DF36057FPV Equivalent & Substitute Parts

Part Overview

The DF36057FPV is a 16-bit H8/300H Tiny Microcontroller manufactured by Renesas Electronics Corporation, designed for embedded applications requiring CANbus and SCI connectivity. This device features 56KB FLASH program memory, 3KB RAM, and operates at 20MHz with a supply voltage range of 3V to 5.5V. The product is classified as obsolete, making equivalent substitute parts necessary for ongoing system maintenance, redesigns, and production continuity.

Substiute Parts

DF36057FPV
Renesas Electronics CorporationIn Stock: 1192DF36057FPV Datasheet
DF36057FPV
Current Part
MC9S12P64VLH
NXP USA Inc.In Stock: 908MC9S12P64VLH Datasheet
MC9S12P64VLH
Similar

Key Parameters

Parameter DF36057FPV
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Speed 20MHz
Program Memory Size 56KB FLASH
RAM Size 3K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 45
Package 64-LQFP (10x10)
Connectivity CANbus, SCI, SSU
Peripherals PWM, WDT
Data Converters A/D 8x10b
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the DF36057FPV is determined by the following critical parameters:

  • Package Compatibility: Both devices must use 64-LQFP (10x10) surface mount packaging to ensure PCB footprint compatibility
  • Core Architecture: 16-bit processor architecture is required to maintain instruction set compatibility
  • Voltage Supply Range: The substitute must operate within or encompass the 3V to 5.5V supply range
  • Connectivity Interfaces: CANbus and SCI connectivity are essential for system integration
  • Memory Configuration: Program memory must be sufficient for application code; RAM must support runtime requirements
  • Peripheral Set: PWM and WDT functionality must be present for timing and watchdog operations

The MC9S12P64VLH qualifies as a substitute based on these parameters: it maintains the 64-LQFP package, provides 16-bit processing, supports the required voltage range, includes CANbus and SCI connectivity, and incorporates PWM and WDT peripherals.

Parameter Comparison

Parameter DF36057FPV MC9S12P64VLH
Manufacturer Renesas Electronics Corporation NXP USA Inc.
Core Size 16-Bit 16-Bit
Speed 20MHz 32MHz
Program Memory Size 56KB FLASH 64KB FLASH
RAM Size 3K x 8 4K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 1.72V ~ 5.5V
Number of I/O 45 49
Package 64-LQFP (10x10) 64-LQFP (10x10)
Connectivity CANbus, SCI, SSU CANbus, SCI, SPI
Peripherals PWM, WDT LVD, POR, PWM, WDT
Data Converters A/D 8x10b A/D 10x12b
EEPROM Size Not specified 4K x 8
Operating Temperature -20°C ~ 75°C (TA) -40°C ~ 105°C (TA)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

The MC9S12P64VLH is suitable as a substitute for the DF36057FPV based on the following engineering criteria:

Package and Pinout: Both devices use identical 64-LQFP (10x10) surface mount packaging, ensuring direct PCB compatibility without layout modifications.

Compliance and Certifications: Both parts maintain ROHS3 compliance and REACH unaffected status, meeting regulatory requirements for new designs and production continuity.

Product Status Advantage: The MC9S12P64VLH is classified as active, providing long-term availability and supply chain stability compared to the obsolete DF36057FPV.

Enhanced Specifications: The substitute offers improved performance characteristics including higher clock speed (32MHz vs. 20MHz), increased program memory (64KB vs. 56KB), expanded RAM (4K vs. 3K), and extended operating temperature range (-40°C to 105°C vs. -20°C to 75°C).

Functional Compatibility: Both devices provide CANbus and SCI connectivity, PWM and WDT peripherals, and 16-bit processing architecture required for embedded control applications.

Frequently Asked Questions (FAQ)

Q: Can the MC9S12P64VLH directly replace the DF36057FPV without PCB modifications?

A: Yes. Both devices use the 64-LQFP (10x10) package with identical footprints. No PCB layout changes are required for package compatibility.

Q: Are there differences in instruction set architecture between these devices?

A: Yes. The DF36057FPV uses the H8/300H instruction set, while the MC9S12P64VLH uses the HCS12 instruction set. Firmware must be rewritten or ported to the target architecture.

Q: What is the impact of the higher clock speed in the MC9S12P64VLH?

A: The 32MHz speed of the MC9S12P64VLH compared to the 20MHz of the DF36057FPV provides faster instruction execution. Timing-dependent code may require adjustment to maintain equivalent real-time behavior.

Q: Does the MC9S12P64VLH support all connectivity interfaces of the DF36057FPV?

A: The MC9S12P64VLH provides CANbus and SCI connectivity matching the DF36057FPV. The substitute includes SPI instead of SSU; verify SPI compatibility with your application requirements.

Q: Is the extended temperature range of the MC9S12P64VLH beneficial?

A: The MC9S12P64VLH operates from -40°C to 105°C compared to -20°C to 75°C for the DF36057FPV. This extended range provides greater flexibility for industrial and automotive applications.

Q: What are the memory implications of using the MC9S12P64VLH?

A: The MC9S12P64VLH provides 64KB program memory and 4KB RAM compared to 56KB and 3KB respectively in the DF36057FPV. Additionally, the substitute includes 4KB EEPROM. Verify that your application code fits within these memory allocations.

Q: Are both devices RoHS compliant?

A: Yes. Both the DF36057FPV and MC9S12P64VLH are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory standards.

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