ECQ-E2124KS Equivalent & Substitute Parts

Part Overview

The ECQ-E2124KS is a 0.12 µF film capacitor rated for 250V DC operation with polyester metallized dielectric construction. Manufactured by Panasonic Electronic Components, this radial through-hole component is designed for general-purpose applications requiring stable capacitance and reliable performance across industrial temperature ranges.

The ECQ-E2124KS carries an obsolete product status. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production or repair requirements for systems utilizing this component.

Substiute Parts

ECQ-E2124KS

Panasonic Electronic ComponentsIn Stock: 1037ECQ-E2124KS Datasheet

Current PartRFQ

ECQ-E2124KF

Panasonic Electronic ComponentsIn Stock: 1102ECQ-E2124KF Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ECQ-E2124KS is determined by the following critical parameters:

• Capacitance Value: Must be 0.12 µF (exact match required)
• Tolerance: Must be ±10% or tighter
• Voltage Rating - DC: Must be rated for minimum 250V DC
• Dielectric Material: Must be polyester metallized construction
• Mounting Type: Must be through-hole radial configuration
• Termination: Must use PC pins for PCB compatibility

The ECQ-E2124KF meets all substitution criteria. While it features a smaller physical footprint and extended operating temperature range, these differences do not prevent functional equivalence when the core electrical and mechanical parameters align.

Parameter Comparison

Engineering Selection Recommendations

The ECQ-E2124KF is a direct functional equivalent to the ECQ-E2124KS for applications requiring 0.12 µF capacitance at 250V DC with polyester metallized dielectric construction.

The ECQ-E2124KF offers the following advantages:

• Active product status ensures ongoing availability and supply chain support
• ROHS3 compliance and REACH unaffected status align with current regulatory requirements
• Extended operating temperature range (-40°C ~ 105°C) provides broader thermal margin compared to the obsolete ECQ-E2124KS (-40°C ~ 85°C)
• Compact physical dimensions reduce PCB footprint requirements

The primary design consideration is lead spacing: the ECQ-E2124KF uses 7.50mm spacing versus the ECQ-E2124KS 15.00mm spacing. PCB layout modifications are required to accommodate this difference. Physical dimensions are also reduced, which may affect mechanical mounting clearances in confined spaces.

Frequently Asked Questions (FAQ)

Q: Can the ECQ-E2124KF directly replace the ECQ-E2124KS without circuit modification?

A: Electrical substitution is valid. The capacitance, tolerance, voltage rating, and dielectric material are identical. However, PCB layout modification is necessary due to different lead spacing (7.50mm versus 15.00mm) and physical dimensions.

Q: What is the impact of the different lead spacing?

A: Lead spacing determines the distance between mounting holes on the PCB. The ECQ-E2124KF requires holes spaced 7.50mm apart, while the ECQ-E2124KS uses 15.00mm spacing. Existing PCB designs must be updated to accommodate the substitute part.

Q: Does the extended operating temperature range of the ECQ-E2124KF affect compatibility?

A: No. The extended range (-40°C ~ 105°C) is a superset of the original specification (-40°C ~ 85°C). The substitute part maintains performance across the original operating window and extends capability to higher temperatures.

Q: Are there compliance differences between the two parts?

A: The ECQ-E2124KF is ROHS3 compliant and REACH unaffected. Compliance status for the obsolete ECQ-E2124KS is not specified. For new designs or systems requiring regulatory compliance documentation, the ECQ-E2124KF is the appropriate selection.

Q: What is the significance of the smaller physical footprint?

A: The ECQ-E2124KF occupies less PCB space (10.30mm x 6.00mm versus 17.50mm x 5.00mm). This may be advantageous for space-constrained designs but requires PCB redesign. Verify mechanical clearances in the target application before implementation.