DFB2580 Bridge Rectifier Equivalent & Substitute Parts

Part Overview

The DFB2580 is a single-phase bridge rectifier manufactured by onsemi, rated for 800 V peak reverse voltage and 25 A average rectified current. This component is classified as "Not For New Designs," indicating it has reached end-of-life status. Finding equivalent or substitute parts is necessary for maintenance, repair, and legacy system support where the original component is no longer readily available or when design flexibility permits component selection from active product lines.

Substiute Parts

DFB2580
onsemiIn Stock: 1465DFB2580 Datasheet
DFB2580
Current Part
GBJ2508
SMC Diode SolutionsIn Stock: 15400GBJ2508 Datasheet
GBJ2508
Similar
TS25P06G
Taiwan Semiconductor CorporationIn Stock: 1396TS25P06G Datasheet
TS25P06G
Parametric Equivalent
TS25P06GH
Taiwan Semiconductor CorporationIn Stock: 2124TS25P06GH Datasheet
TS25P06GH
Parametric Equivalent

Key Parameters

Parameter Value
Diode Type Single Phase
Technology Standard
Voltage - Peak Reverse (Max) 800 V
Current - Average Rectified (Io) 25 A
Voltage - Forward (Vf) (Max) 1.1 V
Current - Reverse Leakage @ Vr 10 µA @ 800 V
Operating Temperature Range -55°C ~ 150°C (TJ)
Mounting Type Through Hole
Package / Case 4-SIP, TS-6P
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the DFB2580 is determined by the following critical parameters:

  • Voltage Rating: Peak reverse voltage must be 800 V or greater
  • Current Rating: Average rectified current must be 25 A or greater
  • Diode Type: Single phase bridge rectifier configuration
  • Technology: Standard rectifier technology
  • Mounting Type: Through hole mounting
  • Forward Voltage: Maximum forward voltage of 1.1 V or less
  • Reverse Leakage: Maximum 10 µA at 800 V
  • Operating Temperature: -55°C to 150°C or wider range
  • RoHS Compliance: ROHS3 compliant

All substitute parts listed meet or exceed these electrical and mechanical parameters. Package variations (TS-6P vs. GBJ) are acceptable provided the through-hole mounting footprint is compatible with the application circuit board design.

Parameter Comparison

Parameter DFB2580 (onsemi) GBJ2508 (SMC Diode Solutions) TS25P06G (Taiwan Semiconductor) TS25P06GH (Taiwan Semiconductor)
Diode Type Single Phase Single Phase Single Phase Single Phase
Technology Standard Standard Standard Standard
Voltage - Peak Reverse (Max) 800 V 800 V 800 V 800 V
Current - Average Rectified (Io) 25 A 25 A 25 A 25 A
Voltage - Forward (Vf) (Max) 1.1 V @ 25 A 1.1 V @ 12.5 A 1.1 V @ 15 A 1.1 V @ 25 A
Current - Reverse Leakage @ Vr 10 µA @ 800 V 10 µA @ 800 V 10 µA @ 800 V 10 µA @ 800 V
Operating Temperature -55°C ~ 150°C -55°C ~ 150°C -55°C ~ 150°C -55°C ~ 150°C
Mounting Type Through Hole Through Hole Through Hole Through Hole
Package / Case 4-SIP, TS-6P 4-ESIP, GBJ 4-SIP, TS-6P 4-SIP, TS-6P
Product Status Not For New Designs Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

GBJ2508 (SMC Diode Solutions): This part is electrically equivalent with identical voltage and current ratings. It carries active product status and full ROHS3 compliance. The package differs (GBJ vs. TS-6P), requiring verification of PCB footprint compatibility. Forward voltage specification is provided at 12.5 A rather than 25 A, which is acceptable for applications operating below maximum current. This part is suitable for general replacement applications where package footprint can be accommodated.

TS25P06G (Taiwan Semiconductor): This part provides parametric equivalence with matching voltage and current ratings in the same TS-6P package as the original DFB2580. Active product status and ROHS3 compliance are confirmed. Forward voltage is specified at 15 A, which is within the operating range. This part is the preferred choice for direct package compatibility and minimal PCB redesign.

TS25P06GH (Taiwan Semiconductor): This part is a parametric equivalent with identical electrical specifications to the DFB2580, including forward voltage at 25 A. It maintains the TS-6P package for direct compatibility. This part includes automotive-grade qualification (AEC-Q101), providing additional reliability assurance for applications requiring automotive or high-reliability standards. Active product status and ROHS3 compliance are confirmed. This part is the optimal selection for applications requiring automotive qualification or enhanced reliability margins.

Frequently Asked Questions (FAQ)

Q: Can GBJ2508 be used as a direct replacement for DFB2580?

A: GBJ2508 meets all electrical requirements (800 V, 25 A, 1.1 V forward voltage, 10 µA reverse leakage). However, the package differs (GBJ vs. TS-6P). PCB footprint compatibility must be verified before substitution. If the through-hole mounting pattern accommodates the GBJ package, electrical substitution is valid.

Q: What is the difference between TS25P06G and TS25P06GH?

A: Both parts are electrically equivalent with identical voltage and current ratings. TS25P06GH includes automotive-grade qualification (AEC-Q101) and specifies forward voltage at the full 25 A rating, whereas TS25P06G specifies forward voltage at 15 A. For automotive or high-reliability applications, TS25P06GH is preferred. For general industrial applications, TS25P06G is acceptable.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. DFB2580, GBJ2508, TS25P06G, and TS25P06GH are all ROHS3 compliant, meeting environmental and hazardous substance restrictions.

Q: Can I use these substitutes in new designs?

A: Yes. GBJ2508, TS25P06G, and TS25P06GH all carry active product status, making them suitable for new designs. The original DFB2580 is marked "Not For New Designs" and should not be used in new applications.

Q: What is the operating temperature range for all substitute parts?

A: All parts, including DFB2580 and its substitutes, operate across -55°C to 150°C (TJ), providing identical thermal performance.

Q: Do package differences affect electrical performance?

A: No. Package differences (TS-6P vs. GBJ) are mechanical and do not affect electrical performance. Both packages are through-hole configurations suitable for standard PCB assembly. Footprint compatibility must be verified during design integration.

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