EDFA232A2MA-GD-F-D Equivalent & Substitute Parts

Part Overview

The EDFA232A2MA-GD-F-D is a 16Gbit SDRAM Mobile LPDDR3 memory IC manufactured by Micron Technology Inc., designed for parallel interface applications at 800 MHz. This part is classified as obsolete and no longer in active production. Finding equivalent substitute parts is necessary to maintain design continuity, ensure component availability, and support ongoing system requirements where this memory IC was originally specified.

Substiute Parts

EDFA232A2MA-GD-F-D

Micron Technology Inc.In Stock: 1374EDFA232A2MA-GD-F-D Datasheet

Current PartRFQ

MT52L512M32D2PF-107 WT:B TR

Micron Technology Inc.In Stock: 1156MT52L512M32D2PF-107 WT:B TR Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the EDFA232A2MA-GD-F-D is determined by the following critical parameters:

• Memory Capacity: 16Gbit (non-negotiable)
• Memory Organization: 512M x 32 (non-negotiable)
• Technology: SDRAM - Mobile LPDDR3 (non-negotiable)
• Memory Type: Volatile DRAM (non-negotiable)
• Operating Temperature Range: -30°C ~ 85°C (TC) (non-negotiable)
• Voltage Supply Compatibility: Must operate within or overlap the supply voltage range
• RoHS Compliance: ROHS3 Compliant (required for regulatory alignment)
• Moisture Sensitivity Level: 3 (168 Hours) (non-negotiable)

The substitute part MT52L512M32D2PF-107 WT:B TR meets all critical parameters. While the clock frequency differs (933 MHz vs. 800 MHz), this represents a performance upgrade and does not prevent substitution. The voltage supply specification (1.2V) falls within the acceptable operating range of the original part.

Parameter Comparison

Engineering Selection Recommendations

The MT52L512M32D2PF-107 WT:B TR is the designated substitute for the obsolete EDFA232A2MA-GD-F-D based on the following factors:

• Product Status Alignment: The substitute is in active production status, ensuring long-term availability and supply chain continuity.
• Regulatory Compliance: Both parts maintain ROHS3 compliance, satisfying environmental and regulatory requirements.
• Functional Equivalence: Identical memory capacity (16Gbit), organization (512M x 32), and technology (SDRAM - Mobile LPDDR3) ensure functional compatibility.
• Thermal and Electrical Specifications: Operating temperature range and voltage supply specifications are compatible with the original design parameters.
• Moisture Sensitivity Alignment: Both parts share MSL 3 (168 Hours), maintaining consistent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can MT52L512M32D2PF-107 WT:B TR directly replace EDFA232A2MA-GD-F-D in existing designs?

A: Yes. Both parts share identical memory capacity (16Gbit), organization (512M x 32), technology (SDRAM - Mobile LPDDR3), operating temperature range (-30°C ~ 85°C), and moisture sensitivity level (MSL 3). The substitute operates at a higher clock frequency (933 MHz vs. 800 MHz) and is in active production status.

Q: What is the primary reason for substitution?

A: The EDFA232A2MA-GD-F-D is classified as obsolete. The MT52L512M32D2PF-107 WT:B TR is the active equivalent from the same manufacturer, ensuring continued availability and supply chain support.

Q: Are there packaging differences between these parts?

A: Yes. The original part's package specification is not provided in the available data. The substitute uses a 178-VFBGA (11.5x11) package with surface mount technology. Package compatibility must be evaluated against the original design's PCB layout and assembly requirements.

Q: Do the voltage supply specifications differ?

A: The original part operates at 1.14V ~ 1.95V, while the substitute operates at 1.2V. The substitute's voltage specification falls within the original part's acceptable range, ensuring electrical compatibility.

Q: Are both parts RoHS compliant?

A: Yes. Both EDFA232A2MA-GD-F-D and MT52L512M32D2PF-107 WT:B TR are ROHS3 compliant, meeting environmental and regulatory standards.

Q: What is the moisture sensitivity level for both parts?

A: Both parts are classified as MSL 3 (168 Hours), requiring identical handling, storage, and reflow procedures during assembly.