Equivalent & Substitute Parts for DN3687GFPV

Part Overview

The DN3687GFPV is a 16-bit H8/300H Tiny microcontroller manufactured by Renesas Electronics Corporation, featuring 56KB FLASH program memory, 4KB RAM, and 512 bytes EEPROM. This device integrates I2C and SCI connectivity with peripheral functions including LVD, POR, PWM, and WDT capabilities. The part is classified as Obsolete, necessitating identification of equivalent alternatives for ongoing system support and new design considerations.

Substiute Parts

DN3687GFPV

Renesas Electronics CorporationIn Stock: 1002DN3687GFPV Datasheet

Current PartRFQ

HD64F3687GFPV

Renesas Electronics CorporationIn Stock: 2837HD64F3687GFPV Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the DN3687GFPV is determined by the following critical parameters:

• Core Processor Architecture: H8/300H Tiny series
• Memory Configuration: 56KB FLASH program memory, 4KB RAM minimum
• Electrical Specifications: 3V to 5.5V supply voltage range
• Package Format: 64-LQFP (10x10mm) surface mount
• Operating Temperature Range: -20°C to 75°C
• Connectivity: I2C and SCI interfaces
• Peripheral Set: LVD, POR, PWM, WDT functions

The HD64F3687GFPV qualifies as a direct substitute based on matching core processor, memory capacity, voltage specifications, package format, and operating temperature range. Variations in I/O count and EEPROM configuration do not preclude substitution when these parameters are not critical to system function.

Parameter Comparison

Engineering Selection Recommendations

The HD64F3687GFPV serves as a functional equivalent to the DN3687GFPV for applications requiring H8/300H Tiny architecture with 56KB FLASH and 4KB RAM. Both devices maintain identical electrical specifications, package format, and thermal operating range. The DN3687GFPV is classified as Obsolete, while the HD64F3687GFPV carries a Not For New Designs status. Selection between these parts should be based on inventory availability and design phase requirements. Both devices maintain ROHS3 compliance and identical regulatory classifications (EAR99, HTSUS 8542.31.0001), supporting equivalent use in compliant applications.

Frequently Asked Questions (FAQ)

Q: Can HD64F3687GFPV replace DN3687GFPV in existing designs?

A: Yes. Both devices share identical core processor architecture, memory configuration, voltage specifications, package format, and operating temperature range. The 64-LQFP package pinout and electrical interface are compatible.

Q: What are the differences between DN3687GFPV and HD64F3687GFPV?

A: The primary differences are I/O count (DN3687GFPV: 43 I/O; HD64F3687GFPV: 45 I/O) and EEPROM availability (DN3687GFPV: 512 x 8; HD64F3687GFPV: not specified). These variations do not affect core processor functionality or memory capacity.

Q: Are both parts suitable for new designs?

A: DN3687GFPV is classified as Obsolete. HD64F3687GFPV carries a Not For New Designs status. For new development, alternative H8/300H variants with active production status should be evaluated.

Q: Do both parts meet the same compliance standards?

A: Yes. Both DN3687GFPV and HD64F3687GFPV are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99 and HTSUS 8542.31.0001.

Q: What is the package compatibility between these parts?

A: Both devices use 64-LQFP (10x10mm) surface mount packaging with identical pinout and electrical characteristics, ensuring direct PCB compatibility.