DLP230GPFQP Digital Micromirror Device Equivalent & Substitute Parts

Part Overview

The DLP230GPFQP is a Digital Micromirror Device (DMD) manufactured by Texas Instruments in a 54-CLGA surface mount package. This component is classified as Obsolete product status. The DLP230GPFQP requires identification of equivalent substitute parts due to its obsolete classification and potential supply constraints. Substitute parts must maintain identical electrical specifications, mechanical compatibility, and package dimensions to ensure direct replacement capability in existing designs.

Substiute Parts

DLP230GPFQP

Texas InstrumentsIn Stock: 1443DLP230GPFQP Datasheet

Current PartRFQ

DLP230GPAFQP

Texas InstrumentsIn Stock: 1222DLP230GPAFQP Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the DLP230GPFQP is determined by the following critical parameters:

Electrical Compatibility: Base product number DLP230 defines the core digital micromirror device functionality and electrical interface.

Mechanical Compatibility: Package type 54-BFCLGA Module with supplier device package 54-CLGA (16.8x5.92) dimensions must be maintained for PCB layout and assembly compatibility.

Mounting Configuration: Surface mount technology requirement must be preserved.

Regulatory Compliance: ROHS3 compliance and EAR99 export classification must be maintained.

The substitute part DLP230GPAFQP shares the identical base product number, package specification, mounting type, and regulatory compliance status, establishing direct substitution eligibility.

Parameter Comparison

Engineering Selection Recommendations

DLP230GPAFQP is the direct substitute for DLP230GPFQP based on the following engineering criteria:

Product Status Alignment: The DLP230GPAFQP maintains Active product status, ensuring continued manufacturer support and supply availability compared to the Obsolete DLP230GPFQP.

Regulatory Compliance: Both parts maintain ROHS3 compliance and EAR99 export classification, satisfying regulatory requirements for equivalent substitution.

Package and Mechanical Specifications: Identical 54-BFCLGA Module package and 54-CLGA (16.8x5.92) dimensions ensure direct PCB compatibility without layout modifications.

Functional Equivalence: Both parts share the DLP230 base product number, confirming identical Digital Micromirror Device functionality and electrical interface specifications.

Packaging Format Difference: The DLP230GPAFQP is supplied in Tray packaging, whereas the DLP230GPFQP packaging format is not specified. This difference does not affect electrical or mechanical compatibility.

Frequently Asked Questions (FAQ)

Q: Can DLP230GPAFQP directly replace DLP230GPFQP in existing designs?

A: Yes. Both parts share identical base product number (DLP230), package specification (54-BFCLGA Module), supplier device package dimensions (54-CLGA 16.8x5.92), mounting type (Surface Mount), and regulatory compliance status (ROHS3, EAR99). Direct substitution is supported without design modifications.

Q: What is the primary difference between these two part numbers?

A: The DLP230GPFQP is classified as Obsolete, while the DLP230GPAFQP maintains Active product status. The DLP230GPAFQP is supplied in Tray packaging format. These differences do not affect electrical or mechanical compatibility.

Q: Are there any MSL (Moisture Sensitivity Level) considerations for substitution?

A: The DLP230GPFQP specifies MSL 1 (Unlimited), while the DLP230GPAFQP lists MSL as Not Applicable. Both specifications indicate minimal moisture sensitivity risk. Standard handling procedures for surface mount components apply to both parts.

Q: Do both parts meet the same regulatory and export requirements?

A: Yes. Both DLP230GPFQP and DLP230GPAFQP maintain ROHS3 compliance and EAR99 export classification, satisfying identical regulatory requirements.

Q: Is the 54-CLGA package dimension critical for PCB compatibility?

A: Yes. The 54-CLGA (16.8x5.92) package dimension is a critical mechanical specification. Both parts share identical dimensions, ensuring direct PCB footprint compatibility without layout modifications.