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DM365ZCEZ Equivalent & Substitute Parts
Part Overview
The DM365ZCEZ is a Digital Media System-on-Chip (DMSoC) from Texas Instruments' TMS320DM3x DaVinci™ series, designed for embedded video and imaging applications. This 338-pin BGA device integrates a processor core with dedicated media acceleration capabilities, making it suitable for real-time digital signal processing in consumer electronics and industrial systems.
The DM365ZCEZ carries a Last Time Buy status, indicating that Texas Instruments has discontinued active production. This necessitates identifying functionally equivalent alternatives to ensure design continuity and supply chain reliability for ongoing production requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | DM365ZCEZ |
| Manufacturer | Texas Instruments |
| Series | TMS320DM3x, DaVinci™ |
| Package / Case | 338-LFBGA (13x13) |
| Type | Digital Media System-on-Chip (DMSoC) |
| Interface | EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB |
| Clock Rate | 300MHz |
| Voltage - Core | 1.20V |
| Voltage - I/O | 1.8V, 3.3V |
| Operating Temperature | 0°C ~ 85°C (TC) |
| Non-Volatile Memory | ROM (16kB) |
| On-Chip RAM | 56kB |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution eligibility for the DM365ZCEZ is determined by strict alignment across the following critical parameters:
Package Compatibility: Both the main part and substitute must use the 338-LFBGA (13x13) package to ensure PCB footprint and mechanical compatibility without redesign.
Interface Specification: The substitute must provide identical interface support (EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB) to maintain system-level connectivity without firmware or hardware modifications.
Power Supply Requirements: Core voltage (1.20V) and I/O voltage levels (1.8V, 3.3V) must match exactly to ensure compatibility with existing power distribution networks.
Memory Configuration: On-chip RAM (56kB) and ROM (16kB) must be identical to prevent software memory mapping conflicts.
Operating Temperature Range: The 0°C ~ 85°C specification must be maintained for thermal design consistency.
Compliance Standards: RoHS3 compliance and MSL rating (3, 168 Hours) must be preserved for manufacturing and environmental requirements.
The TMS320DM365ZCE21 meets all these criteria and is classified as the manufacturer-recommended substitute.
Parameter Comparison
| Parameter | DM365ZCEZ (Main Part) | TMS320DM365ZCE21 (Substitute) |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Series | TMS320DM3x, DaVinci™ | TMS320DM3x, DaVinci™ |
| Package / Case | 338-LFBGA (13x13) | 338-LFBGA (13x13) |
| Type | Digital Media System-on-Chip (DMSoC) | Digital Media System-on-Chip (DMSoC) |
| Interface | EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB | EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB |
| Clock Rate | 300MHz | 216MHz |
| Voltage - Core | 1.20V | 1.20V |
| Voltage - I/O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | 0°C ~ 85°C (TC) | 0°C ~ 85°C (TC) |
| Non-Volatile Memory | ROM (16kB) | ROM (16kB) |
| On-Chip RAM | 56kB | 56kB |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Last Time Buy | Active |
Engineering Selection Recommendations
The TMS320DM365ZCE21 is the manufacturer-recommended substitute for the DM365ZCEZ. Both devices maintain identical compliance certifications (ROHS3, REACH Unaffected) and share the same ECCN and HTSUS classifications, ensuring regulatory and export control consistency.
The primary difference between the two parts is the clock rate: the DM365ZCEZ operates at 300MHz, while the TMS320DM365ZCE21 operates at 216MHz. This reduction in clock frequency does not affect interface compatibility, memory configuration, or power supply requirements. System designers must evaluate whether the lower clock rate meets application performance requirements.
The TMS320DM365ZCE21 carries Active product status with significantly higher inventory availability (2200 units versus 862 units), providing superior supply chain stability for new designs and ongoing production.
Frequently Asked Questions (FAQ)
Q: Can the TMS320DM365ZCE21 be used as a direct replacement for the DM365ZCEZ without PCB modifications?
A: Yes. Both devices use the identical 338-LFBGA (13x13) package, ensuring footprint compatibility. No PCB redesign is required.
Q: What is the impact of the clock rate difference (300MHz vs. 216MHz)?
A: The TMS320DM365ZCE21 operates at a lower clock frequency. Applications must be evaluated to confirm that 216MHz processing performance is sufficient for the intended use case. This is an application-specific determination and does not affect electrical or mechanical compatibility.
Q: Are the power supply requirements identical?
A: Yes. Both parts require 1.20V core voltage and 1.8V/3.3V I/O voltage. Existing power distribution networks require no modification.
Q: Do both parts support the same interfaces?
A: Yes. Both devices provide identical interface support: EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, and USB. No firmware or hardware interface changes are necessary.
Q: Are there any compliance or certification differences?
A: No. Both parts are ROHS3 compliant, REACH unaffected, and share identical ECCN and HTSUS classifications. Regulatory requirements remain unchanged.
Q: What is the memory configuration for both parts?
A: Both devices feature 16kB ROM and 56kB on-chip RAM. Software memory mapping is identical.
Q: Which part should be selected for new designs?
A: The TMS320DM365ZCE21 is recommended for new designs due to its Active product status and higher inventory availability. The DM365ZCEZ is suitable only for legacy system support or existing production runs.
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