DZ2J03300L Equivalent & Substitute Parts

Part Overview

The DZ2J03300L is a 3.3 V Zener diode rated at 200 mW, manufactured by Panasonic Electronic Components in the SMini2-F5-B surface mount package. This component is classified as discontinued at DiGi Electronics, indicating that direct procurement of the original part number may face availability constraints. Zener diodes in this voltage and power rating are used for voltage regulation, overvoltage protection, and reference voltage applications in electronic circuits. Identifying equivalent and substitute parts ensures design continuity and supply chain reliability when the primary part becomes unavailable.

Substiute Parts

DZ2J03300L
Panasonic Electronic ComponentsIn Stock: 3027DZ2J03300L Datasheet
DZ2J03300L
Current Part
PZU3.3B,115
NXP USA Inc.In Stock: 1194609PZU3.3B,115 Datasheet
PZU3.3B,115
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TFZVTR3.3B
Rohm SemiconductorIn Stock: 116158TFZVTR3.3B Datasheet
TFZVTR3.3B
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UDZVFHTE-173.3B
Rohm SemiconductorIn Stock: 6938UDZVFHTE-173.3B Datasheet
UDZVFHTE-173.3B
Similar
UDZVTE-173.3B
Rohm SemiconductorIn Stock: 20920UDZVTE-173.3B Datasheet
UDZVTE-173.3B
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YFZVFHTR3.3B
Rohm SemiconductorIn Stock: 3786YFZVFHTR3.3B Datasheet
YFZVFHTR3.3B
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Key Parameters

Parameter Value Unit
Voltage - Zener (Nom) 3.3 V
Power - Max 200 mW
Tolerance ±5% -
Impedance (Max) 130 Ohms
Current - Reverse Leakage @ Vr 20 µA @ 1 V
Voltage - Forward (Vf) (Max) @ If 1 V @ 10 mA
Mounting Type Surface Mount -
Package / Case SC-90, SOD-323F -
RoHS Status RoHS Compliant -
Moisture Sensitivity Level 1 (Unlimited) -

Substitute Part Grouping Explanation

Substitution of the DZ2J03300L is determined by the following critical parameters:

Primary Substitution Criteria:

  • Zener voltage: 3.3 V nominal (tolerance variations acceptable within circuit design margins)
  • Power dissipation rating: minimum 200 mW
  • Mounting type: Surface Mount
  • Package compatibility: SC-90 or SOD-323F footprint
  • RoHS compliance status

Secondary Compatibility Factors:

  • Impedance (Zzt): Lower impedance values indicate better voltage regulation characteristics
  • Reverse leakage current: Consistent at 20 µA @ 1 V across all candidates
  • Moisture sensitivity: MSL 1 (Unlimited) across all candidates

Substitute parts are grouped into two categories based on package type and power rating:

Category A - Direct Package Match (SC-90/SOD-323F): Parts maintaining the original package footprint with equivalent or higher power ratings.

Category B - Enhanced Performance (Higher Power Rating): Parts with superior power dissipation capability, suitable for applications requiring thermal margin or higher current handling.

Parameter Comparison

Parameter DZ2J03300L (Main) PZU3.3B,115 TFZVTR3.3B UDZVFHTE-173.3B UDZVTE-173.3B YFZVFHTR3.3B
Manufacturer Panasonic NXP USA Inc. Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor Rohm Semiconductor
Voltage - Zener (Nom) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.43 V
Power - Max 200 mW 310 mW 500 mW 200 mW 200 mW 500 mW
Tolerance ±5% - - ±3.18% - ±3.07%
Impedance (Max) 130 Ohms - 70 Ohms 120 Ohms - 70 Ohms
Current - Reverse Leakage @ Vr 20 µA @ 1 V - 20 µA @ 1 V 20 µA @ 1 V - 20 µA @ 1 V
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case SC-90, SOD-323F SOD323F 2-SMD, Flat Lead SC-90, SOD-323F SC-90, SOD-323F 2-SMD, Flat Lead
Product Status Discontinued Active Active Active Active Active
RoHS Status RoHS Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) - 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
Automotive Grade - - - AEC-Q101 - AEC-Q101

Engineering Selection Recommendations

For Direct Replacement (Identical Footprint and Power Rating):

UDZVTE-173.3B and UDZVFHTE-173.3B are the primary substitutes for the DZ2J03300L. Both parts maintain the SC-90/SOD-323F package footprint and 200 mW power rating, ensuring mechanical and thermal compatibility with existing PCB designs. UDZVTE-173.3B is available in higher quantity (20,830 pcs) and carries active product status. UDZVFHTE-173.3B includes AEC-Q101 automotive qualification and tighter tolerance (±3.18%), making it suitable for applications requiring enhanced reliability or automotive compliance.

For Enhanced Thermal Performance:

TFZVTR3.3B and YFZVFHTR3.3B offer 500 mW power ratings, providing 2.5× thermal margin over the original specification. These parts use the TUMD2M package (2-SMD, Flat Lead) and require PCB layout modification. TFZVTR3.3B maintains the 3.3 V nominal voltage with active status and 116,100 pcs inventory. YFZVFHTR3.3B includes AEC-Q101 automotive qualification but operates at 3.43 V nominal, introducing a 3% voltage offset that may require circuit evaluation.

For Intermediate Power Rating:

PZU3.3B,115 from NXP USA Inc. provides 310 mW power dissipation in the SOD323F package, offering a middle-ground option between the original 200 mW and enhanced 500 mW alternatives. This part maintains the 3.3 V nominal voltage and carries the highest inventory availability (1,194,553 pcs).

Compliance Considerations:

All substitute parts carry ROHS3 compliance and REACH Unaffected status, meeting current environmental and regulatory requirements. Parts designated with AEC-Q101 qualification (UDZVFHTE-173.3B and YFZVFHTR3.3B) are suitable for automotive and high-reliability applications.

Frequently Asked Questions (FAQ)

Q: Can YFZVFHTR3.3B be used as a direct replacement for DZ2J03300L?

A: YFZVFHTR3.3B operates at 3.43 V nominal voltage, which is 3% higher than the DZ2J03300L specification of 3.3 V. While both parts share the same reverse leakage current and impedance characteristics, the voltage difference may affect circuit performance in precision voltage regulation or reference applications. Circuit evaluation is required to confirm compatibility.

Q: What is the difference between UDZVTE-173.3B and UDZVFHTE-173.3B?

A: Both parts maintain identical 3.3 V nominal voltage, 200 mW power rating, and SC-90/SOD-323F package. UDZVFHTE-173.3B includes tighter tolerance (±3.18% vs. unspecified), AEC-Q101 automotive qualification, and maximum junction temperature specification (150°C TJ). UDZVTE-173.3B provides the same core functionality with broader temperature range specification (-55°C ~ 150°C). Selection depends on application requirements for tolerance precision and automotive compliance.

Q: Are TFZVTR3.3B and YFZVFHTR3.3B pin-compatible with the original DZ2J03300L?

A: Both parts use the TUMD2M package (2-SMD, Flat Lead), which differs from the original SC-90/SOD-323F footprint. While both are surface mount Zener diodes with identical pin count and polarity, PCB layout modification is required. Verify footprint compatibility with design tools before implementation.

Q: Which substitute offers the best inventory availability?

A: PZU3.3B,115 from NXP USA Inc. carries the highest inventory level at 1,194,553 pcs. UDZVTE-173.3B from Rohm Semiconductor provides the second-highest availability at 20,830 pcs with direct package compatibility to the original part.

Q: Can I use a 500 mW Zener diode in place of a 200 mW part?

A: Yes. Higher power rating Zener diodes (TFZVTR3.3B and YFZVFHTR3.3B at 500 mW) are functionally compatible with 200 mW applications. The higher power rating provides thermal margin and improved reliability under transient conditions. However, package footprint differences require PCB modification. Verify thermal design and circuit layout compatibility before substitution.

Q: What does RoHS3 compliance mean compared to RoHS Compliant?

A: Both designations indicate compliance with Restriction of Hazardous Substances regulations. RoHS3 represents the current regulatory standard (Directive 2011/65/EU as amended). All substitute parts meet current environmental compliance requirements for commercial and industrial applications.

Q: Is moisture sensitivity a concern for these Zener diodes?

A: All parts, including the original DZ2J03300L and all substitutes, carry MSL 1 (Unlimited) rating. This indicates no moisture sensitivity restrictions during storage, handling, or assembly. Standard PCB assembly processes and storage conditions are acceptable without special precautions.

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