DSPIC30F2011T-20I/SO Equivalent & Substitute Parts

Part Overview

The DSPIC30F2011T-20I/SO is a 16-bit dsPIC microcontroller from Microchip Technology's dsPIC 30F series, designed for embedded applications requiring digital signal processing capabilities. This device integrates 12KB of FLASH program memory, 1KB of RAM, and a 20 MIPS execution speed within an 18-SOIC surface mount package. The part is classified as obsolete, making identification of active equivalent components essential for ongoing production support and design continuity.

Substiute Parts

DSPIC30F2011T-20I/SO
Microchip TechnologyIn Stock: 18709DSPIC30F2011T-20I/SO Datasheet
DSPIC30F2011T-20I/SO
Current Part
DSPIC30F2011-20I/SO
Microchip TechnologyIn Stock: 6690DSPIC30F2011-20I/SO Datasheet
DSPIC30F2011-20I/SO
Direct

Key Parameters

Parameter Value
Core Processor dsPIC
Core Size 16-Bit
Speed 20 MIPS
Program Memory Size 12KB (4K x 24)
Program Memory Type FLASH
RAM Size 1K x 8
Voltage Supply (Vcc/Vdd) 2.5V ~ 5.5V
Data Converters A/D 8x12b
Number of I/O 12
Connectivity I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Mounting Type Surface Mount
Package 18-SOIC (0.295", 7.50mm Width)
Operating Temperature -40°C ~ 85°C (TA)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the DSPIC30F2011T-20I/SO is determined by strict equivalence across the following critical parameters:

  • Core Architecture: dsPIC 16-bit processor
  • Performance: 20 MIPS execution speed
  • Memory Configuration: 12KB FLASH program memory (4K x 24), 1KB RAM
  • Analog Capability: 8-channel 12-bit A/D converter
  • Interface Protocols: I2C, SPI, UART/USART support
  • Peripheral Set: Brown-out Detect/Reset, Power-on Reset, PWM, Watchdog Timer
  • I/O Count: 12 I/O pins
  • Electrical Specifications: 2.5V to 5.5V supply voltage range
  • Package Format: 18-SOIC surface mount package
  • Temperature Range: -40°C to 85°C operating specification
  • Compliance: ROHS3 and REACH requirements

Substitute parts must match all parameters listed above. Variations in any single parameter disqualify a part from direct substitution.

Parameter Comparison

Parameter DSPIC30F2011T-20I/SO (Main Part) DSPIC30F2011-20I/SO (Substitute)
Manufacturer Microchip Technology Microchip Technology
Series dsPIC™ 30F dsPIC™ 30F
Core Processor dsPIC dsPIC
Core Size 16-Bit 16-Bit
Speed 20 MIPS 20 MIPS
Program Memory Size 12KB (4K x 24) 12KB (4K x 24)
Program Memory Type FLASH FLASH
RAM Size 1K x 8 1K x 8
Voltage Supply (Vcc/Vdd) 2.5V ~ 5.5V 2.5V ~ 5.5V
Data Converters A/D 8x12b A/D 8x12b
Number of I/O 12 12
Connectivity I2C, SPI, UART/USART I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Mounting Type Surface Mount Surface Mount
Package / Case 18-SOIC (0.295", 7.50mm Width) 18-SOIC (0.295", 7.50mm Width)
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
Product Status Obsolete Active
Packaging Type Not specified Tube

Engineering Selection Recommendations

The DSPIC30F2011-20I/SO serves as the direct functional equivalent to the obsolete DSPIC30F2011T-20I/SO. Both parts are manufactured by Microchip Technology and share identical electrical, functional, and mechanical specifications. The primary distinction is product status: the main part is classified as obsolete, while the substitute is active in production.

The substitute part maintains full compliance with ROHS3 and REACH regulatory requirements. Both devices support identical supply voltage ranges (2.5V to 5.5V) and operate across the same temperature specification (-40°C to 85°C). Pin configuration, package dimensions, and peripheral functionality are identical, enabling direct replacement in existing designs without circuit modification.

The substitute part is available in Tube packaging, providing standard component handling and storage compatibility with automated assembly processes.

Frequently Asked Questions (FAQ)

Q: Can DSPIC30F2011-20I/SO directly replace DSPIC30F2011T-20I/SO in production?

A: Yes. Both parts are electrically and mechanically identical. The substitute part is active in production and maintains all functional specifications, memory configuration, I/O count, and peripheral capabilities of the obsolete part.

Q: Are there differences in pin configuration between these parts?

A: No. Both parts use the 18-SOIC package with identical pin assignments, voltage specifications, and I/O functionality. No PCB redesign is required.

Q: What is the significance of the product status difference?

A: The main part (DSPIC30F2011T-20I/SO) is classified as obsolete and is no longer manufactured. The substitute part (DSPIC30F2011-20I/SO) is active and available from Microchip Technology, ensuring long-term supply continuity for new production runs and design updates.

Q: Do both parts meet the same regulatory compliance standards?

A: Yes. Both parts are ROHS3 compliant and REACH unaffected. Moisture sensitivity level is identical at MSL 1 (Unlimited), indicating no special storage or handling requirements.

Q: Is the packaging difference significant for assembly?

A: The substitute part is supplied in Tube packaging, which is standard for surface mount components in automated assembly environments. This packaging format is compatible with standard pick-and-place equipment and component feeders.

Q: Are the memory specifications identical?

A: Yes. Both parts feature 12KB FLASH program memory (4K x 24), 1KB RAM, and 8-channel 12-bit A/D conversion. No firmware modifications are required when substituting between these parts.

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