Equivalent & Substitute Parts for DF38076RH10V

Part Overview

The DF38076RH10V is a 16-bit H8/300H SLP microcontroller manufactured by Renesas Electronics Corporation, featuring 52KB FLASH memory and operating at 10MHz. This device is classified as Active product status and is RoHS3 compliant. Finding equivalent or substitute parts may be necessary due to inventory constraints, end-of-life considerations, or application-specific performance requirements that demand higher processing speeds or expanded memory capacity.

Substiute Parts

DF38076RH10V
Renesas Electronics CorporationIn Stock: 908DF38076RH10V Datasheet
DF38076RH10V
Current Part
R5F10WMEAFA#30
Renesas Electronics CorporationIn Stock: 1579R5F10WMEAFA#30 Datasheet
R5F10WMEAFA#30
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Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Speed 10MHz
Program Memory Size 52KB FLASH
RAM Size 2K x 8
Number of I/O 55
Voltage Supply (Vcc/Vdd) 2.7V ~ 3.6V
Data Converters A/D 8x10b
Operating Temperature -20°C ~ 75°C
Package 80-BQFP (14x14)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

The R5F10WMEAFA#30 qualifies as a substitute based on the following alignment criteria:

Manufacturer Consistency: Both parts are manufactured by Renesas Electronics Corporation, ensuring design philosophy and quality standards alignment.

Package Compatibility: Both devices utilize 80-pin QFP packages with identical 14x14mm footprints (80-BQFP and 80-LQFP), enabling direct PCB layout compatibility without redesign.

Core Architecture: Both are 16-bit microcontrollers with surface mount technology, maintaining functional equivalence at the system integration level.

Compliance Alignment: Both parts carry RoHS3 compliance and identical MSL ratings (3, 168 Hours), ensuring environmental and moisture handling requirements are met.

Connectivity Features: Both devices include I2C connectivity and PWM peripherals, supporting common embedded system interfaces.

Memory Architecture: Both employ FLASH-based program memory with internal oscillators, maintaining firmware deployment methodology.

The R5F10WMEAFA#30 represents an enhanced variant with increased processing speed (24MHz vs. 10MHz), expanded program memory (64KB vs. 52KB), and extended operating temperature range (-40°C ~ 85°C vs. -20°C ~ 75°C).

Parameter Comparison

Parameter DF38076RH10V R5F10WMEAFA#30
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Core Size 16-Bit 16-Bit
Speed 10MHz 24MHz
Program Memory Size 52KB FLASH 64KB FLASH
RAM Size 2K x 8 4K x 8
Number of I/O 55 58
Voltage Supply (Vcc/Vdd) 2.7V ~ 3.6V 1.6V ~ 5.5V
Data Converters A/D 8x10b A/D 12x10b
Operating Temperature -20°C ~ 75°C -40°C ~ 85°C
Package 80-BQFP (14x14) 80-LQFP (14x14)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

For Direct Substitution: The R5F10WMEAFA#30 is suitable as a substitute when the application can accommodate the RL78 architecture and does not require strict H8/300H processor compatibility. Both parts maintain Active product status and full RoHS3 compliance.

Performance Considerations: The R5F10WMEAFA#30 offers 2.4x higher clock speed and 12KB additional FLASH memory, supporting applications with increased computational demands or larger firmware footprints.

Voltage Supply Flexibility: The R5F10WMEAFA#30 operates across a wider supply voltage range (1.6V ~ 5.5V) compared to the DF38076RH10V (2.7V ~ 3.6V), providing greater design flexibility for multi-voltage system integration.

Temperature Range Extension: The R5F10WMEAFA#30 supports extended operating temperatures (-40°C ~ 85°C), enabling deployment in industrial and automotive environments beyond the DF38076RH10V specification.

Compliance Assurance: Both parts maintain identical RoHS3 and MSL certifications, ensuring regulatory and manufacturing process compatibility.

Frequently Asked Questions (FAQ)

Q: Can the R5F10WMEAFA#30 be used as a direct pin-for-pin replacement?

A: Both devices use 80-pin QFP packages with identical 14x14mm footprints. However, pin functionality differs between the H8/300H and RL78 architectures. PCB layout compatibility exists, but firmware and peripheral configuration require validation against the RL78/L13 datasheet.

Q: What are the key differences in memory architecture?

A: The DF38076RH10V provides 52KB FLASH and 2KB RAM. The R5F10WMEAFA#30 provides 64KB FLASH, 4KB RAM, and 4KB EEPROM. Applications requiring persistent data storage benefit from the EEPROM addition in the substitute part.

Q: Are both parts suitable for industrial temperature applications?

A: The DF38076RH10V operates from -20°C to 75°C. The R5F10WMEAFA#30 extends to -40°C to 85°C, making it suitable for wider industrial temperature ranges. Application requirements determine which specification is appropriate.

Q: What connectivity differences exist between these parts?

A: The DF38076RH10V includes I2C, IrDA, and SCI connectivity. The R5F10WMEAFA#30 includes CSI, I2C, LINbus, and UART/USART. Both support I2C; application-specific protocols must be verified against system requirements.

Q: Do both parts meet the same compliance standards?

A: Yes. Both parts are RoHS3 compliant, REACH unaffected, and carry identical MSL ratings (3, 168 Hours), ensuring equivalent environmental and manufacturing compliance.

Q: What is the impact of the 24MHz vs. 10MHz speed difference?

A: The R5F10WMEAFA#30 operates at 2.4x the clock speed, enabling faster instruction execution and reduced latency for time-critical operations. Applications with lower performance requirements can operate the substitute part at reduced clock speeds if power consumption is a constraint.

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