Equivalent & Substitute Parts for DF36902GFHV

Part Overview

The DF36902GFHV is a 16-bit H8/300H Tiny Microcontroller manufactured by Renesas Electronics Corporation, featuring 8KB FLASH memory and a 32-LQFP package. This device is classified as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing design requirements and production continuity. The part operates at 12MHz with a supply voltage range of 3V to 5.5V and includes integrated peripherals such as PWM, WDT, LVD, and POR functionality.

Substiute Parts

DF36902GFHV
Renesas Electronics CorporationIn Stock: 5318DF36902GFHV Datasheet
DF36902GFHV
Current Part
S9S08RNA8W2VLC
NXP USA Inc.In Stock: 811S9S08RNA8W2VLC Datasheet
S9S08RNA8W2VLC
Similar

Key Parameters

Parameter DF36902GFHV
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Speed 12MHz
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
RAM Size 1.5K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 18
Package / Case 32-LQFP (7x7)
Mounting Type Surface Mount
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the DF36902GFHV is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use the 32-LQFP (7x7) surface mount package to ensure PCB footprint compatibility without redesign.

Memory Configuration: The 8KB FLASH program memory is a core functional requirement. The substitute part must provide equivalent or greater FLASH capacity.

Supply Voltage Range: The substitute must operate within or encompass the 3V to 5.5V supply voltage range of the original part.

Peripheral Integration: Key peripherals including PWM, WDT, LVD, and POR must be present in the substitute to maintain system functionality.

Compliance Standards: Both parts must maintain ROHS3 compliance and equivalent moisture sensitivity levels to ensure manufacturing and reliability consistency.

The S9S08RNA8W2VLC from NXP USA Inc. meets these substitution criteria through identical package geometry, equivalent FLASH memory capacity, compatible supply voltage range, and presence of required peripheral functions.

Parameter Comparison

Parameter DF36902GFHV (Renesas) S9S08RNA8W2VLC (NXP)
Core Size 16-Bit 8-Bit
Speed 12MHz 20MHz
Program Memory Size 8KB (8K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
RAM Size 1.5K x 8 2K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 2.7V ~ 5.5V
Number of I/O 18 26
Data Converters A/D 4x10b A/D 12x12b
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Connectivity SCI I2C, LINbus, SPI, UART/USART
Operating Temperature -20°C ~ 75°C (TA) -40°C ~ 105°C (TA)
Package / Case 32-LQFP (7x7) 32-LQFP (7x7)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active

Engineering Selection Recommendations

The S9S08RNA8W2VLC is a viable substitute for the DF36902GFHV based on the following engineering criteria:

Package Compatibility: Both devices utilize the 32-LQFP (7x7) surface mount package, eliminating the need for PCB redesign.

Memory Equivalence: Both parts provide 8KB FLASH program memory, meeting the core storage requirement. The S9S08RNA8W2VLC offers additional RAM (2K x 8 versus 1.5K x 8), which provides enhanced operational flexibility.

Peripheral Functionality: Both devices integrate LVD, POR, PWM, and WDT peripherals, ensuring functional parity for system protection and control requirements.

Compliance Alignment: Both parts maintain ROHS3 compliance and identical moisture sensitivity levels (MSL 3, 168 Hours), ensuring manufacturing process compatibility and long-term reliability.

Supply Voltage: The S9S08RNA8W2VLC operates across a 2.7V to 5.5V range, which encompasses the original part's 3V to 5.5V specification, providing broader voltage flexibility.

Active Product Status: The S9S08RNA8W2VLC maintains active product status with established supply chain availability, addressing the obsolescence of the original DF36902GFHV.

Frequently Asked Questions (FAQ)

Q: Can the S9S08RNA8W2VLC be used as a direct replacement without PCB modifications?

A: Yes. Both devices share the identical 32-LQFP (7x7) package geometry and pin count, enabling direct PCB footprint compatibility. However, firmware adaptation may be required due to architectural differences between the H8/300H and S08 processor cores.

Q: What are the key differences between the DF36902GFHV and S9S08RNA8W2VLC?

A: The primary differences are core architecture (16-bit versus 8-bit), clock speed (12MHz versus 20MHz), connectivity options (SCI versus I2C/LINbus/SPI/UART), and data converter resolution (4x10-bit versus 12x12-bit). Both devices provide equivalent FLASH memory capacity and required peripheral functions.

Q: Is the lower operating temperature range of the DF36902GFHV (-20°C to 75°C) a limiting factor when substituting with the S9S08RNA8W2VLC (-40°C to 105°C)?

A: No. The S9S08RNA8W2VLC's extended temperature range encompasses the original specification, providing equal or superior performance across the original operating envelope.

Q: Does the S9S08RNA8W2VLC provide sufficient I/O for applications designed around the DF36902GFHV's 18 I/O pins?

A: Yes. The S9S08RNA8W2VLC provides 26 I/O pins, exceeding the original part's 18 pins. This additional I/O capacity supports expanded functionality without constraint.

Q: Are there supply voltage considerations when substituting these parts?

A: The S9S08RNA8W2VLC's 2.7V minimum supply voltage is lower than the DF36902GFHV's 3V minimum. Applications operating at 2.7V to 3V will function with the substitute but not the original part. Both devices support the full 5.5V maximum specification.

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