DSPIC30F6012-20I/PF Equivalent & Substitute Parts

Part Overview

The DSPIC30F6012-20I/PF is a 16-bit dsPIC microcontroller from Microchip Technology's dsPIC 30F series, featuring 144KB of FLASH program memory, 8KB of RAM, and 4KB of EEPROM. This device operates at 20 MIPS and integrates multiple communication interfaces including CANbus, I2C, SPI, and UART/USART, along with advanced peripherals such as PWM, watchdog timer, and brown-out detection. The part is classified as obsolete, making equivalent substitutes necessary for ongoing production and maintenance applications. The primary substitute identified maintains identical core architecture and pinout while offering enhanced performance specifications.

Substiute Parts

DSPIC30F6012-20I/PF
Microchip TechnologyIn Stock: 1287DSPIC30F6012-20I/PF Datasheet
DSPIC30F6012-20I/PF
Current Part
DSPIC30F6012A-30I/PF
Microchip TechnologyIn Stock: 2404DSPIC30F6012A-30I/PF Datasheet
DSPIC30F6012A-30I/PF
Direct

Key Parameters

Parameter Value
Core Processor dsPIC
Core Size 16-Bit
Speed 20 MIPS
Program Memory Size 144KB (48K x 24)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 8K x 8
Number of I/O 52
Voltage Supply (Vcc/Vdd) 2.5V ~ 5.5V
Data Converters A/D 16x12b
Package / Case 64-TQFP (14x14)
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)

Substitute Part Grouping Explanation

The DSPIC30F6012A-30I/PF qualifies as a direct substitute based on the following critical parameters:

Identical Parameters:

  • Core processor architecture (dsPIC)
  • Core size (16-Bit)
  • Program memory capacity (144KB / 48K x 24)
  • Program memory type (FLASH)
  • EEPROM size (4K x 8)
  • RAM size (8K x 8)
  • Number of I/O pins (52)
  • Voltage supply range (2.5V ~ 5.5V)
  • Data converter specification (A/D 16x12b)
  • Package type (64-TQFP 14x14)
  • Mounting type (Surface Mount)
  • Operating temperature range (-40°C ~ 85°C)
  • Connectivity interfaces (CANbus, I2C, SPI, UART/USART)
  • Peripheral set (AC'97, Brown-out Detect/Reset, I2S, LVD, POR, PWM, WDT)

Differentiation:

  • Speed: DSPIC30F6012A-30I/PF operates at 30 MIPS versus 20 MIPS for the original part
  • Product status: DSPIC30F6012A-30I/PF is Active versus Obsolete
  • Packaging format: Tray versus unspecified for original

The higher clock speed of the substitute part represents an enhancement that maintains full backward compatibility while providing improved performance headroom.

Parameter Comparison

Parameter DSPIC30F6012-20I/PF DSPIC30F6012A-30I/PF
Manufacturer Microchip Technology Microchip Technology
Series dsPIC™ 30F dsPIC™ 30F
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 20 MIPS 30 MIPS
Program Memory Size 144KB (48K x 24) 144KB (48K x 24)
Program Memory Type FLASH FLASH
EEPROM Size 4K x 8 4K x 8
RAM Size 8K x 8 8K x 8
Number of I/O 52 52
Voltage Supply (Vcc/Vdd) 2.5V ~ 5.5V 2.5V ~ 5.5V
Data Converters A/D 16x12b A/D 16x12b
Connectivity CANbus, I2C, SPI, UART/USART CANbus, I2C, SPI, UART/USART
Peripherals AC'97, Brown-out Detect/Reset, I2S, LVD, POR, PWM, WDT AC'97, Brown-out Detect/Reset, I2S, LVD, POR, PWM, WDT
Package / Case 64-TQFP (14x14) 64-TQFP (14x14)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The DSPIC30F6012A-30I/PF is the appropriate substitute for the obsolete DSPIC30F6012-20I/PF. Both devices maintain identical electrical and mechanical specifications across all critical parameters, ensuring direct compatibility at the board level. The substitute part carries Active product status, ensuring long-term availability and supply chain continuity. Both parts maintain equivalent compliance certifications including ROHS3 and REACH Unaffected status, with identical moisture sensitivity levels. The enhanced 30 MIPS performance of the substitute part provides additional processing capability without introducing any compatibility concerns, as the instruction set and peripheral architecture remain unchanged. Selection of the DSPIC30F6012A-30I/PF eliminates obsolescence risk while maintaining full functional equivalence.

Frequently Asked Questions (FAQ)

Q: Can the DSPIC30F6012A-30I/PF directly replace the DSPIC30F6012-20I/PF in existing designs?

A: Yes. Both parts share identical pinout (64-TQFP), package dimensions (14x14mm), voltage specifications (2.5V ~ 5.5V), memory architecture (144KB FLASH, 8KB RAM, 4KB EEPROM), I/O count (52 pins), and peripheral set. No board redesign or firmware modification is required for substitution.

Q: What is the primary difference between these two parts?

A: The DSPIC30F6012A-30I/PF operates at 30 MIPS compared to 20 MIPS for the original part. This represents a performance enhancement with no impact on compatibility. The substitute part also carries Active product status versus Obsolete for the original.

Q: Are there any compliance or certification differences?

A: No. Both parts maintain identical RoHS3 compliance, REACH Unaffected status, and moisture sensitivity level (MSL 3, 168 hours). Regulatory and environmental compliance requirements are equivalent.

Q: What is the significance of the product status difference?

A: The DSPIC30F6012-20I/PF is classified as Obsolete, indicating discontinued production and limited future availability. The DSPIC30F6012A-30I/PF maintains Active status, ensuring ongoing manufacturing and supply chain support for current and future production requirements.

Q: Are the communication interfaces identical?

A: Yes. Both parts provide identical connectivity: CANbus, I2C, SPI, and UART/USART interfaces. Peripheral features including PWM, watchdog timer, brown-out detection, and analog-to-digital conversion (16x12-bit) are functionally equivalent.

Q: Does the higher speed of the substitute part affect power consumption?

A: This document addresses electrical and mechanical parameter equivalence only. Power consumption characteristics require detailed datasheet analysis beyond the scope of substitution parameter comparison.

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