DF36054GFZV Equivalent & Substitute Parts

Part Overview

The DF36054GFZV is a 16-bit H8/300H Tiny microcontroller manufactured by Renesas Electronics Corporation, featuring 32KB FLASH memory, 2KB RAM, and a 20MHz operating frequency in a 64-LFQFP package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs, production continuity, and system upgrades. The part integrates CANbus, SCI, and SSU connectivity with integrated peripherals including LVD, POR, PWM, and WDT functions, suitable for embedded control applications requiring moderate processing capability and memory capacity.

Substiute Parts

DF36054GFZV
Renesas Electronics CorporationIn Stock: 1150DF36054GFZV Datasheet
DF36054GFZV
Current Part
S9S12P32J0MLH
NXP USA Inc.In Stock: 8300S9S12P32J0MLH Datasheet
S9S12P32J0MLH
Similar

Key Parameters

Parameter DF36054GFZV
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Operating Frequency 20MHz
Program Memory 32KB FLASH (32K x 8)
RAM Size 2K x 8
Supply Voltage 3V ~ 5.5V
I/O Count 45
Package Type 64-LFQFP (10x10)
Operating Temperature -20°C ~ 75°C
Product Status Obsolete
RoHS Compliance ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the DF36054GFZV is determined by the following critical parameters:

Core Compatibility Criteria:

  • 16-bit microcontroller architecture
  • Minimum 32KB FLASH program memory
  • Minimum 2KB RAM capacity
  • 64-pin LQFP package form factor (10x10mm)
  • Surface mount technology

Functional Compatibility Criteria:

  • CANbus communication interface
  • SCI serial communication support
  • PWM and watchdog timer (WDT) peripherals
  • Low voltage detection (LVD) and power-on reset (POR)
  • A/D converter capability

Electrical Compatibility Criteria:

  • Supply voltage range compatibility with 3V ~ 5.5V operation
  • Operating temperature range suitable for industrial or consumer applications

The S9S12P32J0MLH from NXP USA Inc. qualifies as a functional substitute based on matching core memory configuration, package footprint, and peripheral feature set, while offering enhanced specifications in processing speed and temperature range.

Parameter Comparison

Parameter DF36054GFZV (Renesas) S9S12P32J0MLH (NXP)
Core Processor H8/300H HCS12
Core Size 16-Bit 16-Bit
Operating Frequency 20MHz 32MHz
Program Memory 32KB FLASH 32KB FLASH
RAM Size 2K x 8 2K x 8
EEPROM Not specified 4K x 8
I/O Count 45 49
Supply Voltage 3V ~ 5.5V 1.72V ~ 5.5V
Connectivity CANbus, SCI, SSU CANbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
A/D Converter 8x10-bit 10x12-bit
Operating Temperature -20°C ~ 75°C -40°C ~ 125°C
Package Type 64-LFQFP (10x10) 64-LQFP (10x10)
Product Status Obsolete Active
RoHS Compliance ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

Primary Substitute: S9S12P32J0MLH

The S9S12P32J0MLH is the recommended substitute for the DF36054GFZV based on the following engineering factors:

  • Product Status: The S9S12P32J0MLH maintains active production status, ensuring long-term availability and supply chain continuity compared to the obsolete DF36054GFZV.
  • Memory Configuration: Both devices feature identical 32KB FLASH and 2KB RAM capacity, supporting equivalent firmware storage and runtime requirements.
  • Package Compatibility: Both utilize 64-pin LQFP (10x10mm) surface mount packages, enabling direct PCB footprint compatibility without layout modifications.
  • Peripheral Feature Parity: Both microcontrollers integrate CANbus, SCI communication, PWM, WDT, LVD, and POR functions, maintaining functional equivalence for embedded control applications.
  • Compliance Certification: Both parts are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronic component procurement.

Design Considerations:

The S9S12P32J0MLH offers enhanced specifications including 32MHz operating frequency (versus 20MHz), extended operating temperature range (-40°C to 125°C versus -20°C to 75°C), additional I/O pins (49 versus 45), integrated 4KB EEPROM, and improved A/D converter resolution (10x12-bit versus 8x10-bit). These enhancements provide performance headroom and expanded functionality without compromising backward compatibility at the package and core memory level.

Frequently Asked Questions (FAQ)

Q: Can the S9S12P32J0MLH be used as a direct replacement for the DF36054GFZV?

A: Yes, the S9S12P32J0MLH is functionally compatible as a substitute. Both devices share identical 32KB FLASH memory, 2KB RAM, 64-pin LQFP package footprint, and core peripheral features (CANbus, SCI, PWM, WDT, LVD, POR). PCB layout and mechanical mounting require no modification. Firmware compatibility depends on instruction set differences between the H8/300H and HCS12 architectures and must be evaluated during design migration.

Q: What are the key differences between these two microcontrollers?

A: The primary differences are processor architecture (H8/300H versus HCS12), operating frequency (20MHz versus 32MHz), temperature range (-20°C to 75°C versus -40°C to 125°C), I/O pin count (45 versus 49), and A/D converter resolution (8x10-bit versus 10x12-bit). The S9S12P32J0MLH also includes 4KB EEPROM, which the DF36054GFZV does not specify. Both maintain identical program memory and RAM capacity.

Q: Are there any connectivity differences that affect substitution?

A: The DF36054GFZV integrates CANbus, SCI, and SSU interfaces, while the S9S12P32J0MLH provides CANbus, SCI, and SPI interfaces. Applications requiring SSU functionality must evaluate whether SPI can fulfill the communication requirement or if alternative solutions are necessary.

Q: Do both parts meet current compliance standards?

A: Yes, both the DF36054GFZV and S9S12P32J0MLH are ROHS3 compliant and REACH unaffected. Both carry MSL 3 moisture sensitivity rating (168 hours). The S9S12P32J0MLH, being in active production, ensures continued compliance with evolving regulatory requirements.

Q: What is the impact of the higher operating frequency of the S9S12P32J0MLH?

A: The 32MHz frequency of the S9S12P32J0MLH (versus 20MHz for the DF36054GFZV) provides increased processing capability and faster instruction execution. This enhancement allows for more complex control algorithms or reduced power consumption through lower clock scaling. Existing firmware may require timing adjustments for peripheral operations and interrupt handling.

Q: Is the extended temperature range of the S9S12P32J0MLH beneficial for all applications?

A: The S9S12P32J0MLH operating range of -40°C to 125°C extends beyond the DF36054GFZV range of -20°C to 75°C, providing suitability for industrial, automotive, and harsh environment applications. For applications operating within the original -20°C to 75°C range, both devices are equivalent in thermal performance.

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