DS17885E-5+ Equivalent & Substitute Parts

Part Overview

The DS17885E-5+ is a Real Time Clock (RTC) IC with Clock/Calendar functionality manufactured by Analog Devices Inc./Maxim Integrated. This device provides 8KB of parallel interface memory with integrated alarm, daylight savings, leap year, NVSRAM, and square wave output capabilities in a 28-TSSOP surface mount package. The product is currently obsolete, making equivalent substitute parts necessary for ongoing system support, maintenance, and new design implementations where legacy compatibility is required.

Substiute Parts

DS17885E-5+

Analog Devices Inc./Maxim IntegratedIn Stock: 1074DS17885E-5+ Datasheet

Current PartRFQ

BQ4802YPW

Texas InstrumentsIn Stock: 1928BQ4802YPW Datasheet

MFR RecommendedRFQ

DP8573AV/NOPB

Texas InstrumentsIn Stock: 4247DP8573AV/NOPB Datasheet

MFR RecommendedRFQ

M48T12-150PC1

STMicroelectronicsIn Stock: 2537M48T12-150PC1 Datasheet

MFR RecommendedRFQ

M48T18-100PC1

STMicroelectronicsIn Stock: 1462M48T18-100PC1 Datasheet

MFR RecommendedRFQ

M48T58-70PC1

STMicroelectronicsIn Stock: 1546M48T58-70PC1 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the DS17885E-5+ is determined by the following critical parameters:

Primary Compatibility Criteria:

• Interface type: Parallel
• Time format: HH:MM:SS (12/24 hr)
• Date format: YY-MM-DD-dd
• Supply voltage range: 4.5V ~ 5.5V
• Operating temperature: 0°C ~ 70°C
• RTC with Clock/Calendar functionality
• RoHS3 compliance

Secondary Considerations:

• Package type (surface mount vs. through-hole affects PCB layout)
• Pin count and physical dimensions
• Battery backup voltage range
• Timekeeping current consumption
• Feature set (alarm, leap year, watchdog timer)

The substitute parts listed below maintain functional equivalence through parallel interface architecture and compatible voltage/temperature specifications. Package variations (28-TSSOP surface mount vs. 28-DIP through-hole) represent design trade-offs between form factor and board integration method.

Parameter Comparison

Engineering Selection Recommendations

Surface Mount Equivalents (Direct Package Compatibility):

BQ4802YPW (Texas Instruments) provides the closest functional match for surface mount applications. This part maintains 28-TSSOP packaging, parallel interface, and compatible voltage specifications. The BQ4802YPW is in active production status with superior MSL rating (1 vs. 3), lower timekeeping current consumption (1.5mA typical vs. 3mA maximum), and extended battery voltage range (2.4V ~ 4V). RoHS3 compliance is maintained.

DP8573AV/NOPB (Texas Instruments) offers surface mount functionality in 28-LCC J-Lead package with extended operating temperature range (-40°C ~ 85°C). This part features exceptionally low timekeeping current (1µA @ 5V) and wide battery voltage range (2.2V ~ 5.1V). Active production status and RoHS3 compliance are confirmed. Package change from TSSOP to LCC requires PCB layout modification.

Through-Hole Equivalents (Form Factor Change):

M48T12-150PC1, M48T18-100PC1, and M48T58-70PC1 (STMicroelectronics Timekeeper® series) provide through-hole DIP alternatives. These parts maintain parallel interface, compatible voltage ranges, and operating temperature specifications. All three are in active production with RoHS3 compliance and superior MSL ratings (1 vs. 3). Through-hole mounting requires different PCB footprint design compared to surface mount originals.

M48T18-100PC1 and M48T58-70PC1 both use 28-DIP packaging, matching the pin count of the DS17885E-5+. M48T12-150PC1 uses 24-DIP packaging with reduced pin count, requiring firmware/hardware interface adaptation.

Compliance and Production Status:

All substitute parts maintain ROHS3 compliance and REACH unaffected status. The DS17885E-5+ obsolete status necessitates transition to active production alternatives. BQ4802YPW and DP8573AV/NOPB (Texas Instruments) and M48T series (STMicroelectronics) are all actively manufactured, ensuring long-term availability and supply chain stability.

Frequently Asked Questions (FAQ)

Q: Can BQ4802YPW directly replace DS17885E-5+ without PCB modification?

A: BQ4802YPW maintains identical 28-TSSOP surface mount packaging and parallel interface pinout compatibility. Functional substitution is supported through matching voltage ranges (4.5V ~ 5.5V), time/date formats, and operating temperature (0°C ~ 70°C). However, firmware validation is required to confirm register-level compatibility and feature mapping (alarm, daylight savings, leap year functions).

Q: What are the package trade-offs between surface mount and through-hole alternatives?

A: Surface mount options (BQ4802YPW, DP8573AV/NOPB) require SMD assembly equipment and smaller PCB footprints. Through-hole alternatives (M48T series) use larger DIP modules compatible with standard IC sockets and manual assembly. Package selection depends on manufacturing capability, board density requirements, and assembly process constraints.

Q: Why does DP8573AV/NOPB have lower timekeeping current (1µA) compared to other options?

A: The DP8573AV/NOPB achieves 1µA timekeeping current through different internal circuit architecture. This specification is provided by Texas Instruments and represents a design trade-off. Actual power consumption in system integration depends on battery backup configuration, temperature conditions, and duty cycle.

Q: Are the M48T series parts pin-compatible with DS17885E-5+?

A: M48T18-100PC1 and M48T58-70PC1 provide 28-pin DIP packaging matching the DS17885E-5+ pin count. However, package form factor changes from surface mount TSSOP to through-hole DIP require PCB redesign. M48T12-150PC1 uses 24-DIP packaging and requires pin mapping verification before implementation.

Q: What is the significance of MSL (Moisture Sensitivity Level) differences?

A: DS17885E-5+ has MSL 3 (168 hours), requiring controlled storage and handling. Substitute parts with MSL 1 (unlimited) or MSL 2A (4 weeks) offer improved shelf life and reduced moisture-related failures during storage and assembly. Lower MSL ratings reduce manufacturing risk and supply chain complexity.

Q: Can these parts be used interchangeably in legacy system repairs?

A: Functional substitution is supported through parallel interface compatibility and matching electrical specifications. However, register-level firmware compatibility must be verified for each application. Legacy systems may require software updates or hardware interface adaptation depending on specific RTC register implementations and feature dependencies.

Q: What compliance certifications are maintained across all substitute options?

A: All substitute parts maintain RoHS3 compliance and REACH unaffected status, matching the DS17885E-5+ regulatory requirements. ECCN and HTSUS classifications remain consistent across all options (EAR99 and 8542.39.0001 respectively).