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EDZFHTE619.1B Equivalent & Substitute Parts
Part Overview
The EDZFHTE619.1B is a Zener diode manufactured by Rohm Semiconductor, classified as a surface mount component in the EDZ series. This device is rated for 100 mW power dissipation and operates across a temperature range of -55°C to 125°C. The part is currently listed as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and procurement needs. Substitute components must maintain compatibility with surface mount assembly processes and meet the same environmental and compliance standards.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | EDZFHTE619.1B |
| Manufacturer | Rohm Semiconductor |
| Category | Diodes, Zener |
| Description | Zener Diode 100 mW Surface Mount |
| Power - Max | 100 mW |
| Operating Temperature | -55°C ~ 125°C |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8541.10.0050 |
Substitute Part Grouping Explanation
Substitution of the EDZFHTE619.1B is based on the following critical parameters that define functional equivalence:
Primary Substitution Criteria:
- Mounting Type: Surface Mount (required match)
- Category: Diodes, Zener (required match)
- Manufacturer: Rohm Semiconductor (preferred continuity)
- RoHS Compliance: ROHS3 Compliant (required match)
- Moisture Sensitivity Level: 1 (Unlimited) (required match)
- ECCN Classification: EAR99 (required match)
Secondary Compatibility Factors:
- Power Rating: Substitute must equal or exceed 100 mW
- Operating Temperature Range: Substitute must support the required thermal envelope
- Package Type: Surface mount package compatibility with assembly equipment
The EDZVFHT2R9.1B qualifies as a substitute based on these parameters. It maintains surface mount configuration, Rohm Semiconductor manufacturing, ROHS3 compliance, MSL 1 rating, and EAR99 classification. The substitute provides enhanced power capability (150 mW versus 100 mW) and extended maximum junction temperature rating (150°C), offering improved thermal performance margins.
Parameter Comparison
| Parameter | EDZFHTE619.1B (Main Part) | EDZVFHT2R9.1B (Substitute) |
|---|---|---|
| Manufacturer | Rohm Semiconductor | Rohm Semiconductor |
| Category | Diodes, Zener | Diodes, Zener |
| Mounting Type | Surface Mount | Surface Mount |
| Power - Max | 100 mW | 150 mW |
| Operating Temperature (Max) | 125°C | 150°C (TJ) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| ECCN | EAR99 | EAR99 |
| HTSUS | 8541.10.0050 | 8541.10.0050 |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The EDZVFHT2R9.1B is the identified substitute for the obsolete EDZFHTE619.1B. Selection of this substitute is supported by the following engineering factors:
Compliance and Regulatory Alignment:
- Both components maintain ROHS3 compliance, ensuring compatibility with environmental regulations and procurement standards
- Identical ECCN (EAR99) and HTSUS classifications confirm export control and tariff consistency
- MSL 1 rating on both parts eliminates moisture sensitivity constraints during storage and assembly
Product Lifecycle Status:
- The substitute component carries Active product status, ensuring long-term availability and supply chain continuity
- The main part's Obsolete status necessitates transition to the substitute for new designs and ongoing production
Thermal and Power Performance:
- The substitute provides 50% additional power dissipation capacity (150 mW versus 100 mW), enabling operation in higher thermal stress conditions
- Extended maximum junction temperature (150°C versus 125°C) provides additional thermal margin for demanding applications
Manufacturing and Assembly Compatibility:
- Both components utilize surface mount technology with compatible assembly processes
- Rohm Semiconductor manufacturing continuity ensures consistent quality and reliability standards
Frequently Asked Questions (FAQ)
Q: Can the EDZVFHT2R9.1B directly replace the EDZFHTE619.1B in existing designs?
A: The EDZVFHT2R9.1B qualifies as a functional substitute based on matching surface mount configuration, Rohm Semiconductor manufacturing, ROHS3 compliance, MSL 1 rating, and identical ECCN/HTSUS classifications. Physical package compatibility and circuit-level voltage/current requirements must be verified against specific design specifications.
Q: What are the key differences between these two components?
A: The primary differences are power rating (150 mW substitute versus 100 mW main part), maximum junction temperature (150°C versus 125°C), and product status (Active versus Obsolete). The substitute offers enhanced thermal performance and extended operational margins.
Q: Does the substitute maintain the same moisture sensitivity characteristics?
A: Yes. Both components carry MSL 1 (Unlimited) classification, indicating identical moisture sensitivity levels and identical handling, storage, and assembly requirements.
Q: Are there any compliance or regulatory differences between these parts?
A: No. Both components maintain ROHS3 compliance, identical ECCN (EAR99) classification, and identical HTSUS tariff codes. Regulatory and export control requirements are equivalent.
Q: What package types are available for the substitute component?
A: The EDZVFHT2R9.1B is supplied in Cut Tape (CT) and Digi-Reel packaging formats with SC-79 and SOD-523 package cases. Packaging selection should align with assembly equipment and procurement workflow requirements.
Q: Is the substitute suitable for automotive applications?
A: The EDZVFHT2R9.1B carries Automotive grade classification and AEC-Q101 qualification, indicating suitability for automotive-grade applications. Application requirements should be evaluated against specific automotive standards and performance criteria.
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