DLR1S1K-F Film Capacitor Equivalent & Substitute Parts

Part Overview

The DLR1S1K-F is a 10000 pF film capacitor manufactured by Cornell Dubilier Electronics (CDE), rated for 100V DC operation with ±10% tolerance. This part is classified as obsolete, necessitating identification of active equivalent components for continued system support and procurement. The part features polyester dielectric construction with radial through-hole mounting, suitable for general-purpose applications requiring stable capacitance characteristics across industrial temperature ranges.

Substiute Parts

DLR1S1K-F

Cornell Dubilier Electronics (CDE)In Stock: 732DLR1S1K-F Datasheet

Current PartRFQ

168103K100A-F

Cornell Dubilier Electronics (CDE)In Stock: 2081168103K100A-F Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the DLR1S1K-F is determined by the following critical parameters:

• Capacitance Value: 10000 pF (exact match required)
• Tolerance: ±10% (matches specification)
• Voltage Rating (DC): 100V (minimum requirement met)
• Voltage Rating (AC): 63V (minimum requirement met)
• Dielectric Material: Polyester-based construction
• Mounting Type: Through Hole radial configuration
• Termination Style: PC Pins

The substitute part 168103K100A-F meets all primary electrical parameters while offering enhanced reliability through active product status and extended operating temperature range. The metallized polyester dielectric variant provides equivalent capacitive performance with improved temperature stability.

Parameter Comparison

Engineering Selection Recommendations

The 168103K100A-F provides direct electrical and mechanical substitution for the obsolete DLR1S1K-F. Both parts maintain identical electrical ratings (10000 pF, ±10%, 100V DC, 63V AC) and comply with ROHS3 and REACH regulatory requirements. The substitute component offers the additional advantage of active product status with enhanced availability and extended operating temperature coverage (-55°C to 125°C versus -40°C to 85°C). The metallized polyester dielectric construction of the substitute provides equivalent performance characteristics within the specified tolerance range. Physical footprint variations exist (original: 6.50 x 4.00 mm, substitute: 7.20 x 2.50 mm), requiring PCB layout validation during implementation.

Frequently Asked Questions (FAQ)

Q: Can the 168103K100A-F directly replace the DLR1S1K-F in existing circuit designs?

A: Yes. Both components share identical electrical specifications (10000 pF capacitance, ±10% tolerance, 100V DC rating, 63V AC rating) and are both ROHS3 and REACH compliant. Physical dimensions differ slightly, requiring confirmation that the substitute's 7.20 x 2.50 mm body fits the available board space.

Q: What is the key difference between the dielectric materials of these two parts?

A: The DLR1S1K-F uses standard polyester film, while the 168103K100A-F uses metallized polyester. Both provide equivalent capacitive performance at the specified rating and tolerance, with the metallized variant offering improved temperature stability characteristics.

Q: Why does the substitute have a wider operating temperature range?

A: The 168103K100A-F (-55°C to 125°C) extends the temperature envelope compared to the DLR1S1K-F (-40°C to 85°C). This reflects advances in capacitor design and manufacturing. When the original part operated within its -40°C to 85°C range, the substitute is fully functional, making it compatible for the application.

Q: Are there any compliance or certification concerns with using the substitute?

A: No. Both parts maintain ROHS3 compliance and REACH unaffected status. Both are classified as MSL Level 1 (Unlimited), requiring no special moisture protection during storage or handling.

Q: What PCB layout considerations apply when switching from the DLR1S1K-F to the 168103K100A-F?

A: Lead spacing changes from 4.50 mm to 5.00 mm, and the physical body dimensions shift from 6.50 x 4.00 mm to 7.20 x 2.50 mm. Verify that the substitute's footprint accommodates the PCB hole pattern and component density constraints of your design.