DSPIC33FJ256GP710T-I/PF Equivalent & Substitute Parts

Part Overview

The DSPIC33FJ256GP710T-I/PF is a 16-bit digital signal processor microcontroller from Microchip Technology's dsPIC™ 33F series. This embedded processor operates at 40 MIPs with 256KB of FLASH program memory and 30KB of RAM, designed for applications requiring signal processing capabilities combined with standard microcontroller functionality. The device is currently in active production status and is RoHS3 compliant. Substitute parts are identified when packaging or inventory configurations differ while maintaining identical electrical and mechanical specifications.

Key Parameters

Parameter	Value
Core Processor	dsPIC
Core Size	16-Bit
Speed	40 MIPs
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
RAM Size	30K x 8
Number of I/O	85
Voltage Supply (Vcc/Vdd)	3V ~ 3.6V
Data Converters	A/D 32x10b/12b
Connectivity	CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals	AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Package / Case	100-TQFP (14x14)
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 85°C (TA)
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the DSPIC33FJ256GP710T-I/PF are identified based on strict equivalence of the following critical parameters:

Core processor architecture (dsPIC)
Core size (16-Bit)
Processing speed (40 MIPs)
Program memory capacity and type (256KB FLASH)
RAM capacity (30K x 8)
I/O count (85 pins)
Supply voltage range (3V ~ 3.6V)
Package type and dimensions (100-TQFP, 14x14mm)
Connectivity interfaces (CANbus, I2C, IrDA, LINbus, SPI, UART/USART)
Peripheral feature set (AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT)
Data converter specifications (A/D 32x10b/12b)
Operating temperature range (-40°C ~ 85°C)
Compliance certifications (RoHS3, REACH Unaffected)

Substitution is valid only when all parameters remain identical. Differences in packaging configuration (Cut Tape vs. Tray) do not affect electrical or mechanical compatibility.

Parameter Comparison

Parameter	DSPIC33FJ256GP710T-I/PF (Main)	DSPIC33FJ256GP710-I/PF (Substitute)
Manufacturer	Microchip Technology	Microchip Technology
Series	dsPIC™ 33F	dsPIC™ 33F
Core Processor	dsPIC	dsPIC
Core Size	16-Bit	16-Bit
Speed	40 MIPs	40 MIPs
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
RAM Size	30K x 8	30K x 8
Number of I/O	85	85
Voltage Supply (Vcc/Vdd)	3V ~ 3.6V	3V ~ 3.6V
Data Converters	A/D 32x10b/12b	A/D 32x10b/12b
Connectivity	CANbus, I2C, IrDA, LINbus, SPI, UART/USART	CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals	AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT	AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Package / Case	100-TQFP (14x14)	100-TQFP (14x14)
Mounting Type	Surface Mount	Surface Mount
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Product Status	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected
Packaging Configuration	Cut Tape (CT) & Digi-Reel®	Tray

Engineering Selection Recommendations

Both the DSPIC33FJ256GP710T-I/PF and DSPIC33FJ256GP710-I/PF are functionally equivalent devices from Microchip Technology's active product line. Selection between these parts should be based on supply chain requirements and packaging preferences:

The main part (DSPIC33FJ256GP710T-I/PF) is supplied in Cut Tape and Digi-Reel® packaging configurations, suitable for automated pick-and-place assembly operations. The substitute part (DSPIC33FJ256GP710-I/PF) is supplied in Tray packaging, appropriate for manual handling or alternative assembly workflows.

Both devices maintain identical electrical specifications, mechanical dimensions, and compliance certifications. The choice between them does not affect circuit design, PCB layout, or firmware compatibility. Selection should align with manufacturing process requirements and inventory management practices.

Frequently Asked Questions (FAQ)

Q: Are these parts pin-compatible? A: Yes. Both parts use the 100-TQFP (14x14mm) package with identical pin assignments, voltage requirements, and I/O configurations. No PCB redesign is required when substituting between these parts.

Q: What is the difference between Cut Tape and Tray packaging? A: Cut Tape (CT) and Digi-Reel® packaging are used for automated assembly lines with tape-and-reel feeders. Tray packaging is used for manual assembly or alternative handling methods. The electrical and mechanical specifications of the device remain unchanged regardless of packaging format.

Q: Can I use these parts interchangeably in my design? A: Yes. The DSPIC33FJ256GP710T-I/PF and DSPIC33FJ256GP710-I/PF are electrically and mechanically identical. Firmware, circuit design, and PCB layout require no modifications when substituting between these parts.

Q: Are both parts RoHS3 compliant? A: Yes. Both the main part and substitute part are RoHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the operating temperature range for both parts? A: Both parts operate across the temperature range of -40°C to 85°C (TA), suitable for industrial and commercial applications.

Q: Do both parts have the same memory configuration? A: Yes. Both parts feature 256KB of FLASH program memory and 30KB of RAM, with identical data converter specifications (A/D 32x10b/12b) and peripheral feature sets.

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