EL816(C) Optoisolator Equivalent & Substitute Parts

Part Overview

The EL816(C) is a 5000Vrms isolation optoisolator with transistor output manufactured by Everlight Electronics Co Ltd. This component is classified as an active product and is supplied in 4-DIP through-hole packaging. The EL816(C) serves applications requiring galvanic isolation between input and output circuits with moderate current transfer ratios and fast switching characteristics. Substitute parts are identified when equivalent electrical performance, isolation voltage, package compatibility, and operational temperature ranges align with the main part specifications.

Substiute Parts

EL816(C)

Everlight Electronics Co LtdIn Stock: 831EL816(C) Datasheet

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TLP785(F)

Toshiba Semiconductor and StorageIn Stock: 2426TLP785(F) Datasheet

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TLP785(GR-TP6,F)

Toshiba Semiconductor and StorageIn Stock: 13910TLP785(GR-TP6,F) Datasheet

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TLP785(Y,F)

Toshiba Semiconductor and StorageIn Stock: 1021TLP785(Y,F) Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the EL816(C) are qualified based on the following criteria:

Mandatory Matching Parameters:

• Isolation voltage: 5000Vrms
• Output type: Transistor
• Number of channels: 1
• Maximum output voltage: 80V
• Maximum output current: 50mA
• Operating temperature range: -55°C to 110°C
• Input type: DC

Allowable Variation Parameters:

• Current Transfer Ratio (CTR): Substitutes may have different minimum and maximum CTR values provided the part functions within the application's input and output current requirements
• Rise/Fall time: Switching speed variations are acceptable if the substitute meets application timing constraints
• Vce Saturation: Output saturation voltage may vary within the specified maximum limits
• Forward voltage (Vf): Input diode forward voltage variations are acceptable within specified ranges

Package Compatibility:

• Through-hole 4-DIP packages are directly substitutable
• Surface-mount 4-SMD variants require PCB redesign and are listed separately

The three Toshiba TLP785 variants meet the mandatory electrical and thermal specifications and are therefore qualified as substitutes for the EL816(C).

Parameter Comparison

Engineering Selection Recommendations

For Through-Hole PCB Designs:

TLP785(F) and TLP785(Y,F) are direct pin-compatible substitutes for EL816(C) in through-hole applications. Both parts maintain the 4-DIP package footprint and mounting type. Selection between these variants depends on current transfer ratio requirements:

• TLP785(F): CTR range 50% to 600% @ 5mA. Suitable for applications requiring wide CTR tolerance or higher maximum CTR performance.
• TLP785(Y,F): CTR range 50% to 150% @ 5mA. Suitable for applications with tighter CTR specifications in the lower to mid-range.

Both TLP785 variants exhibit faster rise time (2µs versus 4µs) compared to EL816(C), which may improve switching performance in high-frequency applications. Vce saturation voltage is higher (400mV maximum) in TLP785 parts compared to EL816(C) (200mV maximum), which affects output voltage headroom in low-voltage applications.

For Surface-Mount PCB Designs:

TLP785(GR-TP6,F) provides equivalent electrical performance in a 4-SMD surface-mount package. This variant requires PCB redesign and is not a direct pin replacement. CTR range is 100% to 300% @ 5mA, positioning it between the other two TLP785 variants. This part is supplied in Tape & Reel packaging format.

Compliance and Product Status:

All substitute parts are active products with RoHS compliance certification. EL816(C) and TLP785 variants carry ROHS3 or RoHS Compliant status, confirming lead-free manufacturing and hazardous substance restrictions compliance. Moisture sensitivity level is 1 (Unlimited) for all parts, indicating no special moisture handling requirements during storage or assembly.

Frequently Asked Questions (FAQ)

Q: Can TLP785(F) directly replace EL816(C) on an existing PCB?

A: Yes. TLP785(F) is pin-compatible with EL816(C) in 4-DIP through-hole applications. Both parts use identical package dimensions (0.300", 7.62mm) and mounting type. No PCB modification is required for mechanical or electrical connection.

Q: What is the difference between TLP785(F) and TLP785(Y,F)?

A: Both are 4-DIP through-hole packages with identical isolation voltage, output voltage, and output current ratings. The primary difference is current transfer ratio specification. TLP785(F) has a CTR range of 50% to 600% @ 5mA, while TLP785(Y,F) has a narrower range of 50% to 150% @ 5mA. Selection depends on whether your application requires the wider CTR tolerance or operates within the lower CTR band.

Q: Why is TLP785(GR-TP6,F) listed as a substitute if it requires PCB redesign?

A: TLP785(GR-TP6,F) is electrically equivalent to EL816(C) and meets all mandatory electrical specifications. However, it is a surface-mount variant (4-SMD) rather than through-hole (4-DIP). This part is listed for applications undergoing PCB redesign or for new designs targeting surface-mount assembly. Existing through-hole designs should use TLP785(F) or TLP785(Y,F).

Q: Are there any thermal or environmental differences between EL816(C) and TLP785 substitutes?

A: No. All parts share identical operating temperature range (-55°C to 110°C) and moisture sensitivity level (MSL 1, Unlimited). Thermal performance characteristics are equivalent across all variants.

Q: What does the higher Vce saturation voltage in TLP785 parts mean for my application?

A: Vce saturation is the voltage drop across the transistor output when fully saturated. EL816(C) has a maximum of 200mV, while TLP785 variants have a maximum of 400mV. In applications with low supply voltages or where output voltage headroom is critical, the higher saturation voltage of TLP785 parts reduces available output swing. Verify that your application's output voltage requirements accommodate this difference.

Q: Can I use TLP785(GR-TP6,F) in a through-hole socket designed for 4-DIP packages?

A: No. TLP785(GR-TP6,F) is a surface-mount component with 4-SMD gull-wing leads. It is not compatible with through-hole sockets or DIP packages. This part requires surface-mount assembly on a PCB with appropriate SMD footprint and reflow soldering.

Q: What is the significance of the packaging format (Tube vs. Tape & Reel)?

A: Tube packaging is used for through-hole components and manual or semi-automated assembly. Tape & Reel packaging is used for high-volume surface-mount assembly with automated pick-and-place equipment. TLP785(GR-TP6,F) is supplied in Tape & Reel format, while TLP785(F) and TLP785(Y,F) are supplied in Tube format. Packaging format does not affect electrical performance but impacts assembly process compatibility.

Q: Are all substitute parts RoHS compliant?

A: Yes. EL816(C) is ROHS3 Compliant. TLP785(F) is ROHS3 Compliant. TLP785(Y,F) and TLP785(GR-TP6,F) are RoHS Compliant. All parts meet lead-free and hazardous substance restriction requirements for regulated markets.