DSF050J823

Part Overview

The DSF050J823 is a 0.082 µF film capacitor rated for 50V DC operation, manufactured by Cornell Dubilier Electronics (CDE) in the DSF series. This component features a polyester metallized dielectric in a through-hole radial package configuration. The product is currently classified as obsolete, necessitating the identification of functionally equivalent substitute parts for continued system support and new design implementations.

Substiute Parts

DSF050J823

Cornell Dubilier Electronics (CDE)In Stock: 985DSF050J823 Datasheet

Current PartRFQ

ECQ-E2823JB

Panasonic Electronic ComponentsIn Stock: 2570ECQ-E2823JB Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The ECQ-E2823JB from Panasonic Electronic Components qualifies as a direct substitute based on the following alignment of critical electrical and mechanical parameters:

Matched Parameters:

• Capacitance: 0.082 µF (identical)
• Tolerance: ±5% (identical)
• Dielectric Material: Polyester, Metallized (equivalent)
• Mounting Type: Through Hole Radial (identical)
• Lead Spacing: 0.197" (5.00mm) (identical)
• Termination: PC Pins (identical)
• RoHS3 Compliance: Both parts meet ROHS3 requirements

Enhanced Characteristics: The ECQ-E2823JB operates at a higher voltage rating (250V DC) and extended temperature range (-40°C ~ 105°C), providing greater design margin for applications operating within or below the DSF050J823 specifications. This substitution is valid for all circuits originally designed for the DSF050J823 without circuit modification.

Parameter Comparison

Engineering Selection Recommendations

The ECQ-E2823JB is the appropriate substitute for the obsolete DSF050J823. Both components achieve ROHS3 compliance and meet the electrical requirements defined by the 0.082 µF capacitance and ±5% tolerance specification. The Panasonic component's active product status ensures long-term availability and supply chain continuity. The elevated voltage rating provides additional design margin without circuit modification. Footprint verification is required: the ECQ-E2823JB exhibits increased physical dimensions (height of 9.60mm versus 6.00mm), necessitating PCB layout assessment for applications with vertical space constraints. Lead spacing compatibility (0.197" on both components) permits direct pin-to-pin substitution.

Frequently Asked Questions (FAQ)

Q: Can the ECQ-E2823JB replace the DSF050J823 directly on the PCB?

A: Yes, for electrical function. The identical lead spacing of 0.197" (5.00mm) and radial through-hole configuration permit pin-compatible substitution. However, physical height differences (9.60mm versus 6.00mm) require verification against PCB layout constraints, particularly in applications with board-to-enclosure or board-to-component clearance limitations.

Q: Does the higher voltage rating of the ECQ-E2823JB (250V versus 50V) affect circuit performance?

A: No. The substitute operates safely at all voltage levels up to and including its rated maximum. Applications requiring only 50V experience no performance change; the higher rating provides design margin and reduces stress on the component.

Q: Are there differences in temperature performance between these components?

A: The ECQ-E2823JB extends the operating temperature range to 105°C compared to the DSF050J823's 85°C maximum. Both components operate within the same minimum temperature of -40°C. Applications within the original -40°C to 85°C range function identically on both parts.

Q: What are the physical installation considerations?

A: Both components use identical PC pin termination and lead spacing. The substitute is approximately 3.6mm taller (9.60mm seated height versus 6.00mm). Measure available vertical clearance during PCB assembly planning. Width and length differences are minimal and generally do not affect standard PCB layouts.

Q: Why has the DSF050J823 become obsolete?

A: Obsolescence is determined by manufacturer production decisions. The availability of functionally equivalent active alternatives such as the ECQ-E2823JB provides a clear transition path for ongoing system support and new designs.