DS1307N Real Time Clock IC Equivalent & Substitute Parts

Part Overview

The DS1307N is a Real Time Clock (RTC) IC manufactured by Analog Devices Inc./Maxim Integrated, designed for clock/calendar applications with I2C serial interface. This through-hole 8-DIP package device provides 56 bytes of non-volatile SRAM, leap year support, and square wave output capability. The DS1307N is classified as obsolete product status, making equivalent and substitute parts necessary for new designs and ongoing production support. Active alternatives with identical or enhanced electrical characteristics are available from multiple manufacturers in both through-hole and surface-mount packages.

Substiute Parts

DS1307N
Analog Devices Inc./Maxim IntegratedIn Stock: 2069DS1307N Datasheet
DS1307N
Current Part
DS1307N+
Analog Devices Inc./Maxim IntegratedIn Stock: 30327DS1307N+ Datasheet
DS1307N+
Direct
1337AGDCGI
Renesas Electronics CorporationIn Stock: 7781337AGDCGI Datasheet
1337AGDCGI
MFR Recommended
1337AGDVGI8
Renesas Electronics CorporationIn Stock: 36821337AGDVGI8 Datasheet
1337AGDVGI8
MFR Recommended
AB0805-T3
Abracon LLCIn Stock: 21403AB0805-T3 Datasheet
AB0805-T3
MFR Recommended
BU9873FVM-GTTR
Rohm SemiconductorIn Stock: 1288BU9873FVM-GTTR Datasheet
BU9873FVM-GTTR
MFR Recommended
ISL12022IBZ
Renesas Electronics CorporationIn Stock: 8594ISL12022IBZ Datasheet
ISL12022IBZ
MFR Recommended
ISL12022IBZ-T7A
Renesas Electronics CorporationIn Stock: 2052ISL12022IBZ-T7A Datasheet
ISL12022IBZ-T7A
MFR Recommended
ISL12022MAIBZ
Renesas Electronics CorporationIn Stock: 1261ISL12022MAIBZ Datasheet
ISL12022MAIBZ
MFR Recommended
ISL12026AIBZ
Renesas Electronics CorporationIn Stock: 2136ISL12026AIBZ Datasheet
ISL12026AIBZ
MFR Recommended
ISL12057IUZ
Renesas Electronics CorporationIn Stock: 2136ISL12057IUZ Datasheet
ISL12057IUZ
MFR Recommended
M41T0M6F
STMicroelectronicsIn Stock: 17094M41T0M6F Datasheet
M41T0M6F
MFR Recommended
M41T83ZQA6F
STMicroelectronicsIn Stock: 4040M41T83ZQA6F Datasheet
M41T83ZQA6F
MFR Recommended
MCP79400-I/ST
Microchip TechnologyIn Stock: 19467MCP79400-I/ST Datasheet
MCP79400-I/ST
MFR Recommended
MCP79400T-I/MS
Microchip TechnologyIn Stock: 7261MCP79400T-I/MS Datasheet
MCP79400T-I/MS
MFR Recommended
MCP79401T-I/MNY
Microchip TechnologyIn Stock: 19929MCP79401T-I/MNY Datasheet
MCP79401T-I/MNY
MFR Recommended
MCP7940MT-I/SN
Microchip TechnologyIn Stock: 27231MCP7940MT-I/SN Datasheet
MCP7940MT-I/SN
MFR Recommended
MCP7940N-I/P
Microchip TechnologyIn Stock: 2116MCP7940N-I/P Datasheet
MCP7940N-I/P
MFR Recommended
MCP7940N-I/ST
Microchip TechnologyIn Stock: 2002MCP7940N-I/ST Datasheet
MCP7940N-I/ST
MFR Recommended
MCP79410T-I/MS
Microchip TechnologyIn Stock: 2682MCP79410T-I/MS Datasheet
MCP79410T-I/MS
MFR Recommended
MCP79412T-I/ST
Microchip TechnologyIn Stock: 1242MCP79412T-I/ST Datasheet
MCP79412T-I/ST
MFR Recommended
PCF8563T/F4,118
NXP USA Inc.In Stock: 3367PCF8563T/F4,118 Datasheet
PCF8563T/F4,118
MFR Recommended
PT7C4337WEX
Diodes IncorporatedIn Stock: 25474PT7C4337WEX Datasheet
PT7C4337WEX
MFR Recommended
PT7C43390AWEX
Diodes IncorporatedIn Stock: 1200PT7C43390AWEX Datasheet
PT7C43390AWEX
MFR Recommended
PT7C4339WEX
Diodes IncorporatedIn Stock: 1519PT7C4339WEX Datasheet
PT7C4339WEX
MFR Recommended
RTC-8564NB:B3 ROHS
EPSONIn Stock: 2693RTC-8564NB:B3 ROHS Datasheet
RTC-8564NB:B3 ROHS
MFR Recommended
RX-8025SA:AA0:PURE SN
RX-8025SA:AA0:PURE SN
MFR Recommended
RX-8571SA:B3 PURE SN
RX-8571SA:B3 PURE SN
MFR Recommended
RX-8803LC:UA PURE SN
RX-8803LC:UA PURE SN
MFR Recommended
RX-8803SA:UC PURE SN
RX-8803SA:UC PURE SN
MFR Recommended
RX-8803SA:UC3 PURE SN
RX-8803SA:UC3 PURE SN
MFR Recommended
RX8900CE:UA3
EPSONIn Stock: 15088RX8900CE:UA3 Datasheet
RX8900CE:UA3
MFR Recommended
S-35390A-J8T1G
ABLIC Inc.In Stock: 17881S-35390A-J8T1G Datasheet
S-35390A-J8T1G
MFR Recommended

Key Parameters

Parameter DS1307N Value
Interface I2C, 2-Wire Serial
Time Format HH:MM:SS (12/24 hr)
Date Format YY-MM-DD-dd
Memory Size 56B
Voltage - Supply 4.5V ~ 5.5V
Voltage - Supply, Battery 2V ~ 4.6V
Current - Timekeeping (Max) 200µA @ 5V
Operating Temperature -40°C ~ 85°C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)
Features Leap Year, NVSRAM, Square Wave Output
RoHS Status RoHS non-compliant

Substitute Part Grouping Explanation

Substitution of the DS1307N is determined by strict alignment of the following electrical and mechanical parameters:

Critical Substitution Parameters:

  • I2C/2-Wire Serial interface compatibility
  • Time format support (12/24 hour)
  • Date format support (YY-MM-DD-dd)
  • Operating temperature range (-40°C ~ 85°C minimum)
  • Supply voltage compatibility (minimum 4.5V ~ 5.5V for direct replacement, or 1.8V ~ 5.5V for designs permitting voltage adjustment)
  • RTC clock/calendar functionality with leap year support

Package Considerations:

  • Through-hole 8-DIP packages maintain direct PCB compatibility
  • Surface-mount alternatives (8-SOIC, 8-TSSOP, 16-QFN) require PCB redesign but offer improved electrical performance and compliance status
  • Module packages (10-SMD) provide integrated solutions with reduced component count

Compliance Factors:

  • RoHS3 compliance status differentiates active production parts from obsolete designs
  • REACH and ECCN classifications remain consistent across all listed alternatives

Parameter Comparison

Part Number Manufacturer Package Mounting Interface Time Format Supply Voltage Current (Max) Memory Product Status RoHS Status
DS1307N Analog Devices/Maxim 8-DIP Through Hole I2C, 2-Wire 12/24 hr 4.5V ~ 5.5V 200µA @ 5V 56B Obsolete Non-compliant
DS1307N+ Analog Devices/Maxim 8-DIP Through Hole I2C, 2-Wire 12/24 hr 4.5V ~ 5.5V 200µA @ 5V 56B Active ROHS3 Compliant
1337AGDCGI Renesas Electronics 8-SOIC Surface Mount I2C, 2-Wire 12/24 hr 1.8V ~ 5.5V 0.3µA @ 1.3V ~ 1.8V Active ROHS3 Compliant
1337AGDVGI8 Renesas Electronics 8-TSSOP Surface Mount I2C, 2-Wire 12/24 hr 1.8V ~ 5.5V 0.3µA @ 1.3V ~ 1.8V Active ROHS3 Compliant
AB-RTCMC-32.768KHZ-B5GA-S3-T Abracon LLC 10-SMD Module Surface Mount I2C, 2-Wire 24 hr 1.2V ~ 5.5V 0.45µA ~ 0.55µA @ 2V ~ 5V Active ROHS3 Compliant
AB0805-T3 Abracon LLC 16-VFQFN Surface Mount I2C, 2-Wire HH:MM:SS:hh 1.7V ~ 3.6V 0.17µA ~ 0.22µA @ 1.8V ~ 3V 256B Active ROHS3 Compliant
BU9873FVM-GTTR Rohm Semiconductor 8-MSOP Surface Mount I2C, 2-Wire 12/24 hr 1.8V ~ 5.5V 1µA ~ 1.35µA @ 3V ~ 5.5V Not For New Designs ROHS3 Compliant
ISL12022IBZ Renesas Electronics 8-SOIC Surface Mount I2C, 2-Wire 12/24 hr 2.7V ~ 5.5V 14µA ~ 15µA @ 3V ~ 5V 128B Active ROHS3 Compliant
ISL12022IBZ-T7A Renesas Electronics 8-SOIC Surface Mount I2C, 2-Wire 12/24 hr 2.7V ~ 5.5V 14µA ~ 15µA @ 3V ~ 5V 128B Active ROHS3 Compliant
ISL12022MAIBZ Renesas Electronics 20-SOIC Surface Mount I2C, 2-Wire 12/24 hr 2.7V ~ 5.5V 14µA ~ 15µA @ 3V ~ 5V 128B Active ROHS3 Compliant
ISL12026AIBZ Renesas Electronics 8-SOIC Surface Mount I2C, 2-Wire 12/24 hr 2.7V ~ 5.5V 10µA ~ 20µA @ 2.7V ~ 5.5V Active ROHS3 Compliant

Engineering Selection Recommendations

Direct Through-Hole Replacement: DS1307N+ is the primary direct replacement, maintaining identical electrical specifications and 8-DIP package form factor while transitioning from obsolete to active product status with ROHS3 compliance.

Surface-Mount Alternatives for PCB Redesign: For designs permitting PCB layout modification, surface-mount options provide superior electrical performance and compliance status. Selection depends on specific application requirements:

  • 1337AGDCGI and 1337AGDVGI8 (Renesas): Offer extended supply voltage range (1.8V ~ 5.5V) and significantly reduced timekeeping current (0.3µA). Available in 8-SOIC and 8-TSSOP packages. Both are active products with ROHS3 compliance.

  • ISL12022IBZ series (Renesas): Provide 128B SRAM, alarm functionality, and daylight savings support. Available in 8-SOIC and 20-SOIC packages. All variants are active with ROHS3 compliance.

  • ISL12026AIBZ (Renesas): Compact 8-SOIC alternative with alarm and leap year features. Active product status with ROHS3 compliance.

  • AB0805-T3 (Abracon): Highest integration with 256B memory, trickle-charger, and watchdog timer in 16-VFQFN package. Lowest timekeeping current (0.17µA ~ 0.22µA). Active product with ROHS3 compliance.

  • AB-RTCMC-32.768KHZ-B5GA-S3-T (Abracon): Integrated module solution with 10-SMD package, eliminating external crystal requirement. Active product with ROHS3 compliance.

Parts Not Recommended for New Designs: BU9873FVM-GTTR carries "Not For New Designs" status despite ROHS3 compliance and should be avoided for new development.

Frequently Asked Questions (FAQ)

Q: Can DS1307N be directly replaced with DS1307N+ without PCB modification? A: Yes. DS1307N+ maintains identical electrical specifications and 8-DIP package dimensions, requiring no circuit or layout changes. The primary difference is active product status and ROHS3 compliance.

Q: What are the key differences between through-hole and surface-mount alternatives? A: Through-hole packages (8-DIP) maintain existing PCB compatibility but limit performance improvements. Surface-mount alternatives (8-SOIC, 8-TSSOP, 16-QFN) require PCB redesign but offer extended voltage ranges, reduced power consumption, enhanced features (alarm, SRAM, watchdog), and improved compliance status.

Q: Which substitute provides the lowest power consumption? A: AB0805-T3 delivers the lowest timekeeping current at 0.17µA ~ 0.22µA @ 1.8V ~ 3V, followed by Renesas 1337 series at 0.3µA @ 1.3V ~ 1.8V. Standard DS1307N operates at 200µA @ 5V.

Q: Are all listed substitutes compatible with 5V supply voltage? A: All listed substitutes support 5V operation within their specified supply voltage ranges. However, designs using lower voltage supplies (1.8V ~ 3.6V) benefit from alternatives with extended lower voltage limits.

Q: What is the significance of the 56B memory in DS1307N? A: The 56B non-volatile SRAM provides storage for application-specific data beyond time/date registers. ISL12022 series offers 128B SRAM for expanded storage. AB0805-T3 provides 256B. Alternatives without specified memory still support I2C register access for time/date functions.

Q: Can surface-mount alternatives be used in existing through-hole designs? A: Direct PCB substitution is not possible without redesign. Surface-mount parts require adapter boards or complete PCB layout modification. Evaluate cost-benefit of redesign against volume requirements.

Q: Which substitute offers the best feature set for new designs? A: AB0805-T3 combines 256B memory, alarm functionality, trickle-charger, watchdog timer, and lowest power consumption in a compact 16-QFN package. ISL12022 series provides balanced features with 128B SRAM and alarm support in standard 8-SOIC packages.

Q: What is the difference between ISL12022IBZ and ISL12022IBZ-T7A? A: Both parts are electrically identical with 128B SRAM and identical specifications. The primary difference is packaging format: ISL12022IBZ is supplied in tubes, while ISL12022IBZ-T7A uses cut tape and Digi-Reel format for automated assembly.

Q: Is RoHS compliance mandatory for all substitutes? A: All listed active alternatives are ROHS3 compliant. Original DS1307N is RoHS non-compliant. For applications requiring RoHS compliance, select from active product alternatives.

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