.71V ~ 1.89V), requiring power distribution network redesign and potential modifications to voltage regulator circuits.

Q: What is the significance of the I/O pin count difference (376 versus 380)?

A: The substitute provides four additional I/O pins. Designs using all 376 pins of the original part will function with the substitute. Unused pins on the substitute require proper termination per Lattice design guidelines.

Q: Does the higher logic element count affect design compatibility?

A: No. The substitute's 67000 logic elements exceed the original 8320 capacity, providing design margin. Existing designs targeting the original part will fit within the substitute's capacity without modification.

Q: Are there firmware or HDL changes required when switching to the LFE3-70EA-8FN672C?

A: HDL source code remains compatible. FPGA design tools and synthesis flows differ between Intel and Lattice platforms, requiring re-synthesis and re-implementation using Lattice design software (Lattice ispLEVER or Radiant).

Q: What is the impact of the RoHS compliance difference?

A: The original part is RoHS non-compliant; the substitute is ROHS3 compliant. For applications subject to RoHS regulations or customer requirements, the substitute eliminates compliance risk. Existing designs using the original part may continue without regulatory impact if not subject to RoHS mandates.

Q: How do the RAM capacities compare, and does this affect design migration?

A: The substitute provides 4526080 bits versus the original 106496 bits—a 42x increase. Designs using embedded RAM will benefit from additional capacity; no design changes are necessary to accommodate this difference.

Q: Is the 672-FBGA package designation interchangeable with 672-BBGA?

A: Both designations refer to the same 672-pin ball grid array in a 27x27mm footprint. FBGA and BBGA terminology reflects different manufacturer conventions; the physical package is identical.