DSP56F805FV80 Equivalent & Substitute Parts

Part Overview

The DSP56F805FV80 is a 16-bit embedded microcontroller from NXP USA Inc. based on the 56800 core processor architecture. This device integrates 64KB of FLASH program memory, 2K x 16 RAM, and operates at 80MHz with a 3V to 3.6V supply voltage. The part features CANbus, EBI/EMI, SCI, and SPI connectivity options, along with integrated PWM, watchdog timer, and power-on reset functionality.

The DSP56F805FV80 is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support long-term product maintenance where original inventory is depleted or procurement becomes impractical.

Substiute Parts

DSP56F805FV80
NXP USA Inc.In Stock: 2024DSP56F805FV80 Datasheet
DSP56F805FV80
Current Part
DSP56F805FV80E
NXP USA Inc.In Stock: 2712DSP56F805FV80E Datasheet
DSP56F805FV80E
Direct

Key Parameters

Parameter Value
Core Processor 56800
Core Size 16-Bit
Speed 80MHz
Program Memory Size 64KB (32K x 16)
Program Memory Type FLASH
RAM Size 2K x 16
Voltage Supply (Vcc/Vdd) 3V ~ 3.6V
Number of I/O 32
Data Converters A/D 8x12b
Connectivity CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT
Package / Case 144-LQFP (20x20)
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution eligibility for the DSP56F805FV80 is determined by strict equivalence across the following critical parameters:

  • Core processor architecture (56800)
  • Core size (16-Bit)
  • Operating frequency (80MHz)
  • Program memory capacity and type (64KB FLASH, 32K x 16 organization)
  • RAM capacity (2K x 16)
  • Supply voltage range (3V ~ 3.6V)
  • I/O count (32 pins)
  • Data converter specification (A/D 8x12b)
  • Connectivity interfaces (CANbus, EBI/EMI, SCI, SPI)
  • Peripheral set (POR, PWM, WDT)
  • Package form factor (144-LQFP, 20x20mm)
  • Operating temperature range (-40°C ~ 85°C)

The DSP56F805FV80E meets all substitution criteria. The primary distinction is packaging format (Tray vs. standard) and product status (Active vs. Obsolete), with improved RoHS3 compliance in the substitute part.

Parameter Comparison

Parameter DSP56F805FV80 DSP56F805FV80E
Manufacturer NXP USA Inc. NXP USA Inc.
Series 56F8xx 56F8xx
Core Processor 56800 56800
Core Size 16-Bit 16-Bit
Speed 80MHz 80MHz
Program Memory Size 64KB (32K x 16) 64KB (32K x 16)
Program Memory Type FLASH FLASH
RAM Size 2K x 16 2K x 16
Voltage Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Number of I/O 32 32
Data Converters A/D 8x12b A/D 8x12b
Connectivity CANbus, EBI/EMI, SCI, SPI CANbus, EBI/EMI, SCI, SPI
Peripherals POR, PWM, WDT POR, PWM, WDT
Package / Case 144-LQFP (20x20) 144-LQFP (20x20)
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
Packaging Format Standard Tray

Engineering Selection Recommendations

The DSP56F805FV80E is a direct functional equivalent to the DSP56F805FV80. Both parts share identical electrical specifications, memory architecture, peripheral configuration, and package form factor.

Selection between these parts should be based on the following factors:

  • Product Status: The DSP56F805FV80E carries Active status, ensuring continued manufacturer support and availability. The DSP56F805FV80 is Obsolete, indicating end-of-life status and potential supply constraints.

  • Regulatory Compliance: The DSP56F805FV80E meets ROHS3 compliance requirements, while the DSP56F805FV80 is RoHS non-compliant. For applications subject to RoHS directives or customer compliance mandates, the DSP56F805FV80E is the appropriate selection.

  • Packaging and Logistics: The DSP56F805FV80E is supplied in Tray packaging, which may align with automated assembly workflows. Packaging format does not affect electrical or functional performance.

For new designs or production transitions, the DSP56F805FV80E is the recommended selection. For legacy system maintenance where the original part number is specified, the DSP56F805FV80E provides full functional compatibility with improved compliance status.

Frequently Asked Questions (FAQ)

Q: Are the DSP56F805FV80 and DSP56F805FV80E pin-compatible?

A: Yes. Both parts use the 144-LQFP (20x20mm) package with identical pin assignments, I/O configuration (32 pins), and electrical characteristics. Direct PCB substitution is possible without layout modification.

Q: What is the difference between these two part numbers?

A: The primary differences are product status (Obsolete vs. Active), RoHS compliance level (non-compliant vs. ROHS3 Compliant), and packaging format (standard vs. Tray). All functional and electrical parameters are identical.

Q: Can I use the DSP56F805FV80E as a drop-in replacement for the DSP56F805FV80?

A: Yes. The DSP56F805FV80E is functionally equivalent across all critical parameters: core processor, clock speed, memory capacity and type, I/O count, supply voltage, operating temperature range, and peripheral set. No firmware or hardware modifications are required.

Q: Why is the DSP56F805FV80 marked as Obsolete?

A: Obsolete status indicates the manufacturer has discontinued active production and support. The DSP56F805FV80E remains in active production, making it the preferred choice for ongoing supply chain management.

Q: Does RoHS3 compliance affect performance or functionality?

A: No. RoHS3 compliance relates to material composition and environmental standards, not electrical performance or functional capability. Both parts operate identically within their specified parameters.

Q: What is the significance of the Tray packaging for the DSP56F805FV80E?

A: Tray packaging is a standard format for automated pick-and-place assembly. It does not affect electrical performance or compatibility. Selection between packaging formats depends on manufacturing process requirements and logistics preferences.

Q: Are there any thermal or reliability differences between these parts?

A: No. Both parts share identical operating temperature range (-40°C ~ 85°C), thermal characteristics, and reliability specifications. Moisture sensitivity level (MSL 3, 168 Hours) is the same for both.

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