Equivalent & Substitute Parts for DZ2J062M0L

Part Overview

The DZ2J062M0L is a 6.2 V Zener diode manufactured by Panasonic Electronic Components, rated for 200 mW power dissipation in a surface mount SMini2-F5-B package. This component is classified as discontinued at DiGi Electronics, necessitating identification of active equivalent and substitute parts from alternative manufacturers. The part maintains RoHS compliance and unlimited moisture sensitivity rating (MSL 1), making it suitable for standard industrial and commercial applications requiring voltage regulation or transient protection at 6.2 V nominal.

Key Parameters

Parameter	Value	Unit
Voltage - Zener (Nom)	6.2	V
Tolerance	±2.5%	-
Power - Max	200	mW
Impedance (Max)	30	Ohms
Current - Reverse Leakage @ Vr	200	nA @ 4 V
Voltage - Forward (Vf) (Max) @ If	1	V @ 10 mA
Mounting Type	Surface Mount	-
Package / Case	SC-90, SOD-323F	-
RoHS Status	RoHS Compliant	-
Moisture Sensitivity Level	1 (Unlimited)	-

Substitute Part Grouping Explanation

Substitution of the DZ2J062M0L is determined by the following critical parameters:

Primary Matching Criteria:

Zener voltage nominal: 6.2 V (or within tolerance specification)
Mounting type: Surface Mount
Package compatibility: SC-90, SOD-323F, or equivalent footprint
Power rating: Equal to or greater than 200 mW
RoHS compliance status

Secondary Compatibility Factors:

Voltage tolerance: ±2.5% or tighter
Impedance (Zzt): Maximum 30 Ohms or lower
Reverse leakage current: 200 nA @ 4 V or lower
Forward voltage: 1 V @ 10 mA or lower
Moisture sensitivity: MSL 1 (Unlimited)

Substitute parts are grouped into two categories based on power rating alignment:

Category A - Direct Power Rating Match (200 mW): Parts with identical 200 mW power dissipation, maintaining the same thermal and electrical operating envelope as the original component.

Category B - Higher Power Rating (300 mW and above): Parts with increased power dissipation capability, suitable for applications where thermal margin or higher current handling is beneficial, provided all other electrical parameters remain compatible.

Parameter Comparison

Part Number	Manufacturer	Vz (Nom)	Tolerance	Power (Max)	Zzt (Max)	Ir @ Vr	Vf (Max) @ If	Package	Status
DZ2J062M0L	Panasonic	6.2 V	±2.5%	200 mW	30 Ω	200 nA @ 4 V	1 V @ 10 mA	SC-90, SOD-323F	Discontinued
MM3Z6V2ST1G	onsemi	6.2 V	±2%	300 mW	10 Ω	3 µA @ 4 V	900 mV @ 10 mA	SC-76, SOD-323	Active
TFZGTR6.2B	Rohm Semiconductor	6.2 V	-	500 mW	10 Ω	5 µA @ 3 V	-	2-SMD, Flat Lead	Active
TFZVTR6.2B	Rohm Semiconductor	6.2 V	-	500 mW	10 Ω	5 µA @ 3 V	-	2-SMD, Flat Lead	Active
UDZSTE-176.2B	Rohm Semiconductor	6.2 V	±2%	200 mW	60 Ω	1 µA @ 3 V	-	SC-90, SOD-323F	Active
UDZVFHTE-176.2B	Rohm Semiconductor	6.2 V	±2.18%	200 mW	60 Ω	1 µA @ 3 V	-	SC-90, SOD-323F	Active
UDZVTE-176.2B	Rohm Semiconductor	6.2 V	-	200 mW	60 Ω	1 µA @ 3 V	-	SC-90, SOD-323F	Active
YFZVFHTR6.2B	Rohm Semiconductor	6.12 V	±2.53%	500 mW	10 Ω	5 µA @ 3 V	-	2-SMD, Flat Lead	Active

Engineering Selection Recommendations

For Direct Replacement (Identical Electrical and Thermal Envelope):

UDZSTE-176.2B, UDZVFHTE-176.2B, and UDZVTE-176.2B are the primary substitutes, all manufactured by Rohm Semiconductor with 200 mW power rating matching the original DZ2J062M0L. These parts maintain the SC-90, SOD-323F package footprint and are all ROHS3 compliant with active product status. UDZSTE-176.2B and UDZVTE-176.2B offer standard industrial temperature range (-55°C to 150°C). UDZVFHTE-176.2B includes automotive-grade qualification (AEC-Q101) with maximum junction temperature of 150°C, suitable for applications requiring automotive reliability standards.

For Applications Requiring Increased Power Dissipation:

MM3Z6V2ST1G (onsemi, 300 mW) provides a moderate power increase with improved impedance characteristics (10 Ω vs. 30 Ω original) and tighter voltage tolerance (±2%). Operating temperature range extends to -65°C to 150°C. Package is SC-76, SOD-323, which maintains SOD-323 footprint compatibility.

TFZVTR6.2B and TFZGTR6.2B (Rohm Semiconductor, 500 mW) offer maximum power dissipation capability with superior impedance (10 Ω). Both are ROHS3 compliant and active. Operating temperature range is -55°C to 150°C. Package is 2-SMD, Flat Lead (TUMD2/TUMD2M), requiring PCB layout verification for footprint compatibility.

For Automotive Applications:

UDZVFHTE-176.2B is qualified to AEC-Q101 automotive standard and maintains 200 mW power rating with SC-90, SOD-323F package compatibility. YFZVFHTR6.2B provides automotive qualification with 500 mW power rating but operates at 6.12 V nominal (within ±2.53% tolerance of 6.2 V specification) and uses TUMD2M package.

Compliance and Availability:

All substitute parts are ROHS3 compliant and carry REACH Unaffected status. Inventory availability is confirmed for all listed substitutes, with TFZVTR6.2B showing highest stock (517,290 pcs).

Frequently Asked Questions (FAQ)

Q: Can MM3Z6V2ST1G directly replace DZ2J062M0L in all applications?

A: MM3Z6V2ST1G is electrically compatible as a substitute, maintaining 6.2 V nominal zener voltage and meeting or exceeding all critical electrical parameters. However, package footprint differs (SC-76, SOD-323 vs. SC-90, SOD-323F). PCB layout verification is required to confirm mechanical compatibility. The 300 mW power rating provides additional thermal margin compared to the original 200 mW specification.

Q: What is the difference between UDZSTE-176.2B, UDZVTE-176.2B, and UDZVFHTE-176.2B?

A: All three parts share identical 6.2 V nominal voltage, 200 mW power rating, and SC-90, SOD-323F package. UDZSTE-176.2B specifies ±2% voltage tolerance. UDZVTE-176.2B does not specify tolerance. UDZVFHTE-176.2B specifies ±2.18% tolerance and includes automotive-grade qualification (AEC-Q101) with maximum junction temperature of 150°C. Selection depends on tolerance requirements and automotive qualification necessity.

Q: Are TFZVTR6.2B and TFZGTR6.2B interchangeable?

A: Both parts share identical electrical specifications (6.2 V, 500 mW, 10 Ω impedance) and operating temperature range (-55°C to 150°C). The primary difference is package designation: TFZGTR6.2B uses TUMD2 package, while TFZVTR6.2B uses TUMD2M package. These represent different supplier device packages from Rohm Semiconductor. Verify PCB footprint compatibility before selection, as package variants may have dimensional differences.

Q: Why does YFZVFHTR6.2B show 6.12 V instead of 6.2 V?

A: YFZVFHTR6.2B specifies 6.12 V nominal with ±2.53% tolerance. The tolerance range encompasses 6.2 V within acceptable limits. This part is automotive-qualified (AEC-Q101) and rated for 500 mW. Use this part only if the application circuit can tolerate the 6.12 V nominal specification and automotive qualification is required.

Q: What is the impact of impedance differences between substitute parts?

A: The original DZ2J062M0L specifies 30 Ω maximum impedance. Substitute parts UDZSTE-176.2B, UDZVTE-176.2B, and UDZVFHTE-176.2B specify 60 Ω maximum impedance, which is higher. MM3Z6V2ST1G, TFZVTR6.2B, and TFZGTR6.2B specify 10 Ω maximum impedance, which is lower. Lower impedance provides better voltage regulation and faster transient response. Higher impedance may affect circuit performance in applications requiring tight voltage regulation. Circuit simulation or testing is necessary to confirm suitability for specific applications.

Q: Are all substitute parts RoHS compliant?

A: Yes. All listed substitute parts are ROHS3 compliant. The original DZ2J062M0L is RoHS compliant. All parts carry REACH Unaffected status where specified.

Q: What is the moisture sensitivity level for all parts?

A: All parts, including the original DZ2J062M0L and all substitutes, carry MSL 1 (Unlimited) moisture sensitivity rating, indicating no moisture sensitivity restrictions for storage and handling.

Q: Can I use a higher power-rated part (300 mW or 500 mW) in place of the 200 mW original?

A: Yes, higher power-rated parts are suitable substitutes provided all other electrical parameters (voltage, tolerance, impedance, leakage current) meet circuit requirements. Higher power rating provides additional thermal margin and does not degrade circuit performance. However, PCB layout and thermal management design must accommodate the different package footprint if applicable.

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