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DS2433AX-S#T Equivalent & Substitute Parts
Part Overview
The DS2433AX-S#T is a 4Kbit EEPROM memory IC with 1-Wire® interface manufactured by Analog Devices Inc./Maxim Integrated. This component features a 6-FlipChip package (2.82x2.54) and operates across the industrial temperature range of -40°C to 85°C. The part is currently classified as obsolete, making identification of suitable substitutes essential for ongoing system support and new design implementations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Type | Non-Volatile EEPROM |
| Memory Size | 4Kbit |
| Memory Organization | 256 x 16 |
| Memory Interface | 1-Wire® |
| Access Time | 2 µs |
| Operating Temperature Range | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the DS2433AX-S#T is determined by strict equivalence across the following critical parameters:
- Memory Capacity & Organization: 4Kbit capacity with 256 x 16 organization
- Interface Protocol: 1-Wire® communication standard
- Access Performance: 2 µs access time
- Temperature Specification: -40°C to 85°C operating range
- Compliance Standards: ROHS3 compliance and MSL Level 1 rating
- Functional Equivalence: Non-volatile EEPROM technology with identical memory format
The DS24B33Q+T&R qualifies as a direct substitute based on matching all critical electrical and functional parameters. The primary difference is packaging format: the substitute uses a 6-TDFN (3x3) package instead of the 6-FlipChip format of the original part.
Parameter Comparison
| Parameter | DS2433AX-S#T (Main Part) | DS24B33Q+T&R (Substitute) |
|---|---|---|
| Manufacturer | Analog Devices Inc./Maxim Integrated | Analog Devices Inc./Maxim Integrated |
| Memory Type | Non-Volatile EEPROM | Non-Volatile EEPROM |
| Memory Size | 4Kbit | 4Kbit |
| Memory Organization | 256 x 16 | 256 x 16 |
| Memory Interface | 1-Wire® | 1-Wire® |
| Access Time | 2 µs | 2 µs |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 6-XBGA, FCBGA | 6-WDFN Exposed Pad |
| Supplier Device Package | 6-FlipChip (2.82x2.54) | 6-TDFN (3x3) |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) |
| Supply Voltage | Not specified | 2.8V ~ 5.25V |
Engineering Selection Recommendations
The DS24B33Q+T&R is the active production substitute for the obsolete DS2433AX-S#T. Both components maintain identical electrical specifications for memory capacity, interface protocol, access time, and operating temperature range. The substitute part carries active product status with confirmed availability (47,700 units in stock), ensuring supply chain continuity.
Both parts maintain ROHS3 compliance and MSL Level 1 rating, satisfying environmental and reliability requirements. The primary design consideration is the package transition from 6-FlipChip to 6-TDFN format, which requires PCB layout modification but does not affect functional performance or electrical compatibility.
Frequently Asked Questions (FAQ)
Q: Can DS24B33Q+T&R directly replace DS2433AX-S#T without design changes?
A: Electrical and functional compatibility is complete. PCB layout modification is required due to package format change from 6-FlipChip (2.82x2.54) to 6-TDFN (3x3). Pin assignment and 1-Wire® interface remain functionally equivalent.
Q: What is the primary reason for substitution?
A: The DS2433AX-S#T is classified as obsolete. The DS24B33Q+T&R is the active production equivalent with identical memory specifications and interface protocol.
Q: Are there supply differences between these parts?
A: The main part shows 784 units in stock (obsolete status). The substitute part has 47,700 units available with active product status, providing superior supply chain reliability.
Q: Do both parts meet the same compliance standards?
A: Yes. Both parts are ROHS3 compliant with MSL Level 1 rating. Environmental and regulatory requirements are equivalent.
Q: What is the significance of the package change?
A: The 6-TDFN package (3x3) is smaller than the 6-FlipChip format. This requires PCB footprint redesign but offers improved thermal characteristics and manufacturing compatibility with standard surface mount processes.
Q: Is the 1-Wire® interface identical between both parts?
A: Yes. Both parts implement the 1-Wire® protocol with 2 µs access time and 256 x 16 memory organization. Communication protocol and timing specifications are fully compatible.
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