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DS1307N Real Time Clock IC Equivalent & Substitute Parts
Part Overview
The DS1307N is a Real Time Clock (RTC) IC manufactured by Analog Devices Inc./Maxim Integrated, designed for clock/calendar applications with I2C serial interface. This through-hole 8-DIP package device provides 56 bytes of non-volatile SRAM, leap year support, and square wave output capability. The DS1307N is classified as obsolete product status, making equivalent and substitute parts necessary for new designs and ongoing production support. Active alternatives with identical or enhanced electrical characteristics are available from multiple manufacturers in both through-hole and surface-mount packages.
Substiute Parts
Key Parameters
| Parameter | DS1307N Value |
|---|---|
| Interface | I2C, 2-Wire Serial |
| Time Format | HH:MM:SS (12/24 hr) |
| Date Format | YY-MM-DD-dd |
| Memory Size | 56B |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Supply, Battery | 2V ~ 4.6V |
| Current - Timekeeping (Max) | 200µA @ 5V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300", 7.62mm) |
| Features | Leap Year, NVSRAM, Square Wave Output |
| RoHS Status | RoHS non-compliant |
Substitute Part Grouping Explanation
Substitution of the DS1307N is determined by strict alignment of the following electrical and mechanical parameters:
Critical Substitution Parameters:
- I2C/2-Wire Serial interface compatibility
- Time format support (12/24 hour)
- Date format support (YY-MM-DD-dd)
- Operating temperature range (-40°C ~ 85°C minimum)
- Supply voltage compatibility (minimum 4.5V ~ 5.5V for direct replacement, or 1.8V ~ 5.5V for designs permitting voltage adjustment)
- RTC clock/calendar functionality with leap year support
Package Considerations:
- Through-hole 8-DIP packages maintain direct PCB compatibility
- Surface-mount alternatives (8-SOIC, 8-TSSOP, 16-QFN) require PCB redesign but offer improved electrical performance and compliance status
- Module packages (10-SMD) provide integrated solutions with reduced component count
Compliance Factors:
- RoHS3 compliance status differentiates active production parts from obsolete designs
- REACH and ECCN classifications remain consistent across all listed alternatives
Parameter Comparison
| Part Number | Manufacturer | Package | Mounting | Interface | Time Format | Supply Voltage | Current (Max) | Memory | Product Status | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|
| DS1307N | Analog Devices/Maxim | 8-DIP | Through Hole | I2C, 2-Wire | 12/24 hr | 4.5V ~ 5.5V | 200µA @ 5V | 56B | Obsolete | Non-compliant |
| DS1307N+ | Analog Devices/Maxim | 8-DIP | Through Hole | I2C, 2-Wire | 12/24 hr | 4.5V ~ 5.5V | 200µA @ 5V | 56B | Active | ROHS3 Compliant |
| 1337AGDCGI | Renesas Electronics | 8-SOIC | Surface Mount | I2C, 2-Wire | 12/24 hr | 1.8V ~ 5.5V | 0.3µA @ 1.3V ~ 1.8V | — | Active | ROHS3 Compliant |
| 1337AGDVGI8 | Renesas Electronics | 8-TSSOP | Surface Mount | I2C, 2-Wire | 12/24 hr | 1.8V ~ 5.5V | 0.3µA @ 1.3V ~ 1.8V | — | Active | ROHS3 Compliant |
| AB-RTCMC-32.768KHZ-B5GA-S3-T | Abracon LLC | 10-SMD Module | Surface Mount | I2C, 2-Wire | 24 hr | 1.2V ~ 5.5V | 0.45µA ~ 0.55µA @ 2V ~ 5V | — | Active | ROHS3 Compliant |
| AB0805-T3 | Abracon LLC | 16-VFQFN | Surface Mount | I2C, 2-Wire | HH:MM:SS:hh | 1.7V ~ 3.6V | 0.17µA ~ 0.22µA @ 1.8V ~ 3V | 256B | Active | ROHS3 Compliant |
| BU9873FVM-GTTR | Rohm Semiconductor | 8-MSOP | Surface Mount | I2C, 2-Wire | 12/24 hr | 1.8V ~ 5.5V | 1µA ~ 1.35µA @ 3V ~ 5.5V | — | Not For New Designs | ROHS3 Compliant |
| ISL12022IBZ | Renesas Electronics | 8-SOIC | Surface Mount | I2C, 2-Wire | 12/24 hr | 2.7V ~ 5.5V | 14µA ~ 15µA @ 3V ~ 5V | 128B | Active | ROHS3 Compliant |
| ISL12022IBZ-T7A | Renesas Electronics | 8-SOIC | Surface Mount | I2C, 2-Wire | 12/24 hr | 2.7V ~ 5.5V | 14µA ~ 15µA @ 3V ~ 5V | 128B | Active | ROHS3 Compliant |
| ISL12022MAIBZ | Renesas Electronics | 20-SOIC | Surface Mount | I2C, 2-Wire | 12/24 hr | 2.7V ~ 5.5V | 14µA ~ 15µA @ 3V ~ 5V | 128B | Active | ROHS3 Compliant |
| ISL12026AIBZ | Renesas Electronics | 8-SOIC | Surface Mount | I2C, 2-Wire | 12/24 hr | 2.7V ~ 5.5V | 10µA ~ 20µA @ 2.7V ~ 5.5V | — | Active | ROHS3 Compliant |
Engineering Selection Recommendations
Direct Through-Hole Replacement: DS1307N+ is the primary direct replacement, maintaining identical electrical specifications and 8-DIP package form factor while transitioning from obsolete to active product status with ROHS3 compliance.
Surface-Mount Alternatives for PCB Redesign: For designs permitting PCB layout modification, surface-mount options provide superior electrical performance and compliance status. Selection depends on specific application requirements:
-
1337AGDCGI and 1337AGDVGI8 (Renesas): Offer extended supply voltage range (1.8V ~ 5.5V) and significantly reduced timekeeping current (0.3µA). Available in 8-SOIC and 8-TSSOP packages. Both are active products with ROHS3 compliance.
-
ISL12022IBZ series (Renesas): Provide 128B SRAM, alarm functionality, and daylight savings support. Available in 8-SOIC and 20-SOIC packages. All variants are active with ROHS3 compliance.
-
ISL12026AIBZ (Renesas): Compact 8-SOIC alternative with alarm and leap year features. Active product status with ROHS3 compliance.
-
AB0805-T3 (Abracon): Highest integration with 256B memory, trickle-charger, and watchdog timer in 16-VFQFN package. Lowest timekeeping current (0.17µA ~ 0.22µA). Active product with ROHS3 compliance.
-
AB-RTCMC-32.768KHZ-B5GA-S3-T (Abracon): Integrated module solution with 10-SMD package, eliminating external crystal requirement. Active product with ROHS3 compliance.
Parts Not Recommended for New Designs: BU9873FVM-GTTR carries "Not For New Designs" status despite ROHS3 compliance and should be avoided for new development.
Frequently Asked Questions (FAQ)
Q: Can DS1307N be directly replaced with DS1307N+ without PCB modification? A: Yes. DS1307N+ maintains identical electrical specifications and 8-DIP package dimensions, requiring no circuit or layout changes. The primary difference is active product status and ROHS3 compliance.
Q: What are the key differences between through-hole and surface-mount alternatives? A: Through-hole packages (8-DIP) maintain existing PCB compatibility but limit performance improvements. Surface-mount alternatives (8-SOIC, 8-TSSOP, 16-QFN) require PCB redesign but offer extended voltage ranges, reduced power consumption, enhanced features (alarm, SRAM, watchdog), and improved compliance status.
Q: Which substitute provides the lowest power consumption? A: AB0805-T3 delivers the lowest timekeeping current at 0.17µA ~ 0.22µA @ 1.8V ~ 3V, followed by Renesas 1337 series at 0.3µA @ 1.3V ~ 1.8V. Standard DS1307N operates at 200µA @ 5V.
Q: Are all listed substitutes compatible with 5V supply voltage? A: All listed substitutes support 5V operation within their specified supply voltage ranges. However, designs using lower voltage supplies (1.8V ~ 3.6V) benefit from alternatives with extended lower voltage limits.
Q: What is the significance of the 56B memory in DS1307N? A: The 56B non-volatile SRAM provides storage for application-specific data beyond time/date registers. ISL12022 series offers 128B SRAM for expanded storage. AB0805-T3 provides 256B. Alternatives without specified memory still support I2C register access for time/date functions.
Q: Can surface-mount alternatives be used in existing through-hole designs? A: Direct PCB substitution is not possible without redesign. Surface-mount parts require adapter boards or complete PCB layout modification. Evaluate cost-benefit of redesign against volume requirements.
Q: Which substitute offers the best feature set for new designs? A: AB0805-T3 combines 256B memory, alarm functionality, trickle-charger, watchdog timer, and lowest power consumption in a compact 16-QFN package. ISL12022 series provides balanced features with 128B SRAM and alarm support in standard 8-SOIC packages.
Q: What is the difference between ISL12022IBZ and ISL12022IBZ-T7A? A: Both parts are electrically identical with 128B SRAM and identical specifications. The primary difference is packaging format: ISL12022IBZ is supplied in tubes, while ISL12022IBZ-T7A uses cut tape and Digi-Reel format for automated assembly.
Q: Is RoHS compliance mandatory for all substitutes? A: All listed active alternatives are ROHS3 compliant. Original DS1307N is RoHS non-compliant. For applications requiring RoHS compliance, select from active product alternatives.
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