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DL5226B-TP Equivalent & Substitute Parts
Part Overview
The DL5226B-TP is a 3.3 V Zener diode rated at 500 mW, manufactured by Micro Commercial Co in a Mini MELF surface mount package. This component is classified as obsolete, necessitating identification of equivalent and substitute parts for ongoing design requirements and production continuity. Equivalent parts maintain identical electrical specifications and package compatibility, while substitute parts offer functional equivalence with potential package or performance variations that require design consideration.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Voltage - Zener (Nom) | 3.3 V |
| Tolerance | ±5% |
| Power - Max | 500 mW |
| Impedance (Max) | 28 Ohms |
| Current - Reverse Leakage @ Vr | 25 µA @ 1 V |
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 200 mA |
| Operating Temperature | -65°C ~ 175°C |
| Mounting Type | Surface Mount |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the DL5226B-TP is determined by the following critical parameters:
Electrical Equivalence Criteria:
- Zener voltage: 3.3 V nominal
- Power dissipation: 500 mW maximum
- Tolerance: ±5%
- Reverse leakage current: 25 µA @ 1 V (or lower)
- Forward voltage: 1.1 V @ 200 mA (or lower)
Mechanical Compatibility Criteria:
- Surface mount mounting type
- Package compatibility: DO-213AC/MINI-MELF/SOD-80 or equivalent footprint
Compliance Criteria:
- RoHS3 compliance preferred for new designs
- Operating temperature range: -65°C to 175°C or subset thereof
Substitute parts are grouped into two categories: direct package equivalents (Mini MELF) and alternative package formats (SOD-123, DO-213AA) that maintain electrical specifications but require PCB layout modification.
Parameter Comparison
| Part Number | Manufacturer | Vz (Nom) | Tolerance | Power Max | Zzt (Max) | Reverse Leakage @ 1V | Vf (Max) @ If | Temp Range | Package | Product Status | RoHS |
|---|---|---|---|---|---|---|---|---|---|---|---|
| DL5226B-TP | Micro Commercial Co | 3.3 V | ±5% | 500 mW | 28 Ω | 25 µA | 1.1 V @ 200 mA | -65°C ~ 175°C | Mini MELF | Obsolete | ROHS3 |
| MMSZ5226B-TP | Micro Commercial Co | 3.3 V | ±5% | 500 mW | 28 Ω | 25 µA | 900 mV @ 10 mA | -55°C ~ 150°C | SOD-123 | Active | ROHS3 |
| 1N5226BUR-1 | Microchip Technology | 3.3 V | ±5% | 500 mW | 28 Ω | 25 µA | 1.1 V @ 200 mA | -65°C ~ 175°C | DO-213AA | Active | Non-compliant |
| TZMC3V3-GS08 | Vishay General Semiconductor | 3.3 V | ±5% | 500 mW | 90 Ω | 2 µA | 1.5 V @ 200 mA | -55°C ~ 175°C | SOD-80 MiniMELF | Active | ROHS3 |
| TZMC3V3-GS18 | Vishay General Semiconductor | 3.3 V | ±5% | 500 mW | 90 Ω | 2 µA | 1.5 V @ 200 mA | -55°C ~ 175°C | SOD-80 MiniMELF | Active | ROHS3 |
| TZMC3V3-M-08 | Vishay General Semiconductor | 3.3 V | ±5% | 500 mW | 90 Ω | 2 µA | 1.5 V @ 200 mA | -65°C ~ 175°C | SOD-80 MiniMELF | Active | ROHS3 |
| TZMC3V3-M-18 | Vishay General Semiconductor | 3.3 V | ±5% | 500 mW | 90 Ω | 2 µA | 1.5 V @ 200 mA | -65°C ~ 175°C | SOD-80 MiniMELF | Active | ROHS3 |
Engineering Selection Recommendations
Direct Package Equivalents (Mini MELF / SOD-80):
TZMC3V3-M-08 and TZMC3V3-M-18 (Vishay) are the preferred substitutes for the DL5226B-TP. Both parts maintain the Mini MELF package format, eliminating PCB layout modifications. These parts are active products with AEC-Q101 automotive qualification, ROHS3 compliance, and operating temperature range of -65°C to 175°C, matching the original specification. The Vishay parts feature lower reverse leakage current (2 µA versus 25 µA) and higher impedance (90 Ω versus 28 Ω), which represent improved performance characteristics. The primary difference between TZMC3V3-M-08 and TZMC3V3-M-18 is packaging format (Cut Tape versus Tape & Reel).
TZMC3V3-GS08 and TZMC3V3-GS18 (Vishay) are functionally equivalent alternatives in SOD-80 MiniMELF package. These parts are active with AEC-Q101 qualification and ROHS3 compliance. The operating temperature range is -55°C to 175°C, which is narrower than the original part at the lower end. Selection between GS08 and GS18 variants depends on packaging requirements (Cut Tape & Digi-Reel versus Tape & Reel).
Alternative Package Formats:
MMSZ5226B-TP (Micro Commercial Co) is an active product in SOD-123 package with identical electrical specifications to the original part except for forward voltage measurement conditions (900 mV @ 10 mA versus 1.1 V @ 200 mA). Operating temperature range is -55°C to 150°C. This part requires PCB layout modification due to package change but maintains the same manufacturer and ROHS3 compliance.
1N5226BUR-1 (Microchip Technology) is an active product in DO-213AA package with identical electrical specifications and operating temperature range (-65°C to 175°C) to the original part. This part is not RoHS3 compliant and should be selected only when RoHS compliance is not a design requirement.
Compliance Considerations:
For new designs requiring RoHS3 compliance, select from TZMC3V3-M-08, TZMC3V3-M-18, TZMC3V3-GS08, TZMC3V3-GS18, or MMSZ5226B-TP. For applications with no RoHS requirement, 1N5226BUR-1 is available as an alternative.
Frequently Asked Questions (FAQ)
Q: Can TZMC3V3-M-08 be used as a direct replacement for DL5226B-TP without PCB modification?
A: Yes. Both parts use the Mini MELF (SOD-80) package format with identical footprints. No PCB layout changes are required. The Vishay part offers improved performance with lower reverse leakage current and maintains the full -65°C to 175°C operating temperature range.
Q: What is the difference between TZMC3V3-M-08 and TZMC3V3-GS08?
A: Both parts are Vishay 3.3 V Zener diodes in SOD-80 MiniMELF package with identical electrical specifications. The primary difference is operating temperature range: TZMC3V3-M-08 operates from -65°C to 175°C, while TZMC3V3-GS08 operates from -55°C to 175°C. Select TZMC3V3-M-08 for applications requiring the full lower temperature range.
Q: Why does MMSZ5226B-TP have a different forward voltage specification?
A: Forward voltage is measured under different test conditions. MMSZ5226B-TP specifies 900 mV @ 10 mA, while DL5226B-TP specifies 1.1 V @ 200 mA. Both measurements are valid for the same device under different bias conditions. The lower measurement current in MMSZ5226B-TP results in lower forward voltage.
Q: Is 1N5226BUR-1 suitable for new production designs?
A: 1N5226BUR-1 is electrically equivalent and active in production. However, it is not RoHS3 compliant. Use this part only in applications where RoHS compliance is not required. For new designs, Vishay TZMC3V3 series or Micro Commercial MMSZ5226B-TP are preferred.
Q: What is the significance of the impedance difference between DL5226B-TP (28 Ω) and Vishay parts (90 Ω)?
A: Impedance (Zzt) is the dynamic impedance of the Zener diode at specified test conditions. Higher impedance (90 Ω) indicates slightly different internal characteristics but does not affect functional equivalence for standard voltage regulation applications. Both values are within acceptable ranges for 3.3 V Zener diodes.
Q: Can MMSZ5226B-TP be used in applications requiring -65°C operation?
A: No. MMSZ5226B-TP operates from -55°C to 150°C. For applications requiring -65°C minimum operating temperature, select TZMC3V3-M-08, TZMC3V3-M-18, or 1N5226BUR-1.
Q: What packaging format should be selected for high-volume production?
A: Tape & Reel (TR) packaging is standard for high-volume surface mount assembly. Select TZMC3V3-M-18, TZMC3V3-GS18, or MMSZ5226B-TP for Tape & Reel format. Cut Tape (CT) format is suitable for lower-volume or prototype applications.
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