DF36049GHV Equivalent & Substitute Parts

Part Overview

The DF36049GHV is a 16-bit H8/300H Tiny Microcontroller IC manufactured by Renesas Electronics Corporation, featuring 96KB FLASH memory and operating at 20MHz. This device is actively produced and widely used in embedded applications requiring compact microcontroller solutions with integrated peripherals including I2C, SCI connectivity, PWM, watchdog timer, and analog-to-digital conversion capabilities. Finding equivalent or substitute parts becomes necessary when addressing supply chain constraints, inventory availability, or specific application requirements that may benefit from enhanced feature sets or extended operating parameters.

Substiute Parts

DF36049GHV
Renesas Electronics CorporationIn Stock: 2273DF36049GHV Datasheet
DF36049GHV
Current Part
R5F10WMFAFA#30
Renesas Electronics CorporationIn Stock: 9807R5F10WMFAFA#30 Datasheet
R5F10WMFAFA#30
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Key Parameters

Parameter DF36049GHV
Core Processor H8/300H
Core Size 16-Bit
Speed 20MHz
Program Memory Size 96KB (96K x 8)
Program Memory Type FLASH
RAM Size 4K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 8x10b
Number of I/O 59
Package / Case 80-BQFP (14x14)
Operating Temperature -20°C ~ 75°C (TA)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the DF36049GHV is evaluated based on the following critical parameters that determine functional and mechanical compatibility:

Core Memory Configuration: Both the main part and substitute must maintain 96KB FLASH program memory and compatible RAM architecture to ensure firmware compatibility and application functionality.

Core Architecture & Processing Capability: The 16-bit core size and processing speed establish the computational baseline. Substitute parts may operate at equal or higher clock speeds without compromising backward compatibility.

Voltage Supply Range: The operating voltage window (3V ~ 5.5V for the main part) defines power supply compatibility. Substitute parts with extended or overlapping voltage ranges remain compatible with existing power delivery systems.

Package & Pin Configuration: The 80-pin QFP package format (14x14mm) is a mechanical constraint. Substitute parts must use equivalent or compatible package types to ensure PCB layout and assembly compatibility.

Peripheral Integration & I/O Count: The number of I/O pins (59) and integrated peripherals (I2C, SCI, PWM, WDT, LVD, POR) define the functional interface. Substitute parts with equal or enhanced peripheral sets and compatible I/O counts maintain system integration.

Environmental & Compliance Ratings: RoHS3 compliance and MSL rating (3) ensure regulatory and manufacturing process compatibility. Substitute parts must meet or exceed these standards.

The R5F10WMFAFA#30 qualifies as a substitute based on matching core memory (96KB FLASH), maintaining 16-bit architecture, providing enhanced processing speed (24MHz), supporting extended voltage range (1.6V ~ 5.5V), using compatible 80-pin package format (80-LQFP 14x14mm), offering enhanced peripheral integration, and maintaining equivalent compliance certifications.

Parameter Comparison

Parameter DF36049GHV R5F10WMFAFA#30
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Core Size 16-Bit 16-Bit
Speed 20MHz 24MHz
Program Memory Size 96KB (96K x 8) 96KB (96K x 8)
Program Memory Type FLASH FLASH
RAM Size 4K x 8 6K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 1.6V ~ 5.5V
Data Converters A/D 8x10b A/D 12x10b
Number of I/O 59 58
Package / Case 80-BQFP (14x14) 80-LQFP (14x14)
Operating Temperature -20°C ~ 75°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Active Active

Engineering Selection Recommendations

DF36049GHV Selection: Retain this part number when the H8/300H architecture is specifically required by application firmware, when the operating temperature range of -20°C to 75°C matches environmental constraints, or when existing designs are optimized for this processor family and migration costs outweigh supply benefits.

R5F10WMFAFA#30 Selection: This substitute part is suitable when supply availability of the DF36049GHV is constrained. The R5F10WMFAFA#30 offers enhanced processing capability (24MHz versus 20MHz), extended low-voltage operation (1.6V minimum versus 3V), increased RAM capacity (6K x 8 versus 4K x 8), and superior analog conversion resolution (12-bit versus 8-bit A/D). The extended operating temperature range (-40°C to 85°C) provides broader environmental coverage. Both parts maintain ROHS3 compliance and equivalent MSL ratings, ensuring regulatory and manufacturing compatibility. The RL78/L13 architecture and enhanced peripheral set (DMA, LCD support, LINbus, UART/USART) provide functional advantages in applications requiring expanded connectivity or data processing capabilities.

Package Consideration: Both parts use 80-pin QFP packages with identical 14x14mm footprints, enabling direct PCB layout compatibility. The BQFP and LQFP package variants are mechanically interchangeable for surface mount assembly.

Frequently Asked Questions (FAQ)

Q: Can the R5F10WMFAFA#30 directly replace the DF36049GHV in existing designs?

A: Direct replacement is mechanically feasible due to identical 80-pin QFP package footprints (14x14mm). However, firmware compatibility depends on application code architecture. The DF36049GHV uses the H8/300H processor family, while the R5F10WMFAFA#30 uses the RL78 architecture. Applications written in portable C code with minimal processor-specific assembly may transition between architectures. Applications with extensive H8/300H-specific code require porting effort.

Q: What are the key electrical differences between these parts?

A: The R5F10WMFAFA#30 provides extended voltage operation (1.6V minimum versus 3V minimum), higher processing speed (24MHz versus 20MHz), increased RAM (6K x 8 versus 4K x 8), and enhanced analog conversion (12-bit versus 8-bit A/D). The DF36049GHV operates within a narrower voltage window (3V ~ 5.5V) and lower clock speed. Both maintain identical 96KB FLASH memory capacity.

Q: Are there I/O pin count differences?

A: The DF36049GHV provides 59 I/O pins, while the R5F10WMFAFA#30 provides 58 I/O pins. This single-pin difference may require PCB layout verification to confirm all required signals can be routed on the substitute part.

Q: Do both parts meet the same compliance standards?

A: Both parts are ROHS3 compliant and carry MSL rating 3 (168 Hours), ensuring equivalent regulatory and manufacturing process compatibility. Both are actively produced by Renesas Electronics Corporation.

Q: What is the operating temperature range difference?

A: The DF36049GHV operates from -20°C to 75°C, while the R5F10WMFAFA#30 operates from -40°C to 85°C. The substitute part provides extended low-temperature and high-temperature operation, suitable for broader environmental applications.

Q: Are the peripheral sets compatible?

A: The DF36049GHV includes I2C, SCI, PWM, WDT, LVD, and POR. The R5F10WMFAFA#30 includes CSI, I2C, LINbus, UART/USART, DMA, LCD, LVD, POR, PWM, and WDT. The substitute part offers enhanced connectivity options (LINbus, UART/USART, DMA, LCD) while maintaining core peripherals (I2C, PWM, WDT, LVD, POR) present in the original part.

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