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Equivalent & Substitute Parts for DF36902GFHV
Part Overview
The DF36902GFHV is a 16-bit H8/300H Tiny Microcontroller manufactured by Renesas Electronics Corporation, featuring 8KB FLASH memory and a 32-LQFP package. This device is classified as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing design requirements and production continuity. The part operates at 12MHz with a supply voltage range of 3V to 5.5V and includes integrated peripherals such as PWM, WDT, LVD, and POR functionality.
Substiute Parts
Key Parameters
| Parameter | DF36902GFHV |
|---|---|
| Manufacturer | Renesas Electronics Corporation |
| Core Processor | H8/300H |
| Core Size | 16-Bit |
| Speed | 12MHz |
| Program Memory Size | 8KB (8K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 1.5K x 8 |
| Voltage Supply (Vcc/Vdd) | 3V ~ 5.5V |
| Number of I/O | 18 |
| Package / Case | 32-LQFP (7x7) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution of the DF36902GFHV is determined by the following critical parameters:
Package Compatibility: Both the main part and substitute must use the 32-LQFP (7x7) surface mount package to ensure PCB footprint compatibility without redesign.
Memory Configuration: The 8KB FLASH program memory is a core functional requirement. The substitute part must provide equivalent or greater FLASH capacity.
Supply Voltage Range: The substitute must operate within or encompass the 3V to 5.5V supply voltage range of the original part.
Peripheral Integration: Key peripherals including PWM, WDT, LVD, and POR must be present in the substitute to maintain system functionality.
Compliance Standards: Both parts must maintain ROHS3 compliance and equivalent moisture sensitivity levels to ensure manufacturing and reliability consistency.
The S9S08RNA8W2VLC from NXP USA Inc. meets these substitution criteria through identical package geometry, equivalent FLASH memory capacity, compatible supply voltage range, and presence of required peripheral functions.
Parameter Comparison
| Parameter | DF36902GFHV (Renesas) | S9S08RNA8W2VLC (NXP) |
|---|---|---|
| Core Size | 16-Bit | 8-Bit |
| Speed | 12MHz | 20MHz |
| Program Memory Size | 8KB (8K x 8) | 8KB (8K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 1.5K x 8 | 2K x 8 |
| Voltage Supply (Vcc/Vdd) | 3V ~ 5.5V | 2.7V ~ 5.5V |
| Number of I/O | 18 | 26 |
| Data Converters | A/D 4x10b | A/D 12x12b |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Connectivity | SCI | I2C, LINbus, SPI, UART/USART |
| Operating Temperature | -20°C ~ 75°C (TA) | -40°C ~ 105°C (TA) |
| Package / Case | 32-LQFP (7x7) | 32-LQFP (7x7) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active |
Engineering Selection Recommendations
The S9S08RNA8W2VLC is a viable substitute for the DF36902GFHV based on the following engineering criteria:
Package Compatibility: Both devices utilize the 32-LQFP (7x7) surface mount package, eliminating the need for PCB redesign.
Memory Equivalence: Both parts provide 8KB FLASH program memory, meeting the core storage requirement. The S9S08RNA8W2VLC offers additional RAM (2K x 8 versus 1.5K x 8), which provides enhanced operational flexibility.
Peripheral Functionality: Both devices integrate LVD, POR, PWM, and WDT peripherals, ensuring functional parity for system protection and control requirements.
Compliance Alignment: Both parts maintain ROHS3 compliance and identical moisture sensitivity levels (MSL 3, 168 Hours), ensuring manufacturing process compatibility and long-term reliability.
Supply Voltage: The S9S08RNA8W2VLC operates across a 2.7V to 5.5V range, which encompasses the original part's 3V to 5.5V specification, providing broader voltage flexibility.
Active Product Status: The S9S08RNA8W2VLC maintains active product status with established supply chain availability, addressing the obsolescence of the original DF36902GFHV.
Frequently Asked Questions (FAQ)
Q: Can the S9S08RNA8W2VLC be used as a direct replacement without PCB modifications?
A: Yes. Both devices share the identical 32-LQFP (7x7) package geometry and pin count, enabling direct PCB footprint compatibility. However, firmware adaptation may be required due to architectural differences between the H8/300H and S08 processor cores.
Q: What are the key differences between the DF36902GFHV and S9S08RNA8W2VLC?
A: The primary differences are core architecture (16-bit versus 8-bit), clock speed (12MHz versus 20MHz), connectivity options (SCI versus I2C/LINbus/SPI/UART), and data converter resolution (4x10-bit versus 12x12-bit). Both devices provide equivalent FLASH memory capacity and required peripheral functions.
Q: Is the lower operating temperature range of the DF36902GFHV (-20°C to 75°C) a limiting factor when substituting with the S9S08RNA8W2VLC (-40°C to 105°C)?
A: No. The S9S08RNA8W2VLC's extended temperature range encompasses the original specification, providing equal or superior performance across the original operating envelope.
Q: Does the S9S08RNA8W2VLC provide sufficient I/O for applications designed around the DF36902GFHV's 18 I/O pins?
A: Yes. The S9S08RNA8W2VLC provides 26 I/O pins, exceeding the original part's 18 pins. This additional I/O capacity supports expanded functionality without constraint.
Q: Are there supply voltage considerations when substituting these parts?
A: The S9S08RNA8W2VLC's 2.7V minimum supply voltage is lower than the DF36902GFHV's 3V minimum. Applications operating at 2.7V to 3V will function with the substitute but not the original part. Both devices support the full 5.5V maximum specification.
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