Equivalent & Substitute Parts for DF38076RH4V

Part Overview

The DF38076RH4V is a 16-bit H8/300H SLP microcontroller manufactured by Renesas Electronics Corporation, featuring 52KB FLASH memory and operating at 4MHz. This device is actively produced and widely used in embedded applications requiring low-power operation across industrial and consumer segments. Finding equivalent or substitute parts becomes necessary when addressing supply constraints, design optimization requirements, or when transitioning to newer microcontroller architectures that offer enhanced performance or expanded feature sets while maintaining functional compatibility within system constraints.

Key Parameters

Parameter	DF38076RH4V
Manufacturer	Renesas Electronics Corporation
Core Processor	H8/300H
Core Size	16-Bit
Speed	4MHz
Program Memory Size	52KB FLASH
RAM Size	2K x 8
Number of I/O	55
Voltage Supply (Vcc/Vdd)	1.8V ~ 3.6V
Package Type	80-BQFP (14x14)
Mounting Type	Surface Mount
Operating Temperature	-20°C ~ 75°C
RoHS Status	ROHS3 Compliant
Product Status	Active

Substitute Part Grouping Explanation

Substitution of the DF38076RH4V with the R5F10WMEAFA#30 is based on the following alignment criteria:

Common Parameters Supporting Substitution:

Manufacturer: Both manufactured by Renesas Electronics Corporation
Core Size: Both are 16-bit microcontrollers
Package Form Factor: Both use 80-pin QFP packages (80-BQFP and 80-LQFP respectively) with identical 14x14mm footprint
Mounting Type: Both are surface mount devices
RoHS Compliance: Both meet ROHS3 requirements
Product Status: Both are actively produced

Parameters Requiring Design Evaluation:

Operating frequency differs (4MHz vs. 24MHz)
Program memory capacity differs (52KB vs. 64KB)
RAM capacity differs (2K x 8 vs. 4K x 8)
Voltage supply range differs (1.8V~3.6V vs. 1.6V~5.5V)
Operating temperature range differs (-20°C~75°C vs. -40°C~85°C)
Peripheral feature sets differ (LCD, POR, PWM, WDT vs. DMA, LCD, LVD, POR, PWM, WDT)

Parameter Comparison

Parameter	DF38076RH4V	R5F10WMEAFA#30	Compatibility Notes
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Same manufacturer
Core Size	16-Bit	16-Bit	Identical
Speed	4MHz	24MHz	Substitute offers 6x higher frequency
Program Memory Size	52KB FLASH	64KB FLASH	Substitute provides 12KB additional capacity
RAM Size	2K x 8	4K x 8	Substitute provides 2KB additional capacity
Number of I/O	55	58	Substitute provides 3 additional I/O pins
Voltage Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.6V ~ 5.5V	Substitute supports wider voltage range
Data Converters	A/D 8x10b	A/D 12x10b	Substitute offers higher resolution ADC
Package Type	80-BQFP (14x14)	80-LQFP (14x14)	Identical footprint, different package designation
Operating Temperature	-20°C ~ 75°C	-40°C ~ 85°C	Substitute supports extended temperature range
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Both compliant
Product Status	Active	Active	Both actively produced

Engineering Selection Recommendations

Both the DF38076RH4V and R5F10WMEAFA#30 are actively produced Renesas microcontrollers with ROHS3 compliance and identical physical footprints. Selection between these devices depends on application-specific requirements:

The DF38076RH4V remains the appropriate choice for applications with established firmware, fixed low-frequency operation requirements, and constrained power budgets where the 4MHz speed and lower supply voltage range are sufficient.

The R5F10WMEAFA#30 is suitable as a substitute when applications require higher processing speed, expanded memory capacity, enhanced ADC resolution, or operation across a wider voltage and temperature range. The RL78/L13 architecture provides additional peripherals including DMA and LVD functionality not present in the H8/300H variant.

Both devices maintain identical package footprints and surface mount characteristics, enabling direct PCB layout compatibility. Firmware migration from H8/300H to RL78 architecture requires code porting and recompilation due to different instruction set architectures.

Frequently Asked Questions (FAQ)

Q: Can the R5F10WMEAFA#30 be used as a direct pin-for-pin replacement for the DF38076RH4V?

A: Both devices use 80-pin QFP packages with identical 14x14mm footprints, enabling direct PCB placement compatibility. However, pin functionality differs between the H8/300H and RL78 architectures, requiring firmware modification and validation before deployment.

Q: What are the key differences in memory architecture between these devices?

A: The DF38076RH4V provides 52KB FLASH and 2KB RAM, while the R5F10WMEAFA#30 provides 64KB FLASH, 4KB RAM, and 4KB EEPROM. Applications requiring larger data storage or runtime memory may benefit from the substitute device.

Q: Are there voltage supply considerations when substituting these devices?

A: The DF38076RH4V operates within 1.8V to 3.6V, while the R5F10WMEAFA#30 operates within 1.6V to 5.5V. The substitute device accommodates a wider supply range, providing flexibility in power supply design. Existing power delivery circuits designed for the original device remain compatible with the substitute.

Q: How do the operating temperature ranges compare?

A: The DF38076RH4V operates from -20°C to 75°C, while the R5F10WMEAFA#30 operates from -40°C to 85°C. Applications requiring extended temperature operation benefit from the substitute device's wider thermal specification.

Q: What firmware considerations apply when transitioning from DF38076RH4V to R5F10WMEAFA#30?

A: Both devices are manufactured by Renesas but use different processor cores (H8/300H versus RL78). Complete firmware recompilation and functional testing are required. Renesas provides development tools and migration guides for transitioning between these architectures.

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