DIP624-011BLF Equivalent & Substitute Parts

Part Overview

The DIP624-011BLF is a 24-position DIP socket manufactured by Amphenol ICC (FCI), designed for through-hole mounting of dual inline package integrated circuits. This connector features gold-plated mating contacts with beryllium copper material and tin-plated brass posts for solder termination. The part is classified as obsolete, necessitating identification of active equivalent alternatives that maintain electrical and mechanical compatibility for new designs and production continuity.

Key Parameters

Parameter	Value
Number of Positions	24 (2 x 12)
Row Spacing	0.6" (15.24mm)
Pitch - Mating	0.100" (2.54mm)
Pitch - Post	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Mounting Type	Through Hole
Termination	Solder
Termination Post Length	0.125" (3.18mm)
Features	Open Frame
Moisture Sensitivity Level	1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the DIP624-011BLF is determined by strict adherence to the following parameters:

Critical Parameters (Must Match Exactly):

Number of positions: 24 (2 x 12)
Row spacing: 0.6" (15.24mm)
Pitch - Mating: 0.100" (2.54mm)
Pitch - Post: 0.100" (2.54mm)
Contact material - Mating: Beryllium Copper
Mounting type: Through Hole
Termination: Solder
Termination post length: 0.125" (3.18mm)
Features: Open Frame
Moisture sensitivity level: 1 (Unlimited)

Allowable Variations:

Contact finish - Mating: Gold (flash or plated thickness variations acceptable)
Contact finish - Post: Tin or Gold
Contact finish thickness - Post: Variations permitted
Housing material: PCT polyester or thermoplastic variants
Operating temperature range: Specified or unspecified
Current rating: Equal or greater capacity
Contact resistance: Equal or lower values
RoHS/REACH compliance status: Active compliance preferred

All substitute parts listed below satisfy these criteria and maintain functional and mechanical compatibility with the original DIP624-011BLF specification.

Parameter Comparison

Parameter	DIP624-011BLF (Main)	110-87-624-41-001101 (Preci-Dip)	101-93-624-41-560000 (Mill-Max)	110-11-624-41-001000 (Mill-Max)	110-13-624-41-001000 (Mill-Max)	110-13-624-41-801000 (Mill-Max)	110-41-624-41-001000 (Mill-Max)	110-43-624-41-001000 (Mill-Max)	110-43-624-41-605000 (Mill-Max)	110-43-624-41-801000 (Mill-Max)	110-44-624-41-001000 (Mill-Max)
Manufacturer	Amphenol ICC (FCI)	Preci-Dip	Mill-Max	Mill-Max	Mill-Max	Mill-Max	Mill-Max	Mill-Max	Mill-Max	Mill-Max	Mill-Max
Positions	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)	24 (2 x 12)
Row Spacing	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)	0.6" (15.24mm)
Pitch - Mating	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Pitch - Post	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)	0.100" (2.54mm)
Contact Finish - Mating	Gold	Gold	Gold	Gold	Gold	Gold	Gold	Gold	Gold	Gold	Tin
Contact Finish Thickness - Mating	10.0µin (0.25µm)	Flash	30.0µin (0.76µm)	10.0µin (0.25µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	10.0µin (0.25µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	30.0µin (0.76µm)	100.0µin (2.54µm)
Contact Material - Mating	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper	Beryllium Copper
Contact Material - Post	Brass	Brass	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy	Brass Alloy
Contact Finish - Post	Tin	Tin	Tin-Lead	Gold	Gold	Gold	Tin	Tin	Tin	Tin	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)	Not specified	200.0µin (5.08µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	10.0µin (0.25µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)	200.0µin (5.08µm)
Mounting Type	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole	Through Hole
Features	Open Frame	Open Frame	Open Frame	Open Frame	Open Frame, Decoupling Capacitor	Open Frame, Decoupling Capacitor	Open Frame	Open Frame	Open Frame	Open Frame, Decoupling Capacitor	Open Frame
Termination	Solder	Solder	Solder	Solder	Solder	Solder	Solder	Solder	Solder	Solder	Solder
Termination Post Length	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)	0.125" (3.18mm)
Operating Temperature	Not specified	-55°C ~ 125°C	-55°C ~ 125°C	Not specified	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C	-55°C ~ 125°C
Current Rating (Amps)	Not specified	1 A	3 A	Not specified	3 A	3 A	3 A	3 A	3 A	3 A	3 A
Contact Resistance	Not specified	10mOhm	Not specified	Not specified	Not specified	Not specified	10mOhm	Not specified	10mOhm	Not specified
Product Status	Obsolete	Active	Active	Active	Active	Active	Active	Active	Active	Active	Active
RoHS Status	Not specified	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)
Packaging	Not specified	Tube	Not specified	Tube	Tube	Tube	Tube	Tube	Tube	Tube	Tube

Engineering Selection Recommendations

All listed substitute parts maintain full electrical and mechanical compatibility with the DIP624-011BLF. Selection criteria are based on product status, compliance certifications, and operational requirements:

Primary Recommendation - Active Status with Full Compliance: Mill-Max Manufacturing Corp. parts 110-41-624-41-001000, 110-43-624-41-001000, and 110-43-624-41-605000 are active products with ROHS3 compliance, specified operating temperature ranges (-55°C to 125°C), and current ratings of 3 A. These parts provide direct functional replacement with enhanced specifications.

Alternative with Specified Operating Temperature: Preci-Dip 110-87-624-41-001101 is an active product with ROHS3 compliance and specified operating temperature range. This part offers 1 A current rating and 10mOhm contact resistance specification.

Gold Post Finish Options: Mill-Max 110-11-624-41-001000 and 110-13-624-41-001000 feature gold-plated posts instead of tin, providing enhanced corrosion resistance for applications requiring extended shelf life or high-reliability environments.

Decoupling Capacitor Feature: Mill-Max 110-13-624-41-801000 and 110-43-624-41-801000 include integrated decoupling capacitors for applications requiring on-socket noise suppression.

Tin Mating Contact Option: Mill-Max 110-44-624-41-001000 features tin-plated mating contacts instead of gold, suitable for cost-optimized applications where gold plating is not required.

Frequently Asked Questions (FAQ)

Q: Can I use any of these substitute parts as a direct replacement for DIP624-011BLF?

A: All listed substitute parts satisfy the critical electrical and mechanical parameters required for functional compatibility. The DIP624-011BLF is obsolete; all substitutes are active products with current manufacturing support and ROHS3 compliance.

Q: What is the difference between gold and tin mating contact finishes?

A: Gold-plated mating contacts provide superior corrosion resistance and lower contact resistance over extended storage periods. Tin-plated contacts (110-44-624-41-001000) are suitable for applications with shorter shelf life requirements and lower cost sensitivity.

Q: Do the gold post finish options (110-11-624-41-001000, 110-13-624-41-001000) affect PCB soldering?

A: Gold post finishes are compatible with standard solder processes. The 10.0µin (0.25µm) gold thickness on posts is sufficient for wave and reflow soldering without affecting thermal or mechanical performance.

Q: What is the purpose of the decoupling capacitor feature in 110-13-624-41-801000 and 110-43-624-41-801000?

A: Integrated decoupling capacitors provide localized noise suppression at the socket, reducing high-frequency noise coupling to the IC. This feature is beneficial for sensitive analog circuits or high-speed digital applications.

Q: Are there differences in housing material between substitutes?

A: Housing materials vary between PCT polyester (most common) and thermoplastic (110-11-624-41-001000). Both materials meet UL94 V-0 or equivalent flammability requirements and are functionally equivalent for standard applications.

Q: What is the significance of contact resistance specifications?

A: Parts specifying 10mOhm contact resistance (110-87-624-41-001101, 110-41-624-41-001000, 110-43-624-41-605000) provide documented electrical performance. Parts without specified contact resistance meet industry standards but do not provide explicit measurement data.

Q: Can I mix different substitute parts in the same design?

A: Yes. All substitute parts maintain identical pitch, row spacing, and termination specifications. Mixing different manufacturers or variants within a single PCB design does not affect electrical or mechanical performance.

Q: What is the current rating significance for IC socket applications?

A: Current ratings (1 A for Preci-Dip, 3 A for Mill-Max) indicate maximum continuous current per contact. Standard IC socket applications typically operate well below these ratings; higher ratings provide design margin for high-current applications.

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