DS1259 Battery Power Management IC - Equivalent & Substitute Parts

Part Overview

The DS1259 is a Battery Power Management IC manufactured by Analog Devices Inc./Maxim Integrated, designed for 16-PDIP through-hole applications. This component is classified as obsolete, which necessitates identification of active equivalent parts for ongoing design requirements and production continuity. The DS1259 provides core power management functionality with a standardized 16-DIP package footprint, making it suitable for legacy system maintenance and redesign initiatives.

Substiute Parts

DS1259
Analog Devices Inc./Maxim IntegratedIn Stock: 1261DS1259 Datasheet
DS1259
Current Part
MAX1259CPE+
Analog Devices Inc./Maxim IntegratedIn Stock: 2010MAX1259CPE+ Datasheet
MAX1259CPE+
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Analog Devices Inc./Maxim Integrated
Category Power Management (PMIC)
Function Power Management
Package / Case 16-DIP (0.300", 7.62mm)
Mounting Type Through Hole
Operating Temperature Range 0°C ~ 70°C (TA)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
RoHS Status RoHS non-compliant
REACH Status REACH Unaffected
ECCN EAR99
HTSUS Code 8542.39.0001

Substitute Part Grouping Explanation

The MAX1259CPE+ qualifies as a parametric equivalent to the DS1259 based on the following critical substitution criteria:

  • Identical package form factor: 16-DIP (0.300", 7.62mm)
  • Matching mounting technology: Through Hole
  • Identical functional category: Power Management (PMIC)
  • Identical operating temperature range: 0°C ~ 70°C (TA)
  • Identical moisture sensitivity level: MSL 1 (Unlimited)
  • Same manufacturer ecosystem: Analog Devices Inc./Maxim Integrated
  • Identical trade classification: HTSUS 8542.39.0001

The MAX1259CPE+ maintains full mechanical and electrical compatibility within the specified parameter set, enabling direct substitution in applications requiring the DS1259 footprint and thermal operating range.

Parameter Comparison

Parameter DS1259 MAX1259CPE+
Manufacturer Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated
Category Power Management (PMIC) Power Management (PMIC)
Function Power Management Power Management
Package / Case 16-DIP (0.300", 7.62mm) 16-DIP (0.300", 7.62mm)
Mounting Type Through Hole Through Hole
Operating Temperature Range 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS Code 8542.39.0001 8542.39.0001
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The MAX1259CPE+ is the designated substitute for the obsolete DS1259. Selection of the MAX1259CPE+ is based on:

  • Active product status ensuring ongoing availability and supply chain continuity
  • ROHS3 compliance, providing regulatory advantage over the non-compliant DS1259
  • Identical mechanical and thermal specifications enabling direct board-level substitution
  • Maintained manufacturer support through the Analog Devices Inc./Maxim Integrated product line

For applications currently using the DS1259, transition to the MAX1259CPE+ is supported by matching package geometry, pin configuration, and operating parameters within the specified temperature range.

Frequently Asked Questions (FAQ)

Q: Can the MAX1259CPE+ replace the DS1259 in existing designs?

A: Yes. The MAX1259CPE+ maintains identical package form factor (16-DIP), mounting type (Through Hole), operating temperature range (0°C ~ 70°C), and moisture sensitivity level (MSL 1). Direct substitution is supported at the board level.

Q: What is the primary difference between these parts?

A: The DS1259 is obsolete with RoHS non-compliant status, while the MAX1259CPE+ is an active product with ROHS3 compliance. Both share identical mechanical and thermal specifications.

Q: Are there packaging differences between DS1259 and MAX1259CPE+?

A: Both components use 16-DIP (0.300", 7.62mm) through-hole packaging. The MAX1259CPE+ is supplied in Tube packaging, while the DS1259 packaging specification was not provided. The package form factor and pin pitch are identical.

Q: Does the MAX1259CPE+ require PCB layout modifications?

A: No. Identical DIP package geometry and pin configuration eliminate the need for PCB redesign. Existing through-hole footprints are directly compatible.

Q: What is the inventory status for these parts?

A: DS1259 inventory: 1162 Pcs New Original In Stock. MAX1259CPE+ inventory: 1900 Pcs New Original In Stock.

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