ECH8410-TL-H N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The ECH8410-TL-H is an N-Channel MOSFET manufactured by onsemi, rated for 30V drain-to-source voltage with 12A continuous drain current at 25°C. This device is packaged in an 8-SMD flat lead surface mount configuration and is designed for general-purpose switching applications requiring moderate current handling and low on-resistance characteristics.

The ECH8410-TL-H has reached obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this component.

Substiute Parts

ECH8410-TL-H
onsemiIn Stock: 20863ECH8410-TL-H Datasheet
ECH8410-TL-H
Current Part
NTTFS4C10NTWG
onsemiIn Stock: 40417NTTFS4C10NTWG Datasheet
NTTFS4C10NTWG
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Key Parameters

Parameter Value Unit
FET Type N-Channel
Drain to Source Voltage (Vdss) 30 V
Continuous Drain Current (Id) @ 25°C 12 A (Ta)
On-Resistance (Rds On Max) @ Id, Vgs 10 mOhm @ 6A, 10V
Gate Charge (Qg Max) @ Vgs 31 nC @ 10V
Gate Voltage (Vgs Max) ±20 V
Input Capacitance (Ciss Max) @ Vds 1700 pF @ 10V
Power Dissipation (Max) 1.6 W (Ta)
Operating Temperature (TJ) 150 °C
Mounting Type Surface Mount
Package / Case 8-SMD, Flat Lead
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

Substitution of the ECH8410-TL-H is determined by strict alignment of the following electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • FET Type: N-Channel topology required
  • Drain to Source Voltage (Vdss): Minimum 30V rating
  • Continuous Drain Current (Id): Minimum 12A at 25°C ambient temperature
  • Gate Voltage (Vgs Max): ±20V or greater
  • On-Resistance (Rds On): Performance at specified gate and drain conditions
  • Gate Charge (Qg): Switching speed and drive requirements
  • Input Capacitance (Ciss): Gate drive circuit compatibility

Mechanical and Packaging Criteria:

  • Mounting Type: Surface Mount required
  • Moisture Sensitivity Level (MSL): 1 (Unlimited) or equivalent
  • Environmental Compliance: REACH Unaffected status

Regulatory and Supply Status:

  • REACH compliance and ECCN classification alignment
  • Product availability and inventory status

The NTTFS4C10NTWG meets the core electrical requirements for N-Channel 30V operation with sufficient current rating and compatible gate voltage specifications. However, packaging differences and product status variations must be evaluated for specific application requirements.

Parameter Comparison

Parameter ECH8410-TL-H NTTFS4C10NTWG Unit
Manufacturer onsemi onsemi
FET Type N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 30 30 V
Continuous Drain Current (Id) @ 25°C 12 (Ta) 8.2 (Ta), 44 (Tc) A
On-Resistance (Rds On Max) 10 mOhm @ 6A, 10V 7.4 mOhm @ 30A, 10V
Gate Charge (Qg Max) @ Vgs 31 @ 10V 18.6 @ 10V nC
Gate Voltage (Vgs Max) ±20 ±20 V
Input Capacitance (Ciss Max) 1700 @ 10V 993 @ 15V pF
Power Dissipation (Max) 1.6 (Ta) 0.79 (Ta), 23.6 (Tc) W
Operating Temperature (TJ) 150 −55 to 150 °C
Mounting Type Surface Mount Surface Mount
Package / Case 8-SMD, Flat Lead 8-PowerWDFN
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
Product Status Obsolete Last Time Buy

Engineering Selection Recommendations

ECH8410-TL-H Status: The ECH8410-TL-H has reached obsolete product status. New procurement of this part number is not available through standard distribution channels. Existing inventory of 20,845 pieces is available as new original stock, but this represents a finite supply with no future manufacturing planned.

NTTFS4C10NTWG as Substitute: The NTTFS4C10NTWG is classified as Last Time Buy, indicating a defined end-of-life window with limited future availability. This part meets the core electrical requirements for N-Channel 30V operation and is manufactured by the same supplier (onsemi), ensuring design continuity and compatibility with existing supply chain relationships.

Key Considerations:

  1. Electrical Compatibility: Both devices operate at 30V Vdss with N-Channel topology and ±20V gate voltage ratings. The NTTFS4C10NTWG provides lower on-resistance (7.4 mOhm vs. 10 mOhm) and reduced gate charge (18.6 nC vs. 31 nC), resulting in improved switching efficiency and reduced drive circuit requirements.

  2. Current Rating Differential: The ECH8410-TL-H is rated for 12A continuous drain current at 25°C ambient. The NTTFS4C10NTWG provides 8.2A at 25°C ambient but 44A at 25°C case temperature, indicating superior thermal performance in applications with adequate heat sinking.

  3. Package Transition: The ECH8410-TL-H uses 8-SMD flat lead packaging, while the NTTFS4C10NTWG uses 8-PowerWDFN (3.3x3.3mm) packaging. PCB layout modifications are required for this substitution. The PowerWDFN package includes an exposed thermal pad, improving heat dissipation characteristics.

  4. Regulatory Compliance: Both parts maintain REACH Unaffected status and EAR99 ECCN classification, ensuring no additional regulatory burden for substitution.

  5. Supply Chain Planning: Given the Last Time Buy status of the NTTFS4C10NTWG, long-term design strategies should evaluate additional alternatives or establish extended inventory reserves to support production continuity beyond the Last Time Buy window.

Frequently Asked Questions (FAQ)

Q: Can the NTTFS4C10NTWG directly replace the ECH8410-TL-H without circuit modifications?

A: Electrical substitution is feasible based on matching Vdss (30V), gate voltage (±20V), and N-Channel topology. However, package geometry differs significantly (8-SMD flat lead vs. 8-PowerWDFN 3.3x3.3mm). PCB layout redesign is required to accommodate the different footprint and thermal pad configuration. Gate drive circuit optimization may be beneficial due to reduced gate charge (18.6 nC vs. 31 nC).

Q: What are the thermal performance differences between these devices?

A: The ECH8410-TL-H is rated for 1.6W power dissipation at 25°C ambient. The NTTFS4C10NTWG provides 0.79W at 25°C ambient but 23.6W at 25°C case temperature. The PowerWDFN package includes an exposed thermal pad for direct PCB heat transfer, enabling superior thermal performance in applications with adequate thermal management. The lower on-resistance (7.4 mOhm vs. 10 mOhm) also reduces conduction losses.

Q: Are there continuous drain current limitations with the NTTFS4C10NTWG?

A: The NTTFS4C10NTWG is rated for 8.2A continuous drain current at 25°C ambient temperature, which is lower than the ECH8410-TL-H rating of 12A. Applications requiring sustained 12A operation at 25°C ambient without case temperature elevation require thermal analysis to confirm the NTTFS4C10NTWG can deliver equivalent performance through improved heat dissipation via the PowerWDFN thermal pad.

Q: What is the impact of reduced gate charge on circuit design?

A: The NTTFS4C10NTWG gate charge is 18.6 nC compared to 31 nC for the ECH8410-TL-H. Lower gate charge reduces switching losses and simplifies gate drive circuit design. Existing gate driver circuits designed for the ECH8410-TL-H will operate with improved performance margins and reduced power consumption when driving the NTTFS4C10NTWG.

Q: How do input capacitance differences affect circuit performance?

A: The ECH8410-TL-H has input capacitance of 1700 pF at 10V, while the NTTFS4C10NTWG has 993 pF at 15V. Lower input capacitance in the NTTFS4C10NTWG reduces gate drive current requirements and improves switching speed. This difference is beneficial for high-frequency switching applications and reduces thermal stress on gate driver circuits.

Q: What is the significance of Last Time Buy status for the NTTFS4C10NTWG?

A: Last Time Buy status indicates a defined end-of-life window with a final order deadline. After this date, the part will transition to obsolete status with no further manufacturing. Current inventory of 40,400 pieces is available, but long-term design strategies should evaluate additional alternatives or establish extended inventory reserves to support production continuity beyond the Last Time Buy window.

Q: Are there RoHS compliance differences between these parts?

A: The ECH8410-TL-H does not specify RoHS status in the provided data. The NTTFS4C10NTWG is ROHS3 Compliant. Both parts maintain REACH Unaffected status. Verify RoHS requirements for your specific application and supply chain requirements.

Q: What packaging considerations are critical for this substitution?

A: The ECH8410-TL-H uses 8-SMD flat lead packaging without a thermal pad. The NTTFS4C10NTWG uses 8-PowerWDFN (3.3x3.3mm) with an exposed thermal pad. PCB footprint, via placement for thermal pad connection, and solder reflow profile optimization are required. The thermal pad must be properly connected to ground or thermal planes to realize the improved heat dissipation benefits of the PowerWDFN package.

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