Equivalent & Substitute Parts for DF3064BFBL25V

Part Overview

The DF3064BFBL25V is a 16-bit H8/300H microcontroller manufactured by Renesas Electronics Corporation, featuring 256KB FLASH program memory, 8KB RAM, and 70 I/O pins in a 100-QFP surface mount package. This device operates at 25MHz with a supply voltage range of 4.5V to 5.5V and includes integrated analog/digital converters, PWM, and watchdog timer peripherals. The part maintains Active product status and is ROHS3 compliant.

Finding equivalent or substitute parts becomes necessary when the primary device is unavailable, when design requirements shift toward different voltage specifications, or when alternative packaging formats better suit manufacturing processes. The DF2318VTE25V represents a functionally similar alternative from the same manufacturer, though with distinct architectural and electrical characteristics that require careful evaluation before substitution.

Substiute Parts

DF3064BFBL25V

Renesas Electronics CorporationIn Stock: 771DF3064BFBL25V Datasheet

Current PartRFQ

DF2318VTE25V

Renesas Electronics CorporationIn Stock: 1306DF2318VTE25V Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The DF2318VTE25V qualifies as a substitute based on the following shared electrical and mechanical parameters:

• Core Size: Both devices are 16-bit microcontrollers
• Speed: Both operate at 25MHz
• Program Memory: Both feature 256KB FLASH memory (256K x 8)
• RAM: Both include 8K x 8 RAM
• Data Converters: Both integrate A/D 8x10b and D/A 2x8b converters
• Connectivity: Both support SCI and SmartCard interfaces
• Operating Temperature: Both rated for -20°C ~ 75°C (TA)
• Mounting Type: Both are surface mount devices
• Package Footprint: Both use 100-pin QFP packages (14x14mm)
• Compliance: Both are ROHS3 compliant with MSL 3 rating

Critical differences that affect substitution decisions include processor architecture (H8/300H versus H8S/2000), supply voltage range (4.5V–5.5V versus 2.7V–3.6V), and product lifecycle status.

Parameter Comparison

Engineering Selection Recommendations

DF3064BFBL25V is the primary selection for new designs. This device maintains Active product status, ensuring long-term availability and manufacturer support. It operates within the 4.5V–5.5V supply range, making it suitable for standard 5V logic environments.

DF2318VTE25V substitution is limited to legacy system maintenance or specific low-voltage applications requiring 2.7V–3.6V operation. This device carries "Not For New Designs" status, indicating Renesas has transitioned away from this product line. Substitution requires:

• Verification of power supply compatibility (voltage range difference is critical)
• Firmware recompilation for H8S/2000 processor architecture
• PCB footprint validation between 100-BFQFP and 100-TQFP packages
• Confirmation that the additional POR peripheral in DF2318VTE25V does not conflict with existing circuit design

Both devices maintain ROHS3 compliance and identical MSL ratings, supporting equivalent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can DF2318VTE25V directly replace DF3064BFBL25V on the same PCB?

A: Direct replacement is not recommended without design review. While both devices use 100-pin QFP packages with identical 14x14mm footprints, the package designations differ (BFQFP versus TQFP). Verify that your PCB footprint accommodates both package variants. Additionally, the supply voltage ranges are incompatible (4.5V–5.5V versus 2.7V–3.6V), requiring separate power supply circuits.

Q: What firmware changes are required when switching from DF3064BFBL25V to DF2318VTE25V?

A: The processor architectures differ (H8/300H versus H8S/2000). Firmware must be recompiled for the H8S/2000 instruction set. Peripheral register layouts and interrupt handling may differ between processor families, requiring code validation and testing.

Q: Are the I/O pin configurations identical between these devices?

A: Both devices provide 70 I/O pins with identical connectivity (SCI, SmartCard) and equivalent peripheral support (PWM, WDT). However, individual pin assignments and multiplexing options may differ. Consult the detailed datasheets for each device to confirm pin-level compatibility with your application.

Q: Why is DF2318VTE25V marked "Not For New Designs"?

A: This designation indicates that Renesas has discontinued active development and long-term support for this product line. DF3064BFBL25V represents the current-generation equivalent with Active status, ensuring availability and manufacturer support throughout the product lifecycle.

Q: What is the significance of the different package codes (BFQFP versus TQFP)?

A: BFQFP (Bumpered Fine-pitch QFP) and TQFP (Thin Quad Flat Package) are distinct package variants with different lead frame designs and thermal characteristics. While both are 100-pin QFP packages with 14x14mm footprints, the internal construction differs. Verify your PCB design accommodates the specific package variant before substitution.

Q: Are the memory specifications truly identical?

A: Yes. Both devices feature 256KB FLASH program memory (256K x 8), 8KB RAM (8K x 8), and identical data converter specifications (A/D 8x10b; D/A 2x8b). Memory capacity and organization are fully compatible.

Q: What additional peripheral does DF2318VTE25V include?

A: DF2318VTE25V includes a Power-On Reset (POR) peripheral in addition to PWM and WDT. If your circuit design does not account for this additional function, verify that its presence does not create conflicts with existing reset circuitry.