ECQ-E6564KZ Equivalent & Substitute Parts

Part Overview

The ECQ-E6564KZ is a 0.56 µF film capacitor rated for 630V DC operation with polyester metallized dielectric construction. Manufactured by Panasonic Electronic Components, this radial through-hole component is designed for general-purpose applications requiring stable capacitance and high voltage tolerance. The ECQ-E6564KZ is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing system support and new design implementations.

Substiute Parts

ECQ-E6564KZ

Panasonic Electronic ComponentsIn Stock: 816ECQ-E6564KZ Datasheet

Current PartRFQ

ECQ-E6564KF

Panasonic Electronic ComponentsIn Stock: 4284ECQ-E6564KF Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ECQ-E6564KZ is determined by strict equivalence across the following critical parameters:

• Capacitance Value: Must be 0.56 µF
• Tolerance: Must be ±10%
• Voltage Rating - DC: Must be 630V or higher
• Dielectric Material: Must be Polyester, Metallized
• Mounting Type: Must be Through Hole
• Package / Case: Must be Radial
• Termination: Must be PC Pins

The ECQ-E6564KF meets all substitution criteria. While physical dimensions and operating temperature ranges differ, these variations remain within acceptable mechanical and thermal compatibility boundaries for through-hole radial film capacitors in general-purpose applications.

Parameter Comparison

Engineering Selection Recommendations

The ECQ-E6564KF is the direct functional equivalent for the obsolete ECQ-E6564KZ. Both components share identical capacitance, tolerance, DC voltage rating, dielectric material, and termination specifications. The ECQ-E6564KF carries Active product status with significantly higher inventory availability (4200 units versus 707 units), ensuring supply chain continuity.

The ECQ-E6564KF features an extended operating temperature range (-40°C ~ 105°C versus -40°C ~ 85°C) and includes RoHS3 and REACH compliance certifications. Physical dimensions are slightly reduced, which may require PCB layout verification for existing designs but generally presents no compatibility issues for through-hole radial mounting applications.

Frequently Asked Questions (FAQ)

Q: Can the ECQ-E6564KF directly replace the ECQ-E6564KZ in existing designs?

A: Yes. Both components meet identical electrical specifications for capacitance (0.56 µF), tolerance (±10%), and DC voltage rating (630V). Physical dimensions are smaller on the ECQ-E6564KF, requiring verification that PCB pad spacing accommodates the 0.886" (22.50mm) lead spacing versus the original 1.004" (25.50mm).

Q: What is the significance of the different operating temperature ranges?

A: The ECQ-E6564KZ operates from -40°C to 85°C, while the ECQ-E6564KF extends to 105°C. For applications operating within the original -40°C to 85°C window, both components perform identically. The ECQ-E6564KF provides additional thermal margin for higher-temperature environments.

Q: Does the AC voltage rating difference affect substitution?

A: The ECQ-E6564KZ does not specify an AC voltage rating. The ECQ-E6564KF is rated for 250V AC. For DC-only applications, this difference is not relevant. For applications requiring AC voltage operation, the ECQ-E6564KF's 250V AC rating must be verified against circuit requirements.

Q: Are there compliance differences between these parts?

A: The ECQ-E6564KF includes RoHS3 Compliant and REACH Unaffected certifications. The ECQ-E6564KZ does not specify these certifications. For applications requiring regulatory compliance documentation, the ECQ-E6564KF provides certified status.

Q: What should be verified before implementing the ECQ-E6564KF as a replacement?

A: Verify PCB pad spacing compatibility with the 0.886" (22.50mm) lead spacing. Confirm that the reduced physical dimensions (26.00mm x 10.00mm versus 29.00mm x 14.00mm) do not conflict with mechanical clearance requirements. Validate that the extended operating temperature range does not introduce unintended thermal behavior changes in the application circuit.