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DSA30C60PB Equivalent & Substitute Parts
Part Overview
The DSA30C60PB is an IXYS Schottky diode array in a 1 Pair Common Cathode configuration rated for 60 V DC reverse voltage and 15 A average rectified current per diode. This component is mounted through-hole in a TO-220-3 package and is classified as Active product status. The device operates across a junction temperature range of -55°C to 175°C and complies with RoHS3 and REACH standards.
Substitute parts are identified when equivalent electrical performance and mechanical compatibility can be maintained within the specified parameter tolerances for Schottky diode arrays in this voltage and current class.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Diode Configuration | 1 Pair Common Cathode | — |
| Technology | Schottky | — |
| Voltage - DC Reverse (Vr) (Max) | 60 | V |
| Current - Average Rectified (Io) (per Diode) | 15 | A |
| Voltage - Forward (Vf) (Max) @ If | 850 mV @ 15 A | — |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | — |
| Mounting Type | Through Hole | — |
| Package / Case | TO-220-3 | — |
| Operating Temperature - Junction | -55 to 175 | °C |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitution of Schottky diode arrays is determined by the following critical parameters:
Electrical Compatibility Requirements:
- Voltage - DC Reverse (Vr) rating must equal or exceed 60 V
- Current - Average Rectified (Io) per diode must equal or exceed 15 A
- Diode Configuration must be 1 Pair Common Cathode
- Technology must be Schottky
- Speed classification must be Fast Recovery ≤ 500ns, > 200mA (Io)
Mechanical Compatibility Requirements:
- Mounting Type must be Through Hole
- Package / Case must be compatible with TO-220 family footprints
Compliance Requirements:
- RoHS3 Compliant status
- REACH Unaffected status
- Active product status
Substitute parts are grouped into two categories: Similar Manufacturer Parts (reduced current rating but equivalent voltage) and Parametric Equivalents (identical electrical ratings with different package form factor).
Parameter Comparison
| Parameter | DSA30C60PB (IXYS) | STPS20L60CT (STMicroelectronics) | STPS3060CW (STMicroelectronics) |
|---|---|---|---|
| Manufacturer | IXYS | STMicroelectronics | STMicroelectronics |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode | 1 Pair Common Cathode |
| Technology | Schottky | Schottky | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 60 V | 60 V | 60 V |
| Current - Average Rectified (Io) (per Diode) | 15 A | 10 A | 15 A |
| Voltage - Forward (Vf) (Max) @ If | 850 mV @ 15 A | 600 mV @ 10 A | 850 mV @ 15 A |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) |
| Current - Reverse Leakage @ Vr | 500 µA @ 60 V | 350 µA @ 60 V | 150 µA @ 60 V |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Package / Case | TO-220-3 | TO-220-3 | TO-247-3 |
| Operating Temperature - Junction (Max) | 175°C | 150°C | 150°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| REACH Status | REACH Unaffected | REACH Unaffected | REACH Unaffected |
| Product Status | Active | Active | Active |
Engineering Selection Recommendations
STPS3060CW (STMicroelectronics) - Parametric Equivalent:
The STPS3060CW is a parametric equivalent to the DSA30C60PB with identical electrical ratings: 60 V DC reverse voltage, 15 A average rectified current per diode, and 850 mV forward voltage at 15 A. Both devices employ Schottky technology with Fast Recovery characteristics and are mounted through-hole. The primary difference is the package form factor: STPS3060CW uses TO-247-3 versus DSA30C60PB's TO-220-3. Both are RoHS3 Compliant, REACH Unaffected, and Active status. The STPS3060CW exhibits lower reverse leakage current (150 µA versus 500 µA at 60 V) and a maximum junction temperature of 150°C compared to 175°C for the DSA30C60PB. Selection of this substitute requires PCB layout accommodation for the larger TO-247-3 footprint.
STPS20L60CT (STMicroelectronics) - Similar Manufacturer Part:
The STPS20L60CT is a similar manufacturer part with matching 60 V DC reverse voltage and identical package form factor (TO-220-3). The current rating is reduced to 10 A average rectified per diode compared to 15 A for the DSA30C60PB. Forward voltage is lower at 600 mV @ 10 A. Both devices are Schottky technology with Fast Recovery characteristics, RoHS3 Compliant, REACH Unaffected, and Active status. The STPS20L60CT is suitable for applications where the 10 A current rating is sufficient and lower forward voltage drop is beneficial. Maximum junction temperature is 150°C.
Frequently Asked Questions (FAQ)
Q: Can STPS3060CW be used as a direct replacement for DSA30C60PB?
A: The STPS3060CW is electrically equivalent with identical voltage and current ratings. However, it uses a TO-247-3 package instead of TO-220-3. Direct PCB substitution is not possible without layout modification. The larger TO-247-3 footprint requires different mounting holes and trace routing.
Q: What is the difference between the two substitute parts?
A: STPS3060CW is a parametric equivalent with identical 15 A current rating and TO-247-3 package. STPS20L60CT is a similar part with reduced 10 A current rating but maintains the TO-220-3 package form factor. Selection depends on current requirements and available PCB space.
Q: Is the STPS20L60CT suitable for 15 A applications?
A: No. The STPS20L60CT is rated for 10 A average rectified current per diode. Applications requiring 15 A operation must use either the DSA30C60PB or STPS3060CW.
Q: How do the reverse leakage currents compare?
A: DSA30C60PB exhibits 500 µA reverse leakage at 60 V. STPS20L60CT shows 350 µA, and STPS3060CW shows 150 µA at the same voltage. Lower reverse leakage may be advantageous in precision analog circuits.
Q: Are all three parts RoHS3 and REACH compliant?
A: Yes. DSA30C60PB, STPS20L60CT, and STPS3060CW are all RoHS3 Compliant and REACH Unaffected.
Q: What is the maximum junction temperature difference?
A: DSA30C60PB operates to 175°C maximum junction temperature. Both STPS20L60CT and STPS3060CW are rated to 150°C maximum. Applications operating near thermal limits must account for this 25°C difference.
Q: Can package form factor affect thermal performance?
A: Yes. TO-247-3 (STPS3060CW) typically provides better thermal dissipation than TO-220-3 due to larger lead frame and case geometry. TO-220-3 (DSA30C60PB and STPS20L60CT) is more compact but may require additional thermal management in high-power applications.
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