DTD143ECT216 Equivalent & Substitute Parts Reference

Part Overview

The DTD143ECT216 from Rohm Semiconductor is a pre-biased NPN bipolar junction transistor (BJT) designed for general signal amplification and switching, housed in a compact surface mount package (TO-236-3, SC-59, SOT-23-3; supplier device package: SST3). Key attributes include 50 V collector-emitter voltage, 500 mA collector current, matched integrated bias resistors (4.7 kΩ each for R1 and R2), and 200 mW power dissipation. The part is not for new designs, prompting the need to select suitable equivalent or substitute models that conform strictly to defined electrical, mechanical, and compliance specifications.

Key Parameters

Parameter	Value
Transistor Type	NPN - Pre-Biased
Current - Collector (Ic) (Max)	500 mA
Voltage - Collector Emitter Breakdown (Max)	50 V
Resistor - Base (R1)	4.7 kΩ
Resistor - Emitter Base (R2)	4.7 kΩ
DC Current Gain (hFE) (Min) @ Ic, Vce	47 @ 50 mA, 5 V
Vce Saturation (Max) @ Ib, Ic	300 mV @ 2.5 mA, 50 mA
Current - Collector Cutoff (Max)	500 nA
Frequency - Transition	200 MHz
Power - Max	200 mW
Mounting Type	Surface Mount
Package / Case	TO-236-3, SC-59, SOT-23-3
Supplier Device Package	SST3
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected

Substitute Part Grouping Explanation

Equivalent and substitute selections are based strictly on the following key parameters: transistor type, maximum collector current (Ic), maximum collector-emitter breakdown voltage (Vce), integrated bias resistor values (R1/R2), minimum DC current gain (hFE), Vce saturation voltage at specified conditions, collector cutoff current, transition frequency, maximum power rating, surface mount compatibility, and matching package outline. Compliance with RoHS, REACH, and MSL requirements is also maintained for functional and regulatory equivalence.

Parameter Comparison

Manufacturer Part Number	Manufacturer	Transistor Type	Ic (Max)	Vce Breakdown (Max)	R1	R2	hFE (Min) @ Ic,Vce	Vce(sat) (Max) @ Ib,Ic	Collector Cutoff (Max)	fT	Power (Max)	Mounting Type	Package / Case	Supplier Device Package	RoHS Status	MSL	REACH Status
DTD143ECT216	Rohm Semiconductor	NPN - Pre-Biased	500 mA	50 V	4.7 kΩ	4.7 kΩ	47 @ 50 mA, 5 V	300 mV @ 2.5 mA, 50 mA	500 nA	200 MHz	200 mW	Surface Mount	TO-236-3, SC-59, SOT-23-3	SST3	ROHS3 Compliant	1 (Unlimited)	REACH Unaffected
PDTD143ETR	Nexperia USA Inc.	NPN - Pre-Biased	500 mA	50 V	4.7 kΩ	4.7 kΩ	60 @ 50 mA, 5 V	100 mV @ 2.5 mA, 50 mA	500 nA	225 MHz	320 mW	Surface Mount	TO-236-3, SC-59, SOT-23-3	TO-236AB	ROHS3 Compliant	1 (Unlimited)	REACH Unaffected
PDTD143ETVL	Nexperia USA Inc.	NPN - Pre-Biased	500 mA	50 V	4.7 kΩ	4.7 kΩ	60 @ 50 mA, 5 V	100 mV @ 2.5 mA, 50 mA	500 nA	225 MHz	320 mW	Surface Mount	TO-236-3, SC-59, SOT-23-3	TO-236AB	ROHS3 Compliant	1 (Unlimited)	REACH Unaffected

Engineering Selection Recommendations

When selecting substitutes for the DTD143ECT216, consider only parts with equivalent or superior product status. Ensure substitute models, such as PDTD143ETR and PDTD143ETVL, provide matching compliance with ROHS3, REACH, and MSL 1 (Unlimited) standards.

Frequently Asked Questions (FAQ)

Q: Which electrical parameters are critical for selecting substitute parts for DTD143ECT216?
A: The critical parameters are transistor type, maximum collector current, maximum collector-emitter breakdown voltage, integrated base and emitter bias resistor values, minimum DC current gain, Vce saturation voltage, cutoff current, transition frequency, and maximum power rating.

Q: Are the substitute parts PDTD143ETR and PDTD143ETVL compatible in terms of land pattern and package outline?
A: Yes, these substitutes share the same surface mount type and package/case outline: TO-236-3, SC-59, SOT-23-3.

Q: Is compliance with RoHS and REACH standards maintained among the substitute parts?
A: All listed substitutes are ROHS3 compliant and REACH unaffected.

Q: Can substitute devices be mixed in the same production run with DTD143ECT216?
A: Substitute parts have matching electrical parameters, compliance, and package compatibility, supporting drop-in replacement in compatible designs.

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