DMTH3004LFG-7 Equivalent & Substitute Parts

Part Overview

The DMTH3004LFG-7 is an N-Channel MOSFET manufactured by Diodes Incorporated, rated for 30V drain-to-source voltage with 15A continuous drain current at 25°C (Ta) and 75A at case temperature (Tc). This device is housed in a PowerDI3333-8 surface mount package and is designed for power switching applications requiring efficient thermal management. The part maintains Active product status and is RoHS3 compliant with unlimited moisture sensitivity rating (MSL 1).

Equivalent and substitute parts are identified to provide design flexibility when the primary part is unavailable, when inventory constraints exist, or when application requirements allow for alternative devices with compatible electrical and mechanical specifications.

Substiute Parts

DMTH3004LFG-7

Diodes IncorporatedIn Stock: 1131DMTH3004LFG-7 Datasheet

Current PartRFQ

RJK03M5DPA-00#J5A

Renesas Electronics CorporationIn Stock: 30180RJK03M5DPA-00#J5A Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the DMTH3004LFG-7 is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Drain-to-Source Voltage (Vdss) must equal or exceed 30V
• Continuous drain current rating must support application requirements
• On-resistance (Rds On) characteristics must be compatible with switching losses and thermal design
• Gate threshold voltage must fall within acceptable drive circuit specifications
• Maximum gate voltage (Vgs Max) must accommodate drive signal levels

Mechanical Compatibility Criteria:

• Surface mount package type must be compatible with PCB layout and assembly process
• Thermal characteristics (power dissipation rating) must meet thermal management requirements
• Moisture sensitivity level and storage conditions must align with manufacturing processes

Compliance Requirements:

• RoHS3 compliance status must be maintained
• REACH status must be unaffected or compliant
• Product status must be Active

The substitute part RJK03M5DPA-00#J5A from Renesas Electronics Corporation meets these criteria with equivalent voltage rating, compatible package footprint, and superior current handling capability.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitution Criteria:

The RJK03M5DPA-00#J5A qualifies as a substitute for the DMTH3004LFG-7 based on the following factors:

1. Voltage Rating Compatibility: Both devices are rated for 30V Vdss, ensuring equivalent voltage stress handling in the application circuit.

2. Current Handling: The substitute is rated for 30A continuous drain current at 25°C, which exceeds the primary part's 15A rating. This provides design margin for applications operating at or below the primary part's current specification.

3. Compliance Status: Both parts maintain Active product status, RoHS3 compliance, unlimited MSL rating, and REACH unaffected status, ensuring regulatory and supply chain compatibility.

4. Thermal Characteristics: The substitute's 30W (Tc) power dissipation rating is lower than the primary part's 50W (Tc) rating. Applications requiring the full 50W dissipation capability at case temperature must evaluate thermal management requirements independently.

5. Operating Temperature: The substitute's maximum junction temperature of 150°C is lower than the primary part's 175°C rating. Applications requiring operation above 150°C require alternative selection.

6. Package Footprint: The 8-WFDFN Exposed Pad package differs from the 8-PowerVDFN package. PCB layout compatibility must be confirmed through package datasheet comparison before implementation.

7. Switching Characteristics: The substitute exhibits lower gate charge (10.4 nC vs. 44 nC) and lower input capacitance (1890 pF vs. 2370 pF), resulting in faster switching response and reduced drive circuit loading.

Selection Guidance:

Use the RJK03M5DPA-00#J5A substitute when:

• Application current requirements do not exceed 30A at 25°C
• Operating temperature does not exceed 150°C junction temperature
• Power dissipation at case temperature does not exceed 30W
• PCB layout accommodates the 8-WFDFN Exposed Pad package footprint
• Faster switching characteristics are acceptable or beneficial

Do not use the substitute when:

• Application requires continuous operation above 150°C junction temperature
• Thermal design requires power dissipation capability exceeding 30W at case temperature
• PCB layout is fixed to the 8-PowerVDFN package footprint without modification capability

Frequently Asked Questions (FAQ)

Q: Can the RJK03M5DPA-00#J5A be used as a direct replacement for the DMTH3004LFG-7 in existing designs?

A: Direct replacement requires verification of three factors: (1) PCB footprint compatibility between 8-PowerVDFN and 8-WFDFN Exposed Pad packages, (2) thermal design compatibility with the 30W (Tc) power dissipation limit, and (3) operating temperature requirements not exceeding 150°C junction temperature. If all three conditions are met, the substitute is electrically compatible.

Q: What are the key electrical differences between these two parts?

A: The primary electrical differences are: (1) the substitute has double the continuous drain current rating (30A vs. 15A at 25°C), (2) the substitute has lower gate charge (10.4 nC vs. 44 nC), resulting in faster switching, (3) the substitute has slightly higher on-resistance (6.5 mOhm vs. 5.5 mOhm), and (4) the substitute has lower input capacitance (1890 pF vs. 2370 pF). These differences result in lower switching losses but marginally higher conduction losses.

Q: Are both parts RoHS compliant?

A: Yes, both the DMTH3004LFG-7 and RJK03M5DPA-00#J5A are RoHS3 compliant with unlimited moisture sensitivity level (MSL 1) and REACH unaffected status.

Q: What is the impact of the different package types on PCB design?

A: The DMTH3004LFG-7 uses an 8-PowerVDFN package while the RJK03M5DPA-00#J5A uses an 8-WFDFN Exposed Pad package. Although both are 8-pin surface mount packages with exposed pads, the physical dimensions and pad layouts differ. PCB layout modifications may be required, including trace routing, thermal via placement, and solder mask design. Consult the respective manufacturer datasheets for precise package dimensions and thermal pad specifications.

Q: Which part should be selected for high-temperature applications?

A: The DMTH3004LFG-7 supports operating temperatures up to 175°C junction temperature, while the RJK03M5DPA-00#J5A is limited to 150°C. For applications requiring operation above 150°C, the DMTH3004LFG-7 is the appropriate selection.

Q: How do the thermal characteristics compare?

A: The DMTH3004LFG-7 is rated for 50W power dissipation at case temperature (Tc), while the RJK03M5DPA-00#J5A is rated for 30W at Tc. Applications with high power dissipation requirements should use the DMTH3004LFG-7 or select alternative parts with higher thermal ratings. The substitute is suitable for applications dissipating 30W or less at case temperature.

Q: What is the significance of the lower gate charge in the substitute part?

A: The RJK03M5DPA-00#J5A has a gate charge of 10.4 nC compared to 44 nC for the DMTH3004LFG-7. Lower gate charge results in faster switching transitions, reduced switching losses, and lower drive circuit current requirements. This characteristic is beneficial in high-frequency switching applications and reduces thermal stress on gate drive circuits.

Q: Are there inventory considerations for these parts?

A: The DMTH3004LFG-7 has 1,077 pieces in stock, while the RJK03M5DPA-00#J5A has 30,100 pieces in stock. The substitute part has significantly higher inventory availability, which may provide supply chain advantages for high-volume production or extended lead time mitigation.