DF36034FZV Equivalent & Substitute Parts

Part Overview

The DF36034FZV is a 16-bit H8/300H Tiny microcontroller manufactured by Renesas Electronics Corporation, featuring 32KB FLASH memory, 2KB RAM, and a 20MHz clock speed in a 64-LFQFP package. This device is classified as obsolete, making equivalent substitute parts necessary for new designs and production continuity. The H8/300H architecture provides embedded control capabilities with integrated CANbus, SCI, and SSU connectivity, along with PWM and watchdog timer peripherals suitable for industrial and automotive applications.

Substiute Parts

DF36034FZV
Renesas Electronics CorporationIn Stock: 1102DF36034FZV Datasheet
DF36034FZV
Current Part
S9S12P32J0MLH
NXP USA Inc.In Stock: 8300S9S12P32J0MLH Datasheet
S9S12P32J0MLH
Similar

Key Parameters

Parameter DF36034FZV
Manufacturer Renesas Electronics Corporation
Core Processor H8/300H
Core Size 16-Bit
Speed 20MHz
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
RAM Size 2K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V
Number of I/O 45
Package / Case 64-LQFP (10x10)
Mounting Type Surface Mount
Operating Temperature -20°C ~ 75°C
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the DF36034FZV is determined by the following critical parameters:

  • Package Compatibility: 64-LQFP (10x10) surface mount package ensures mechanical and electrical pin compatibility
  • Memory Configuration: 32KB FLASH program memory and 2KB RAM minimum requirements
  • Core Architecture: 16-bit processor capability for instruction set compatibility
  • Voltage Supply Range: Operating voltage window of 3V to 5.5V for power supply compatibility
  • I/O Count: Minimum 45 I/O pins to support existing circuit designs
  • Connectivity Interfaces: CANbus and SCI support for communication protocol requirements
  • Compliance Standards: ROHS3 compliance and equivalent regulatory certifications

The S9S12P32J0MLH qualifies as a substitute based on matching or exceeding these parameters while maintaining the same physical package footprint and electrical interface requirements.

Parameter Comparison

Parameter DF36034FZV (Main) S9S12P32J0MLH (Substitute)
Manufacturer Renesas Electronics Corporation NXP USA Inc.
Core Size 16-Bit 16-Bit
Program Memory Size 32KB (32K x 8) 32KB (32K x 8)
Program Memory Type FLASH FLASH
RAM Size 2K x 8 2K x 8
Voltage Supply (Vcc/Vdd) 3V ~ 5.5V 1.72V ~ 5.5V
Number of I/O 45 49
Package / Case 64-LQFP (10x10) 64-LQFP (10x10)
Mounting Type Surface Mount Surface Mount
Operating Temperature -20°C ~ 75°C -40°C ~ 125°C
RoHS Status ROHS3 Compliant ROHS3 Compliant
Connectivity CANbus, SCI, SSU CANbus, SCI, SPI

Engineering Selection Recommendations

The S9S12P32J0MLH serves as a direct substitute for the obsolete DF36034FZV based on the following engineering criteria:

Package and Pinout Compatibility: Both devices utilize the 64-LQFP (10x10) surface mount package, ensuring mechanical compatibility with existing PCB layouts and socket designs.

Memory Equivalence: Identical 32KB FLASH and 2KB RAM configurations maintain software compatibility and memory map alignment for existing firmware implementations.

Electrical Compatibility: The S9S12P32J0MLH voltage supply range (1.72V ~ 5.5V) encompasses the DF36034FZV requirement (3V ~ 5.5V), providing broader operational flexibility while maintaining compatibility with existing power supply designs.

I/O Capability: The substitute provides 49 I/O pins compared to 45 on the main part, offering additional interface capacity without reducing available functionality.

Regulatory Compliance: Both devices maintain ROHS3 compliance and equivalent regulatory certifications, ensuring consistency with environmental and safety standards.

Product Availability: The S9S12P32J0MLH maintains active product status with substantial inventory availability, addressing the obsolescence of the DF36034FZV.

Frequently Asked Questions (FAQ)

Q: Can the S9S12P32J0MLH directly replace the DF36034FZV in existing designs?

A: The S9S12P32J0MLH is mechanically and electrically compatible with the DF36034FZV due to identical package geometry (64-LQFP 10x10), matching memory configuration (32KB FLASH, 2KB RAM), and compatible voltage supply ranges. However, firmware compatibility depends on instruction set differences between the H8/300H and HCS12 architectures and must be evaluated for specific applications.

Q: What are the key differences between these microcontrollers?

A: The primary differences are processor architecture (H8/300H versus HCS12), clock speed (20MHz versus 32MHz), I/O count (45 versus 49 pins), operating temperature range (-20°C to 75°C versus -40°C to 125°C), and connectivity options (SSU versus SPI). Memory configuration and package remain identical.

Q: Is the substitute part suitable for high-temperature applications?

A: The S9S12P32J0MLH supports an extended operating temperature range of -40°C to 125°C, compared to the DF36034FZV range of -20°C to 75°C. This makes the substitute suitable for applications requiring higher temperature operation.

Q: Are both parts RoHS compliant?

A: Both the DF36034FZV and S9S12P32J0MLH are ROHS3 compliant, meeting environmental and hazardous substance restrictions for electronic components.

Q: What packaging options are available for the substitute?

A: The S9S12P32J0MLH is supplied in Tray packaging, while the DF36034FZV packaging specification was not provided. Both devices use the 64-LQFP (10x10) case format for surface mount assembly.

Request Quote (Ships tomorrow)