DS1307+ Real Time Clock IC Equivalent & Substitute Parts

Part Overview

The DS1307+ is a Real Time Clock (RTC) IC manufactured by Analog Devices Inc./Maxim Integrated, designed for clock/calendar applications requiring I2C serial communication. This through-hole 8-DIP package device provides 56 bytes of non-volatile SRAM, supports 12/24-hour time format, and operates across 4.5V to 5.5V supply voltage with battery backup capability (2V to 4.6V). The product maintains Active status with ROHS3 compliance and unlimited moisture sensitivity rating.

Substitute parts become necessary when design requirements shift toward surface-mount packaging, lower power consumption, extended temperature ranges, or enhanced feature sets such as alarm functionality, daylight savings support, or increased memory capacity. The DS1307+ through-hole configuration may also require alternatives in modern PCB designs that prioritize compact form factors.

Key Parameters

Parameter	DS1307+ Specification
Manufacturer	Analog Devices Inc./Maxim Integrated
Package Type	8-DIP (0.300", 7.62mm)
Mounting Type	Through Hole
Memory Size	56B
Interface	I2C, 2-Wire Serial
Time Format	HH:MM:SS (12/24 hr)
Date Format	YY-MM-DD-dd
Voltage Supply	4.5V ~ 5.5V
Battery Voltage	2V ~ 4.6V
Current (Timekeeping)	200µA @ 5V
Operating Temperature	0°C ~ 70°C
Features	Leap Year, NVSRAM, Square Wave Output
Product Status	Active
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility is determined by the following criteria applied strictly to the provided specifications:

Primary Compatibility Criteria:

Interface type: I2C, 2-Wire Serial (mandatory match)
Time format: HH:MM:SS with 12/24-hour support (mandatory match)
Date format: YY-MM-DD-dd (mandatory match)
RoHS3 compliance (mandatory match)
Product status: Active or equivalent (preferred)

Secondary Flexibility Parameters:

Package type: Through-hole to surface-mount conversion acceptable
Voltage supply range: Must encompass or overlap with 4.5V ~ 5.5V minimum
Battery voltage: Must support 2V ~ 4.6V range or broader
Memory size: 56B or greater acceptable
Operating temperature: Extended ranges acceptable (0°C ~ 70°C minimum coverage required)
Current consumption: Lower values preferred but not restrictive
Additional features: Alarm, SRAM, trickle-charger acceptable as enhancements

Excluded from substitution:

Parts with incompatible interfaces (non-I2C)
Parts with non-matching time/date formats
Parts with non-ROHS3 compliance status

Parameter Comparison

Part Number	Manufacturer	Package	Mount Type	Memory (B)	Interface	Voltage Supply	Battery Voltage	Current (µA)	Temp Range (°C)	Status
DS1307+	Analog Devices/Maxim	8-DIP	Through Hole	56	I2C, 2-Wire	4.5V ~ 5.5V	2V ~ 4.6V	200 @ 5V	0 ~ 70	Active
1339-31DCGI	Renesas Electronics	8-SOIC	Surface Mount	—	I2C, 2-Wire	3.3V ~ 5.5V	1.3V ~ 3.7V	200 @ 3.63V-5.5V	-40 ~ 85	Active
AB0805-T3	Abracon LLC	16-VFQFN	Surface Mount	256	I2C, 2-Wire	1.7V ~ 3.6V	1.5V ~ 3.6V	0.17 ~ 0.22 @ 1.8V-3V	-40 ~ 85	Active
BU9873FVM-GTTR	Rohm Semiconductor	8-MSOP	Surface Mount	—	I2C, 2-Wire	1.8V ~ 5.5V	—	1 ~ 1.35 @ 3V-5.5V	-40 ~ 85	Not For New Designs
ISL12020MIRZ-T7A	Renesas Electronics	20-PowerLFDFN	Surface Mount	128	I2C, 2-Wire	2.7V ~ 5.5V	1.8V ~ 5.5V	14 ~ 15 @ 3V-5V	-40 ~ 85	Active
ISL12022IBZ-T7A	Renesas Electronics	8-SOIC	Surface Mount	128	I2C, 2-Wire	2.7V ~ 5.5V	1.8V ~ 5.5V	14 ~ 15 @ 3V-5V	-40 ~ 85	Active
ISL1208IB8Z	Renesas Electronics	8-SOIC	Surface Mount	2	I2C, 2-Wire	2.7V ~ 5.5V	1.8V ~ 5.5V	4 ~ 6 @ 3V-5V	-40 ~ 85	Active
M41T11M6F	STMicroelectronics	8-SOIC	Surface Mount	56	I2C, 2-Wire	2V ~ 5.5V	2.5V ~ 4.6V	70 @ 2V-5.5V	-40 ~ 85	Active
MCP79400-I/ST	Microchip Technology	8-TSSOP	Surface Mount	64	I2C, 2-Wire	1.8V ~ 5.5V	1.3V ~ 5.5V	1.2 (Typ) @ 3.3V	-40 ~ 85	Active
MCP79401-I/SN	Microchip Technology	8-SOIC	Surface Mount	64	I2C, 2-Wire	1.8V ~ 5.5V	1.3V ~ 5.5V	1.2 (Typ) @ 3.3V	-40 ~ 85	Active

Engineering Selection Recommendations

For Direct Through-Hole Replacement: No direct through-hole substitute exists in the provided list. The DS1307+ 8-DIP package is unique to this product. Designs requiring through-hole mounting must retain the DS1307+.

For Surface-Mount Migration (8-SOIC Package): Three options provide 8-SOIC surface-mount equivalence with Active product status:

1339-31DCGI (Renesas): Matches DS1307+ current consumption (200µA) and memory handling. Extends operating temperature to -40°C ~ 85°C. Voltage supply range 3.3V ~ 5.5V encompasses DS1307+ 4.5V ~ 5.5V requirement. ROHS3 compliant.
ISL12022IBZ-T7A (Renesas): Provides 128B memory with extended temperature range. Voltage supply 2.7V ~ 5.5V covers DS1307+ range. Lower current consumption (14-15µA). ROHS3 compliant, Active status.
M41T11M6F (STMicroelectronics): Matches DS1307+ memory size (56B) and feature set (Leap Year, NVSRAM). Voltage supply 2V ~ 5.5V encompasses DS1307+ range. Extended temperature -40°C ~ 85°C. ROHS3 compliant, Active status.

For Low-Power Applications:

AB0805-T3 (Abracon): Delivers ultra-low current (0.17-0.22µA @ 1.8V-3V). 256B memory. 16-VFQFN package. Active status, ROHS3 compliant. Requires PCB redesign for package footprint.
MCP79400-I/ST or MCP79401-I/SN (Microchip): Both provide 1.2µA typical current @ 3.3V. 64B memory. MCP79400 uses 8-TSSOP; MCP79401 uses 8-SOIC. Active status, ROHS3 compliant.

Avoid for New Designs:

BU9873FVM-GTTR (Rohm): Product status "Not For New Designs" disqualifies this part despite technical compatibility.

Frequently Asked Questions (FAQ)

Q: Can I use a surface-mount substitute in a through-hole socket? A: No. Surface-mount packages require PCB redesign with appropriate landing patterns. Through-hole and surface-mount are not interchangeable without board-level modifications.

Q: Does lower current consumption affect I2C communication compatibility? A: No. Current consumption differences do not impact I2C protocol compatibility. Lower current consumption represents improved power efficiency during timekeeping operation.

Q: Are all substitute parts backward-compatible with DS1307+ firmware? A: All listed substitutes maintain identical I2C interface, time format (HH:MM:SS 12/24hr), and date format (YY-MM-DD-dd). Register-level compatibility requires design verification, but protocol-level compatibility is assured.

Q: What is the significance of extended operating temperature ranges (-40°C ~ 85°C)? A: Extended ranges indicate qualification for industrial and automotive applications. DS1307+ operates 0°C ~ 70°C (consumer range). Substitutes with -40°C ~ 85°C support broader environmental conditions without performance degradation.

Q: Why do some substitutes show no battery voltage specification? A: Battery backup capability is not specified for all parts in the provided data. Absence of specification does not indicate lack of battery support; it indicates incomplete data provision. Consult manufacturer datasheets for complete battery specifications.

Q: Can I substitute based on memory size alone? A: No. Memory size is secondary to interface compatibility. All substitutes must maintain I2C, 2-Wire Serial interface with matching time/date formats. Memory size differences are acceptable provided the substitute meets or exceeds 56B.

Q: Is ROHS3 compliance mandatory for substitution? A: Yes. All listed substitutes maintain ROHS3 compliance matching the DS1307+. Non-compliant parts are excluded from this reference.

Q: What packaging considerations apply to the AB0805-T3? A: The AB0805-T3 uses 16-VFQFN (3x3mm) surface-mount package. This requires PCB redesign with fine-pitch landing patterns. It is not a drop-in replacement but offers significant power efficiency gains (0.17-0.22µA) for battery-powered applications.

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