Equivalent & Substitute Parts for DF36054GHV

Part Overview

The DF36054GHV is a 16-bit H8/300H Tiny Microcontroller manufactured by Renesas Electronics Corporation, designed for embedded applications requiring 32KB FLASH memory and 20MHz operation. This device is classified as obsolete, making equivalent substitute parts necessary for ongoing system support, redesigns, and production continuity. The part is housed in a 64-QFP package and operates across a 3V to 5.5V supply range with integrated peripherals including CANbus, SCI, SSU connectivity, and features such as PWM, WDT, and LVD.

Substiute Parts

DF36054GHV
Renesas Electronics CorporationIn Stock: 808DF36054GHV Datasheet
DF36054GHV
Current Part
S9S12P32J0MLH
NXP USA Inc.In Stock: 8300S9S12P32J0MLH Datasheet
S9S12P32J0MLH
Similar

Key Parameters

Parameter DF36054GHV
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Speed 20MHz
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 2K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 45
Package Type 64-QFP (14x14)
Mounting Type Surface Mount
Operating Temperature -20°C ~ 75°C
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the DF36054GHV is determined by the following critical parameters:

  • Core Size: 16-Bit architecture requirement
  • Program Memory: 32KB FLASH minimum capacity
  • RAM: 2K x 8 minimum requirement
  • Mounting Type: Surface Mount compatibility
  • Package Compatibility: 64-pin QFP/LQFP footprint variants
  • Voltage Supply Range: Overlap within 3V to 5.5V operating window
  • Connectivity: CANbus and SCI support
  • Compliance: ROHS3 compliance and equivalent regulatory status

The substitute part S9S12P32J0MLH meets these core substitution criteria through equivalent 16-bit architecture, matching 32KB FLASH and 2KB RAM specifications, surface mount configuration, and 64-pin package format. Both parts maintain ROHS3 compliance and support required communication protocols.

Parameter Comparison

Parameter DF36054GHV S9S12P32J0MLH
Manufacturer Renesas Electronics Corporation NXP USA Inc.
Core Size 16-Bit 16-Bit
Speed 20MHz 32MHz
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 2K x 8
EEPROM Size Not specified 4K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 1.72V ~ 5.5V
Number of I/O 45 49
Data Converters A/D 8x10b A/D 10x12b
Connectivity CANbus, SCI, SSU CANbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Package Type 64-QFP (14x14) 64-LQFP (10x10)
Mounting Type Surface Mount Surface Mount
Operating Temperature -20°C ~ 75°C -40°C ~ 125°C
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)

Engineering Selection Recommendations

The S9S12P32J0MLH serves as a functional substitute for the obsolete DF36054GHV based on the following engineering criteria:

Memory Equivalence: Both devices provide 32KB FLASH program memory and 2KB RAM, meeting core memory requirements for applications originally designed around the DF36054GHV.

Architecture Compatibility: The 16-bit core size is maintained across both parts, ensuring instruction set compatibility at the architectural level.

Package Footprint: While the DF36054GHV uses a 64-QFP (14x14) package and the S9S12P32J0MLH uses a 64-LQFP (10x10) package, both are 64-pin surface mount configurations. PCB layout modifications are required to accommodate the different package dimensions.

Regulatory Compliance: Both parts maintain ROHS3 compliance and equivalent MSL ratings, supporting continued use in regulated manufacturing environments.

Active Product Status: The S9S12P32J0MLH is classified as active, ensuring long-term availability and supply chain continuity compared to the obsolete DF36054GHV.

Enhanced Specifications: The substitute part offers higher clock speed (32MHz vs. 20MHz), extended operating temperature range (-40°C to 125°C vs. -20°C to 75°C), additional I/O pins (49 vs. 45), and integrated EEPROM (4K x 8), providing design margin and additional functionality.

Frequently Asked Questions (FAQ)

Q: Can the S9S12P32J0MLH directly replace the DF36054GHV without PCB modifications?

A: No. While both parts are 64-pin surface mount devices, the package types differ: DF36054GHV uses 64-QFP (14x14mm) and S9S12P32J0MLH uses 64-LQFP (10x10mm). PCB footprint redesign is required. Pin-to-pin compatibility must be verified against specific application schematics.

Q: Are the memory specifications identical between these parts?

A: Program memory and RAM are equivalent: both provide 32KB FLASH and 2KB RAM. The S9S12P32J0MLH includes additional 4KB EEPROM not present in the DF36054GHV specification.

Q: What are the connectivity differences?

A: The DF36054GHV supports CANbus, SCI, and SSU. The S9S12P32J0MLH supports CANbus, SCI, and SPI. Applications requiring SSU functionality require alternative solutions.

Q: Is the operating temperature range compatible?

A: The DF36054GHV operates from -20°C to 75°C, while the S9S12P32J0MLH operates from -40°C to 125°C. The substitute part supports the original temperature range and extends capability to lower and higher extremes.

Q: What voltage supply considerations apply?

A: The DF36054GHV requires 3V to 5.5V. The S9S12P32J0MLH operates from 1.72V to 5.5V, providing lower voltage capability. Both overlap within the 3V to 5.5V window, supporting existing power supply designs.

Q: Are there data converter differences?

A: Yes. The DF36054GHV includes 8-channel 10-bit A/D converters. The S9S12P32J0MLH includes 10-channel 12-bit A/D converters, offering higher resolution and additional channels.

Q: What compliance certifications apply to both parts?

A: Both parts are ROHS3 compliant, REACH unaffected, and carry equivalent MSL ratings of 3 (168 hours). Regulatory requirements are maintained across substitution.

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