DSPIC33FJ256GP710AT-I/PF Equivalent & Substitute Parts

Part Overview

The DSPIC33FJ256GP710AT-I/PF is a 16-bit dsPIC microcontroller from Microchip Technology's dsPIC™ 33F series, designed for embedded applications requiring digital signal processing capabilities. This device features 256KB of FLASH program memory, 30KB of RAM, and operates at 40 MIPs with integrated connectivity options including CANbus, I2C, IrDA, LINbus, SPI, and UART/USART. The part is currently in active production status. Substitute parts are identified to provide alternative sourcing options when the primary part number is unavailable or when packaging requirements differ.

Substiute Parts

DSPIC33FJ256GP710AT-I/PF

Microchip TechnologyIn Stock: 908DSPIC33FJ256GP710AT-I/PF Datasheet

Current PartRFQ

DSPIC33FJ256GP710A-I/PF

Microchip TechnologyIn Stock: 1966DSPIC33FJ256GP710A-I/PF Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the DSPIC33FJ256GP710AT-I/PF is determined by strict equivalence across the following critical parameters:

• Core processor architecture (dsPIC)
• Core size (16-Bit)
• Processing speed (40 MIPs)
• Program memory capacity (256KB FLASH)
• RAM capacity (30K x 8)
• Supply voltage range (3V ~ 3.6V)
• Package type (100-TQFP 14x14)
• I/O count (85 pins)
• Data converter specifications (A/D 32x10b/12b)
• Connectivity features (CANbus, I2C, IrDA, LINbus, SPI, UART/USART)
• Peripheral set (AC'97, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT)
• Operating temperature range (-40°C ~ 85°C)
• RoHS compliance (ROHS3)

The primary difference between the main part and identified substitutes is the packaging format (Tape & Reel versus Tray) and product verification status, which do not affect electrical or functional performance.

Parameter Comparison

Engineering Selection Recommendations

Both the DSPIC33FJ256GP710AT-I/PF and DSPIC33FJ256GP710A-I/PF are active production parts from Microchip Technology with identical electrical specifications and functional capabilities. Selection between these parts should be based on packaging and supply chain requirements:

The DSPIC33FJ256GP710AT-I/PF in Tape & Reel format is suitable for high-volume automated assembly operations. The DSPIC33FJ256GP710A-I/PF in Tray packaging provides flexibility for lower-volume applications or manual assembly processes. Both parts maintain ROHS3 compliance and identical operating parameters across temperature, voltage, and performance specifications. Inventory availability and procurement lead times may influence selection between these equivalent options.

Frequently Asked Questions (FAQ)

Q: Are DSPIC33FJ256GP710AT-I/PF and DSPIC33FJ256GP710A-I/PF electrically identical?

A: Yes. Both parts share identical core specifications including processor architecture, memory configuration, speed rating, I/O count, and peripheral set. Electrical performance and functional behavior are equivalent.

Q: What is the difference between Tape & Reel and Tray packaging?

A: Tape & Reel packaging is optimized for automated pick-and-place assembly in high-volume manufacturing. Tray packaging is used for manual handling, lower-volume production, or component storage. The packaging format does not affect the electrical or functional characteristics of the microcontroller.

Q: Can I substitute DSPIC33FJ256GP710A-I/PF for DSPIC33FJ256GP710AT-I/PF in my design?

A: Yes, provided your assembly process and supply chain requirements accommodate the Tray packaging format. The electrical specifications, pin configuration, and functional performance are identical.

Q: Are both parts RoHS compliant?

A: Yes. Both DSPIC33FJ256GP710AT-I/PF and DSPIC33FJ256GP710A-I/PF are ROHS3 compliant and REACH unaffected.

Q: What is the Moisture Sensitivity Level (MSL) for these parts?

A: Both parts have an MSL rating of 3 with a 168-hour floor life requirement.