DS280DF810ABVT Equivalent & Substitute Parts

Part Overview

The DS280DF810ABVT is an active buffer and retiming IC manufactured by Texas Instruments, designed for high-speed serial data applications. This 8-channel retimer operates at data rates up to 28.4 Gbps and is housed in a 135-pin fine-pitch ball grid array (FCBGA) package measuring 8.05 x 13.05 mm. The device features input equalization for signal conditioning and CML-level input/output interfaces. With active product status and full RoHS3 compliance, the DS280DF810ABVT serves applications requiring signal integrity maintenance in high-speed interconnect systems. Substitute parts are identified based on matching electrical performance, package specifications, and compliance certifications.

Substiute Parts

DS280DF810ABVT
Texas InstrumentsIn Stock: 7846DS280DF810ABVT Datasheet
DS280DF810ABVT
Current Part
DS280DF810ABVR
Texas InstrumentsIn Stock: 3286DS280DF810ABVR Datasheet
DS280DF810ABVR
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Texas Instruments
Category Interface
Type Buffer, ReDriver
Data Rate (Max) 28.4 Gbps
Number of Channels 8
Input/Output Interface CML
Signal Conditioning Input Equalization
Package Type 135-FCBGA (8.05 x 13.05 mm)
Operating Temperature Range -40°C to 85°C
Mounting Type Surface Mount
Product Status Active
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the DS280DF810ABVT is determined by strict equivalence across the following critical parameters:

  • Data Rate Performance: Maximum 28.4 Gbps operation
  • Channel Configuration: 8-channel architecture
  • Interface Standard: CML input and output levels
  • Signal Processing: Input equalization capability
  • Physical Package: 135-FCBGA form factor with identical dimensions (8.05 x 13.05 mm)
  • Operating Temperature: -40°C to 85°C range
  • Compliance: ROHS3, REACH Unaffected, and EAR99 classification

The DS280DF810ABVR qualifies as a parametric equivalent substitute. Both parts share the same base product number (DS280DF810), identical electrical specifications, and equivalent package specifications. The primary difference is packaging format: the main part is supplied in Tape & Reel (TR) format, while the substitute is available in Cut Tape (CT) & Digi-Reel® format. This distinction affects supply chain logistics and handling but does not impact electrical or mechanical compatibility.

Parameter Comparison

Parameter DS280DF810ABVT (Main) DS280DF810ABVR (Substitute)
Manufacturer Texas Instruments Texas Instruments
Type Buffer, ReDriver Buffer, ReDriver
Data Rate (Max) 28.4 Gbps 28.4 Gbps
Number of Channels 8 8
Input Interface CML CML
Output Interface CML CML
Signal Conditioning Input Equalization Input Equalization
Package / Case 135-BGA Module 135-BGA Module
Supplier Device Package 135-FCBGA (8.05 x 13.05) 135-FCBGA (8.05 x 13.05)
Operating Temperature -40°C to 85°C -40°C to 85°C
Mounting Type Surface Mount Surface Mount
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN Classification EAR99 EAR99
Packaging Format Tape & Reel (TR) Cut Tape (CT) & Digi-Reel®

Engineering Selection Recommendations

Both the DS280DF810ABVT and DS280DF810ABVR are active, production-qualified components from Texas Instruments with identical electrical and mechanical specifications. Selection between these parts should be based on supply chain requirements and packaging format availability:

  • DS280DF810ABVT is appropriate for high-volume manufacturing environments where Tape & Reel packaging supports automated pick-and-place assembly processes.
  • DS280DF810ABVR is suitable for applications requiring Cut Tape or Digi-Reel® packaging formats, which may be preferred for lower-volume production runs or specific assembly workflows.

Both parts meet ROHS3 compliance requirements and carry identical MSL ratings, ensuring equivalent reliability and handling requirements. The selection between these substitutes does not impact circuit performance, thermal characteristics, or long-term reliability.

Frequently Asked Questions (FAQ)

Q: Can DS280DF810ABVR be used as a direct replacement for DS280DF810ABVT in production?

A: Yes. Both parts are electrically and mechanically identical. The only difference is packaging format (Tape & Reel versus Cut Tape & Digi-Reel®). PCB assembly compatibility is identical, and no circuit modifications are required.

Q: What is the significance of the packaging format difference?

A: Packaging format affects supply chain handling and assembly line integration. Tape & Reel (TR) format is optimized for high-speed automated assembly. Cut Tape (CT) & Digi-Reel® format provides flexibility for lower-volume or mixed-component assembly scenarios. Electrical performance is unaffected.

Q: Are there any thermal or reliability differences between these substitutes?

A: No. Both parts share identical operating temperature ranges (-40°C to 85°C), MSL ratings (3, 168 Hours), and compliance certifications. Thermal and reliability characteristics are equivalent.

Q: Do both parts require the same PCB layout and design considerations?

A: Yes. Both parts use the identical 135-FCBGA package with 8.05 x 13.05 mm dimensions. PCB footprints, trace routing, and design rules are interchangeable.

Q: What compliance certifications apply to both parts?

A: Both DS280DF810ABVT and DS280DF810ABVR are ROHS3 compliant, REACH Unaffected, and classified as EAR99 for export control purposes.

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