DS280DF810ABVR Equivalent & Substitute Parts

Part Overview

The DS280DF810ABVR is an active buffer and retiming IC designed for high-speed serial data applications. This 8-channel retimer operates at data rates up to 28.4 Gbps and is housed in a 135-pin fine-pitch ball grid array (FCBGA) package measuring 8.05 x 13.05 mm. The device features CML input and output signaling with integrated input equalization for signal conditioning. Currently in active production status with full RoHS3 compliance, this component is widely used in interface applications requiring signal integrity and retiming functionality. Substitute parts are identified based on identical electrical specifications and package geometry, with differences limited to packaging format and inventory availability.

Key Parameters

Parameter	Value
Manufacturer	Texas Instruments
Category	Interface
Type	Buffer, ReDriver
Number of Channels	8
Data Rate (Max)	28.4 Gbps
Input Signaling	CML
Output Signaling	CML
Signal Conditioning	Input Equalization
Package / Case	135-BGA Module
Supplier Device Package	135-FCBGA (8.05x13.05)
Mounting Type	Surface Mount
Operating Temperature Range	-40°C ~ 85°C
Product Status	Active
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected

Substitute Part Grouping Explanation

The DS280DF810ABVR and DS280DF810ABVT are parametric equivalents sharing identical electrical and mechanical specifications. Substitution eligibility is determined by the following critical parameters:

8-channel retimer architecture
28.4 Gbps maximum data rate capability
CML input and output signaling standards
Input equalization signal conditioning
135-FCBGA package geometry (8.05 x 13.05 mm)
Surface mount configuration
-40°C to 85°C operating temperature range
Active product status with current manufacturing support

The sole distinction between these parts is packaging format: the DS280DF810ABVR is supplied in Cut Tape (CT) & Digi-Reel® format, while the DS280DF810ABVT is supplied in Tape & Reel (TR) format. Both formats are standard industry packaging methods for surface-mount components and do not affect electrical performance or functional compatibility.

Parameter Comparison

Parameter	DS280DF810ABVR	DS280DF810ABVT
Manufacturer	Texas Instruments	Texas Instruments
Category	Interface	Interface
Type	Buffer, ReDriver	Buffer, ReDriver
Number of Channels	8	8
Data Rate (Max)	28.4 Gbps	28.4 Gbps
Input Signaling	CML	CML
Output Signaling	CML	CML
Signal Conditioning	Input Equalization	Input Equalization
Package / Case	135-BGA Module	135-BGA Module
Supplier Device Package	135-FCBGA (8.05x13.05)	135-FCBGA (8.05x13.05)
Mounting Type	Surface Mount	Surface Mount
Operating Temperature Range	-40°C ~ 85°C	-40°C ~ 85°C
Product Status	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected
Packaging Format	Cut Tape (CT) & Digi-Reel®	Tape & Reel (TR)

Engineering Selection Recommendations

Both DS280DF810ABVR and DS280DF810ABVT are active production components from Texas Instruments with full regulatory compliance. Selection between these parts should be based on procurement and assembly requirements:

The DS280DF810ABVR in Cut Tape & Digi-Reel® format is suitable for lower-volume applications, prototype development, and situations requiring flexible component quantities. The DS280DF810ABVT in Tape & Reel format is optimized for high-volume manufacturing environments with automated pick-and-place assembly processes.

Both parts maintain identical electrical performance, thermal characteristics, and compliance certifications. The choice between them does not impact circuit design, signal integrity, or system reliability. Inventory availability and supply chain considerations may influence selection, as current stock levels differ between packaging formats.

Frequently Asked Questions (FAQ)

Q: Can DS280DF810ABVT be used as a direct replacement for DS280DF810ABVR?

A: Yes. Both parts are parametric equivalents with identical electrical specifications, channel count, data rate capability, signaling standards, and package geometry. The only difference is packaging format, which does not affect electrical performance or functional compatibility.

Q: What is the difference between Cut Tape (CT) & Digi-Reel® and Tape & Reel (TR) packaging?

A: Cut Tape & Digi-Reel® format provides components on individual tape segments suitable for manual handling and lower-volume applications. Tape & Reel format supplies components on continuous reels optimized for automated assembly equipment. Both formats contain the same component with identical specifications.

Q: Are there any thermal or electrical performance differences between these parts?

A: No. Both parts operate across the identical temperature range (-40°C to 85°C) and deliver the same 28.4 Gbps data rate capability with CML signaling and input equalization. Thermal and electrical characteristics are identical.

Q: Do both parts meet the same compliance and regulatory requirements?

A: Yes. Both DS280DF810ABVR and DS280DF810ABVT are ROHS3 compliant, REACH unaffected, and carry identical MSL ratings of 3 (168 Hours). Regulatory and environmental compliance is equivalent.

Q: Which part should be selected for high-volume production?

A: The DS280DF810ABVT in Tape & Reel format is recommended for high-volume manufacturing due to compatibility with automated assembly processes and continuous reel supply. The DS280DF810ABVR is better suited for lower-volume or prototype applications.

Q: Is the 135-FCBGA package geometry identical for both parts?

A: Yes. Both parts use the same 135-pin fine-pitch ball grid array package with dimensions of 8.05 x 13.05 mm. PCB footprint, solder ball pitch, and mounting requirements are identical.

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